JPH0472629U - - Google Patents
Info
- Publication number
- JPH0472629U JPH0472629U JP11551590U JP11551590U JPH0472629U JP H0472629 U JPH0472629 U JP H0472629U JP 11551590 U JP11551590 U JP 11551590U JP 11551590 U JP11551590 U JP 11551590U JP H0472629 U JPH0472629 U JP H0472629U
- Authority
- JP
- Japan
- Prior art keywords
- tape base
- wiring
- metal foil
- hole
- patterned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Wire Bonding (AREA)
Description
第１図及び第２図は本考案の一実施例を示すも
のである。第１図は、フイルムキヤリアテープの
位置決め孔付近の縦断面図である。第２図は、フ
イルムキヤリアテープの概略構成を示す斜視図で
ある。第３図は従来例を示すものであり、フイル
ムキヤリアテープの概略構成を示す斜視図である
。
１はテープベース、２はリード（配線）、４は
テープベース孔、５は位置決め孔、６はスプロケ
ツトホールである。
1 and 2 show an embodiment of the present invention. FIG. 1 is a longitudinal sectional view of the vicinity of the positioning hole of the film carrier tape. FIG. 2 is a perspective view showing the schematic structure of the film carrier tape. FIG. 3 shows a conventional example, and is a perspective view showing the schematic structure of a film carrier tape. 1 is a tape base, 2 is a lead (wiring), 4 is a tape base hole, 5 is a positioning hole, and 6 is a sprocket hole.
Claims (1)
ターン形成した半導体実装用フイルムキヤリアテ
ープにおいて、 上記金属箔には上記配線と同時にパターン形成
された位置決め孔が設けられており、かつ、この
位置決め孔に対応するテープベース位置には位置
決め孔よりも径の大きいテープベース孔が設けら
れていることを特徴とするフイルムキヤリアテー
プ。[Claim for Utility Model Registration] A film carrier tape for semiconductor mounting in which wiring is patterned on a metal foil laminated on a tape base, wherein the metal foil is provided with positioning holes patterned at the same time as the wiring. and a tape base hole having a diameter larger than the positioning hole is provided at a tape base position corresponding to the positioning hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11551590U JPH0472629U (en) | 1990-11-02 | 1990-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11551590U JPH0472629U (en) | 1990-11-02 | 1990-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0472629U true JPH0472629U (en) | 1992-06-26 |
Family
ID=31863289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11551590U Pending JPH0472629U (en) | 1990-11-02 | 1990-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0472629U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006224226A (en) * | 2005-02-16 | 2006-08-31 | Mitsui Mining & Smelting Co Ltd | Hand punch and its positioning adjustment device |
| US9072207B2 (en) | 2008-08-06 | 2015-06-30 | Nitto Denko Corporation | Suspension board with circuit, producing method thereof, and positioning method of suspension board with circuit |
-
1990
- 1990-11-02 JP JP11551590U patent/JPH0472629U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006224226A (en) * | 2005-02-16 | 2006-08-31 | Mitsui Mining & Smelting Co Ltd | Hand punch and its positioning adjustment device |
| US9072207B2 (en) | 2008-08-06 | 2015-06-30 | Nitto Denko Corporation | Suspension board with circuit, producing method thereof, and positioning method of suspension board with circuit |
| US10028370B2 (en) | 2008-08-06 | 2018-07-17 | Nitto Denko Corporation | Suspension board and load beam combination including a positioning reference hole and a reinforcing layer |
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