JPH047165Y2 - - Google Patents
Info
- Publication number
- JPH047165Y2 JPH047165Y2 JP8594987U JP8594987U JPH047165Y2 JP H047165 Y2 JPH047165 Y2 JP H047165Y2 JP 8594987 U JP8594987 U JP 8594987U JP 8594987 U JP8594987 U JP 8594987U JP H047165 Y2 JPH047165 Y2 JP H047165Y2
- Authority
- JP
- Japan
- Prior art keywords
- intermediate layer
- film
- metal
- base material
- metal base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 49
- 239000000919 ceramic Substances 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 238000005260 corrosion Methods 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims 2
- 239000002356 single layer Substances 0.000 claims 1
- 230000007797 corrosion Effects 0.000 description 9
- 238000007747 plating Methods 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910018104 Ni-P Inorganic materials 0.000 description 2
- 229910018536 Ni—P Inorganic materials 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- 229910017770 Cu—Ag Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 229910004353 Ti-Cu Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 102200082816 rs34868397 Human genes 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Ceramic Products (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、例えば耐摩耗送風機等の構成部材と
して使用される金属−セラミツク積層接合体の改
良に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an improvement of a metal-ceramic laminate assembly used as a component of, for example, a wear-resistant blower.
耐摩耗送風機の羽根板等は、圧送される粉体と
の接触により急速に摩耗が進む。その金属部材の
表面に窒化けい素（Si3N4）、アルミナ（Ａ2
O3）等のセラミツクタイルを貼付けて粉体との
直接接触を遮断することは、摩耗を防止し耐久性
を改善するための極めて効果的な方法である。
The blades of wear-resistant blowers rapidly wear out due to contact with the powder being pumped. Silicon nitride (Si 3 N 4 ), alumina (A 2
Placing ceramic tiles such as O 3 ) to block direct contact with powder is an extremely effective method to prevent wear and improve durability.
この場合、金属部材とその表面に貼付けられる
セラミツクタイルとは熱膨張係数に大きな差があ
るので、両部材の間に、熱応力を緩和するための
中間層材として、銀や銅などの延性金属、または
両部材の中間の熱膨張係数を有するインバー合金
やコバール合金等の所謂低熱膨張性金属が介装さ
れる。第３図は、その積層接合体の断面構造を示
す。１０は金属基材、２０は中間層材、３０はセ
ラミツクタイルである。中間層材２０は、金属基
材１０とセラミツクタイル３０との間における熱
応力の吸収・緩和効果の確保、および材料節減の
ために、セラミツクタイル３０より小さい平面形
状を有する薄板状材であり、またその平面形状は
セラミツクタイル３０の積層状態を安定化させる
ために、セラミツクタイル３０と略相似形であ
る。該中間層材２０は、セラミツクタイル３０の
配列パターンに略一致する配列パターンを以て金
属基材面上に分散配設され、各中間層材２０の上
にセラミツクタイル３０が隣り合うセラミツクタ
イル３０との間に隙間が生じないように積層配設
されている。また、セラミツクタイル３０の片側
面（中間層材２０に当接する面）には中間層２０
との接合のためのメタライズ処理が施される。こ
のように積層された金属基材１０と中間層材２０
とセラミツクタイル３０との互いの重ね合せ面Ｓ
１，Ｓ２は、予めその重ね合せ面間に付与された
ロウ材により、または重ね合せ面間の拡散接合等
により、接合一体化される。 In this case, since there is a large difference in thermal expansion coefficient between the metal member and the ceramic tile attached to its surface, a ductile metal such as silver or copper is used as an intermediate layer between the two members to alleviate thermal stress. Alternatively, a so-called low thermal expansion metal such as an Invar alloy or a Kovar alloy having a thermal expansion coefficient between those of the two members is interposed. FIG. 3 shows the cross-sectional structure of the laminated assembly. 10 is a metal base material, 20 is an intermediate layer material, and 30 is a ceramic tile. The intermediate layer material 20 is a thin plate-like material having a smaller planar shape than the ceramic tile 30 in order to ensure the effect of absorbing and relaxing thermal stress between the metal base material 10 and the ceramic tile 30 and to save material. Further, its planar shape is approximately similar to the ceramic tile 30 in order to stabilize the stacked state of the ceramic tile 30. The intermediate layer materials 20 are distributed on the metal base material surface with an arrangement pattern that substantially matches the arrangement pattern of the ceramic tiles 30, and the ceramic tiles 30 are placed on each intermediate layer material 20 in such a way that the ceramic tiles 30 adjacent to each other are arranged in a distributed manner. They are stacked so that there are no gaps between them. Further, an intermediate layer 20 is provided on one side of the ceramic tile 30 (the surface that comes into contact with the intermediate layer material 20).
Metallization processing is performed for bonding with. The metal base material 10 and the intermediate layer material 20 laminated in this way
Mutual overlapping surface S of and ceramic tile 30
1 and S2 are joined together by a brazing material applied in advance between the overlapping surfaces, or by diffusion bonding between the overlapping surfaces.
上記のように異種材料同士が接合された積層接
合体は、その接合面における互いの部材のイオン
化傾向が異なり、または相互拡散やロウ材との反
応により生成したイオン化傾向の異なる化合物が
接合界面に存在しているため、接合面Ｓ１，Ｓ２
の外周縁部ａ１，ａ２に水分が付着すると、局部
電池が形成され、その部分に腐食が生じる。かか
る腐食は、部材同士の接合関係を損い、接合体構
造物の損壊の原因となる。
In a laminated assembly in which dissimilar materials are joined as described above, the ionization tendency of each member differs at the bonding surface, or compounds with different ionization tendency generated due to mutual diffusion or reaction with the brazing material may occur at the bonding interface. Since there are bonding surfaces S1 and S2
When moisture adheres to the outer peripheral edges a1 and a2, a local battery is formed and corrosion occurs in that part. Such corrosion impairs the bonding relationship between members and causes damage to the joined structure.
本考案は上記問題点を解決することを目的とし
ている。 The present invention aims to solve the above problems.
本考案は、上記のように金属基材と、その表面
に分散配設された中間層材と、該中間層材の上
に、略隙間がないように配設されたセラミツクタ
イルとを、互いの重ね合せ面を接合面として接合
してなる積層接合体において、各部材同士の接合
面の外周縁部（以下、「接合部」）を防食膜で皮膜
したことを特徴としている。
As described above, the present invention connects the metal base material, the intermediate layer material distributed on the surface thereof, and the ceramic tiles arranged on the intermediate layer material with almost no gaps between them. A laminated assembly formed by joining the overlapping surfaces of the members as the joining surfaces is characterized in that the outer peripheral edge of the joining surfaces of each member (hereinafter referred to as the "joint section") is coated with an anticorrosive film.
第１図は本考案の積層接合体の断面を示してい
る。図中、４０は防食膜であり、第３図における
部材と同一の部材は同じ符号を付している。この
図では、防食膜を、局部電池形成を阻止するに必
要な最小限の部分に限定して、すなわち中間層材
２０と金属基材１０との接合部ａ１および中間層
材２０とセラミツクタイル３０との接合部、ａ２
のみに選択的に設けた例を示しているが、防食膜
形成処理操作の都合上、第２図のように、中間層
材２０の側面、およびその側面と側面との間の空
間Ｖに面する金属基材１０の内側面とセラミツク
タイル３０の内側面の各面に亘つて防食膜を形成
する場合もあり、またそれ以外の部分（セラミツ
クタイルや金属基材の外側面）にも防食膜を付着
させてさしつかえないことは言うまでもない。 FIG. 1 shows a cross section of the laminated assembly of the present invention. In the figure, 40 is an anti-corrosion film, and the same members as those in FIG. 3 are given the same reference numerals. In this figure, the anticorrosion film is limited to the minimum portion necessary to prevent local battery formation, that is, the joint area a1 between the intermediate layer material 20 and the metal base material 10, and the area between the intermediate layer material 20 and the ceramic tile 30. Junction with a2
Although an example is shown in which the anticorrosion film is selectively provided only on the side surface of the intermediate layer material 20 and the space V between the side surface and the side surface, as shown in FIG. In some cases, an anticorrosion film is formed on the inner surface of the metal base material 10 and the inner surface of the ceramic tile 30, and the anticorrosion film is also formed on other parts (the outer surface of the ceramic tile and metal base material). It goes without saying that there is no problem with attaching.
本考案の積層接合体における前記防食膜は、例
えばめつき膜、または樹脂膜等である。めつき膜
は、例えば無電解めつき法により、また樹脂膜
は、浸漬法、スプレー、刷子塗り等により形成さ
れる。防食膜の材質は、積層接合体の用途・使用
環境等に応じて選ばれるが、めつき膜の例とし
て、無電解めつきによるNi−Ｐ合金膜、樹脂膜
の例として、エポキシ樹脂膜等の塗膜が挙げられ
る。 The anticorrosion film in the laminated assembly of the present invention is, for example, a plating film, a resin film, or the like. The plated film is formed, for example, by electroless plating, and the resin film is formed by dipping, spraying, brushing, or the like. The material for the anti-corrosion film is selected depending on the application and usage environment of the laminated assembly. Examples of plated films include Ni-P alloy films formed by electroless plating, and examples of resin films include epoxy resin films, etc. For example, the coating film of
めつき膜を防食膜とする本考案の積層接合体の
製造工程の例を挙げれば、まず金属基材１０に中
間層材２０を所定の配設パターンを以て配設し、
その上面にセラミツクタイル３０を重ね合せたう
え、ロウ付け、拡散接合、その他の接合法によ
り、それらの重ね合せ面を接合し、しかるのち、
その接合体をめつき浴中に浸漬することにより防
食膜４０としてめつき膜を形成し、ついでめつき
液の洗浄除去・乾燥の後処理を経て目的とする積
層接合体を得る。また、めつき液に代え、有機溶
剤に樹脂を溶解した溶液を防食処理液とし、これ
に積層接合体を浸漬することにより、防食膜４０
が樹脂塗膜である積層接合体が得られる。 To give an example of the manufacturing process of the laminated assembly of the present invention using a plating film as an anticorrosion film, first, the intermediate layer material 20 is arranged on the metal base material 10 in a predetermined arrangement pattern,
Ceramic tiles 30 are superimposed on the top surface, and the superimposed surfaces are joined by brazing, diffusion bonding, or other bonding methods, and then,
A plating film is formed as the anti-corrosion film 40 by immersing the joined body in a plating bath, and then the desired laminated joined body is obtained through washing and removal of the plating solution and post-drying treatment. In addition, instead of the plating solution, a solution prepared by dissolving a resin in an organic solvent is used as an anticorrosive treatment solution, and by immersing the laminated assembly in this solution, the anticorrosive film 40
A laminated assembly is obtained in which the resin coating film is formed.
かくして得られる積層接合体は、各部材の接合
部が耐食性を有するめつき膜、または樹脂膜等で
被覆され、水分の付着が遮断されるので、それら
の部材間にイオン化傾向の差があつても、局部電
池の形成と、それによる腐食を生じることがな
い。 In the thus obtained laminated assembly, the joined parts of each member are covered with a corrosion-resistant plating film or resin film, etc., and moisture adhesion is blocked, so there is a difference in ionization tendency between the members. Also, the formation of local batteries and the resulting corrosion will not occur.
（） 金属基材：炭素鋼板（S45C）
（） 中間層材：銅板（板厚：0.5mm）、直径
1.0cmの円に肉接する正六角形状板。
() Metal base material: Carbon steel plate (S45C) () Intermediate layer material: Copper plate (thickness: 0.5mm), diameter
A regular hexagonal plate that touches a 1.0cm circle.
（） セラミツクタイル：窒化けい素系セラミ
ツク焼結品（板厚３mm）。直径1.2cmの円に肉接
する正六角形状板。片側面はメタライズ処理済
（タイル面にTi−Cu合金粉末を塗布し、水素雰
囲気中、1200℃で焼付け）。() Ceramic tile: Sintered silicon nitride ceramic (plate thickness 3mm). A regular hexagonal plate that touches a circle with a diameter of 1.2cm. One side has been metallized (Ti-Cu alloy powder is applied to the tile surface and baked at 1200℃ in a hydrogen atmosphere).
（） ウロ材：BAG ８（Cu−Ag）
ウロ材を塗設した中間層材を、金属基材上に一
定の配列パターンを以て分散配置し、その上にセ
ラミツクタイルを、略隙間がないように配設した
うえ、加熱炉内において900℃に加熱することに
より、各部材間の重ね合せ面をロウ付けした。つ
いで、ニツケル−燐無電解めつき液中に浸漬し、
中間層材同士の間の空隙Ｖに面する金属基材の内
側面、中間層材側面およびセラミツクタイルの内
側面にNi−Ｐめつき膜（膜厚：10μm）を形成す
ることにより、第２図に示すごとき積層接合体を
得た。この積層接合体をＡとする。また、比較材
として、上記防食処理を省略した点を除いて同一
の条件により積層接合体を得た。この積層接合体
をＢとする。() Uro material: BAG 8 (Cu-Ag) The intermediate layer material coated with Uro material is distributed in a certain arrangement pattern on the metal base material, and the ceramic tiles are placed on top of it with almost no gaps. The overlapping surfaces between each member were brazed by heating to 900°C in a heating furnace. Then, it was immersed in a nickel-phosphorus electroless plating solution,
By forming a Ni-P plating film (thickness: 10 μm) on the inner surface of the metal base material facing the gap V between the intermediate layer materials, the side surface of the intermediate layer material, and the inner surface of the ceramic tile, the second A laminated assembly as shown in the figure was obtained. This laminated assembly is designated as A. In addition, as a comparative material, a laminated assembly was obtained under the same conditions except that the anticorrosive treatment was omitted. This laminated assembly is designated as B.
上記供試接合体ＡおよびＢを、腐食雰囲気のチ
ヤンバ（雰囲気ガス：SOx、温度：150℃、湿
分：50％）中に２ケ月間放置し、各々の接合体の
接合部の腐食状態を比較した結果、比較材である
接合体Ｂは、金属基材と中間層材との接合部ａ１
および中間層材とセラミツクタイルとの接合部ａ
１に著しい腐食が生じたのに対し、供試接合体Ａ
では腐食は全く認められなかつた。 The above test joints A and B were left in a corrosive atmosphere chamber (atmosphere gas: SOx, temperature: 150°C, humidity: 50%) for two months, and the corrosion state of the joints of each joint was examined. As a result of the comparison, it was found that the joint B, which is a comparative material, has a joint part a1 between the metal base material and the intermediate layer material.
and the joint a between the intermediate layer material and the ceramic tile.
Significant corrosion occurred in specimen A, while specimen A
No corrosion was observed at all.
本考案によれば、金属−セラミツク積層接合体
の接合部の腐食が効果的に防止されるので、粉体
送風機ライナ、その他の構造材料としての安定
性・耐久性が高められ、また各種の腐食環境に対
する用途への適用が可能となり、その工業的価値
は大である。
According to the present invention, corrosion of the joints of metal-ceramic laminated joints is effectively prevented, thereby increasing the stability and durability of powder blower liners and other structural materials, and preventing various types of corrosion. It can be applied to environmental purposes and has great industrial value.
第１図、第２図は本考案の実施例を示す模式的
断面図、第３図は従来例を示す模式的断面図であ
る。
１０……金属基材、２０……中間層材、３０…
…セラミツクタイル、４０……防食膜。
1 and 2 are schematic cross-sectional views showing an embodiment of the present invention, and FIG. 3 is a schematic cross-sectional view showing a conventional example. 10... Metal base material, 20... Intermediate layer material, 30...
...Ceramic tile, 40...Anti-corrosion film.
Claims (1)
ターンを以て分散配置された中間層材である金
属板材と、該中間層材の上に略隙間なく配設さ
れたセラミツクタイルとが、互いの重ね合せ面
を接合面として接合されている積層接合体にお
いて、 前記接合面の外周縁部を防食膜で被覆したこ
とを特徴とする金属−セラミツク積層接合体。 (2) 防食膜が無電解めつき膜、または樹脂塗膜で
ある上記第１項に記載の金属−セラミツク積層
接合体。[Claims for Utility Model Registration] (1) A metal base material, a metal plate material that is an intermediate layer material distributed in a certain arrangement pattern on the surface of the metal base material, and a substantially gap above the intermediate layer material. 1. A metal-ceramic laminate in which ceramic tiles arranged in a single layer are joined together with their overlapping surfaces as bonding surfaces, characterized in that the outer periphery of the bonding surfaces is coated with an anti-corrosion film. zygote. (2) The metal-ceramic laminate assembly according to item 1 above, wherein the anticorrosive film is an electroless plated film or a resin coating film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8594987U JPH047165Y2 (en) | 1987-06-02 | 1987-06-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8594987U JPH047165Y2 (en) | 1987-06-02 | 1987-06-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63195553U JPS63195553U (en) | 1988-12-15 |
| JPH047165Y2 true JPH047165Y2 (en) | 1992-02-26 |
Family
ID=30941817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8594987U Expired JPH047165Y2 (en) | 1987-06-02 | 1987-06-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH047165Y2 (en) |
-
1987
- 1987-06-02 JP JP8594987U patent/JPH047165Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63195553U (en) | 1988-12-15 |
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