JPH0472667U - - Google Patents
Info
- Publication number
- JPH0472667U JPH0472667U JP11589890U JP11589890U JPH0472667U JP H0472667 U JPH0472667 U JP H0472667U JP 11589890 U JP11589890 U JP 11589890U JP 11589890 U JP11589890 U JP 11589890U JP H0472667 U JPH0472667 U JP H0472667U
- Authority
- JP
- Japan
- Prior art keywords
- iron
- foil
- pasted
- adhesive
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
第１図は、鉄ベース基板の断面図、第２図は、
鉄ベース基板接着時の断面図。 ａは銅箔、ｂは電解鉄箔、ｃはガラスエポキシ
樹脂、Ｄ１，Ｄ２は熱板、Ｅ１，Ｅ２はステンレ
ス鏡面板。
鉄ベース基板接着時の断面図。 ａは銅箔、ｂは電解鉄箔、ｃはガラスエポキシ
樹脂、Ｄ１，Ｄ２は熱板、Ｅ１，Ｅ２はステンレ
ス鏡面板。
Claims (1)
- 電解鉄箔を数枚接着剤で重ねて張り合わせそれ
をベースに銅箔を張りつけた構造をもつ鉄ベース
プリント配線基板材料。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11589890U JPH0472667U (ja) | 1990-11-02 | 1990-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11589890U JPH0472667U (ja) | 1990-11-02 | 1990-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0472667U true JPH0472667U (ja) | 1992-06-26 |
Family
ID=31863707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11589890U Pending JPH0472667U (ja) | 1990-11-02 | 1990-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0472667U (ja) |
-
1990
- 1990-11-02 JP JP11589890U patent/JPH0472667U/ja active Pending
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