JPH0468544U - - Google Patents
Info
- Publication number
- JPH0468544U JPH0468544U JP1990112446U JP11244690U JPH0468544U JP H0468544 U JPH0468544 U JP H0468544U JP 1990112446 U JP1990112446 U JP 1990112446U JP 11244690 U JP11244690 U JP 11244690U JP H0468544 U JPH0468544 U JP H0468544U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal cap
- semiconductor device
- stem
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Casings For Electric Apparatus (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図は、本考案の第１の実施例の断面図、第
２図は本考案の第２の実施例の断面図、第３図は
従来の半導体装置の断面図である。
１……金属キヤツプ、２……半導体チツプ、３
……配線、４……端子、５……溶接部、６……金
属ステム、７……独立した空間、８……溶接屑、
９……間隙、１０……凹部、１１……テーパ部。
FIG. 1 is a sectional view of a first embodiment of the present invention, FIG. 2 is a sectional view of a second embodiment of the present invention, and FIG. 3 is a sectional view of a conventional semiconductor device. 1...Metal cap, 2...Semiconductor chip, 3
... Wiring, 4 ... Terminal, 5 ... Welding part, 6 ... Metal stem, 7 ... Independent space, 8 ... Welding waste,
9...Gap, 10...Concave portion, 11...Tapered portion.
Claims (1)
ヤツプをかぶせて溶接し気密封止するキヤンケー
ス半導体装置において、金属キヤツプと金属ステ
ムの溶接部と半導体チツプの搭載部の間に独立し
た空間を設けたことを特徴とするキヤンケース半
導体装置。 In a case semiconductor device in which a semiconductor chip is mounted on a metal stem, a metal cap is placed over the metal stem, and the metal cap is welded and hermetically sealed, an independent space is provided between the welded part of the metal cap and metal stem and the mounting part of the semiconductor chip A can case semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990112446U JPH0468544U (en) | 1990-10-25 | 1990-10-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990112446U JPH0468544U (en) | 1990-10-25 | 1990-10-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0468544U true JPH0468544U (en) | 1992-06-17 |
Family
ID=31859946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990112446U Pending JPH0468544U (en) | 1990-10-25 | 1990-10-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0468544U (en) |
-
1990
- 1990-10-25 JP JP1990112446U patent/JPH0468544U/ja active Pending