JPH0468345B2 - - Google Patents

Info

Publication number
JPH0468345B2
JPH0468345B2 JP60006692A JP669285A JPH0468345B2 JP H0468345 B2 JPH0468345 B2 JP H0468345B2 JP 60006692 A JP60006692 A JP 60006692A JP 669285 A JP669285 A JP 669285A JP H0468345 B2 JPH0468345 B2 JP H0468345B2
Authority
JP
Japan
Prior art keywords
resin composition
resin
epoxy
resins
silica powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60006692A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61166822A (ja
Inventor
Tsutomu Nagata
Tatsuo Sato
Hiroyuki Hosokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Original Assignee
Toshiba Chemical Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd filed Critical Toshiba Chemical Products Co Ltd
Priority to JP60006692A priority Critical patent/JPS61166822A/ja
Publication of JPS61166822A publication Critical patent/JPS61166822A/ja
Publication of JPH0468345B2 publication Critical patent/JPH0468345B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP60006692A 1985-01-19 1985-01-19 封止用樹脂組成物 Granted JPS61166822A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60006692A JPS61166822A (ja) 1985-01-19 1985-01-19 封止用樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60006692A JPS61166822A (ja) 1985-01-19 1985-01-19 封止用樹脂組成物

Publications (2)

Publication Number Publication Date
JPS61166822A JPS61166822A (ja) 1986-07-28
JPH0468345B2 true JPH0468345B2 (fr) 1992-11-02

Family

ID=11645397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60006692A Granted JPS61166822A (ja) 1985-01-19 1985-01-19 封止用樹脂組成物

Country Status (1)

Country Link
JP (1) JPS61166822A (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10330596A (ja) * 1997-05-30 1998-12-15 Sumitomo Bakelite Co Ltd 難燃性樹脂組成物およびこれを用いた半導体封止材料
JP3611435B2 (ja) * 1997-10-22 2005-01-19 住友ベークライト株式会社 難燃性樹脂組成物、これを用いたプリプレグ及び積層板
US6486242B1 (en) * 1999-04-20 2002-11-26 Sumitomo Bakelite Company Limited Flame-retardant resin composition and prepreg and laminate using the same
KR100721697B1 (ko) * 1999-12-13 2007-05-28 다우 글로벌 테크놀로지스 인크. 난연성 인 원소 함유 에폭시 수지 조성물
JP4972247B2 (ja) * 1999-12-28 2012-07-11 日立化成工業株式会社 難燃性熱硬化樹脂組成物、それを用いたプリプレグ及び電気配線板用積層板
JP4714970B2 (ja) * 2000-08-03 2011-07-06 住友ベークライト株式会社 エポキシ樹脂組成物、プリプレグ及びそれを用いた銅張積層板
JP4639439B2 (ja) * 2000-08-04 2011-02-23 住友ベークライト株式会社 エポキシ樹脂組成物、プリプレグ及びそれを用いた銅張積層板
JP2002060468A (ja) * 2000-08-16 2002-02-26 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物、プリプレグ及びそれを用いた銅張積層板
JP4729777B2 (ja) * 2000-09-13 2011-07-20 住友ベークライト株式会社 エポキシ樹脂組成物、プリプレグ及びそれを用いた銅張積層板
JP4729778B2 (ja) * 2000-09-13 2011-07-20 住友ベークライト株式会社 エポキシ樹脂組成物、プリプレグ及びそれを用いた銅張積層板
KR101141305B1 (ko) * 2009-03-31 2012-05-04 코오롱인더스트리 주식회사 인-변성 페놀 노볼락 수지, 이를 포함하는 경화제 및 에폭시 수지 조성물
JP2024081461A (ja) * 2022-12-06 2024-06-18 株式会社レゾナック 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法

Also Published As

Publication number Publication date
JPS61166822A (ja) 1986-07-28

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Legal Events

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