JPH0467400U

JPH0467400U -

Info

Publication number: JPH0467400U
Application number: JP11055490U
Authority: JP
Priority date: 1990-10-24
Filing date: 1990-10-24
Publication date: 1992-06-15

Description

[Brief explanation of the drawing]

図−１は本考案に係る電子機器の一実施例を示
す断面図、図−２はそれに使用したゴム部品の斜
視図、図−３は本考案の他の実施例を示す断面図
、図−４はそれに使用したゴム部品の斜視図、図
−５は従来の電子機器を示す断面図である。１１……樹脂成形体、１２……シールド層、１
３……突起、１４……シールド層付き樹脂成形体
、１５……ゴム部品、１６……電子部品、２３…
…金属箔、２６……プリント回路基板、２７……
アース回路導体。 Figure 1 is a sectional view showing one embodiment of an electronic device according to the present invention, Figure 2 is a perspective view of rubber parts used therein, and Figure 3 is a sectional view showing another embodiment of the invention. 4 is a perspective view of the rubber parts used therein, and FIG. 5 is a sectional view showing a conventional electronic device. 11... Resin molded body, 12... Shield layer, 1
3...Protrusion, 14...Resin molded body with shield layer, 15...Rubber component, 16...Electronic component, 23...
...Metal foil, 26...Printed circuit board, 27...
Earth circuit conductor.

Claims

[Scope of utility model registration request]

In an electronic device in which a circuit member such as a printed circuit board or an electronic component is attached via a rubber component to the shield layer side of a resin molded body with a shield layer to which a shield material made of metal foil is pasted, the rubber component is A feature is that the shield layer of the resin molded body and the earth circuit conductor of the circuit member are electrically connected via the metal foil of the rubber part by using a metal foil pasted on the surface so as to be continuous from the top to the bottom surface. and electronic equipment.