JPH0472675U - - Google Patents
Info
- Publication number
- JPH0472675U JPH0472675U JP11517590U JP11517590U JPH0472675U JP H0472675 U JPH0472675 U JP H0472675U JP 11517590 U JP11517590 U JP 11517590U JP 11517590 U JP11517590 U JP 11517590U JP H0472675 U JPH0472675 U JP H0472675U
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- circuit board
- printed circuit
- resist
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
第１図は、本考案に従うプリント回路板の一具
体例を示す一部破砕した斜視図。第２図は、第１
図の要部断面図である。第３図は、第１図の要部
平面図である。
１……プリント回路板、２……基板、３……導
体パターン、４……レジスト、５……ハンダ、６
……導体露出部、７……スルーホール、１０……
出力リード線、１６……境界部。
FIG. 1 is a partially exploded perspective view showing a specific example of a printed circuit board according to the present invention. Figure 2 shows the first
It is a sectional view of the main part of the figure. FIG. 3 is a plan view of the main part of FIG. 1. 1...Printed circuit board, 2...Substrate, 3...Conductor pattern, 4...Resist, 5...Solder, 6
...Conductor exposed part, 7...Through hole, 10...
Output lead wire, 16...boundary part.
Claims (1)
り仕切られた導体露出部が分割して設けられ、該
導体露出部にハンダ鍍金を施すことにより、該導
体パターンの電流容量を実質的に高めたことを特
徴とするプリント回路板。 A conductor pattern through which current flows is divided into exposed conductor parts partitioned by resist, and the exposed conductor parts are solder plated to substantially increase the current capacity of the conductor pattern. printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990115175U JP2544459Y2 (en) | 1990-10-31 | 1990-10-31 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990115175U JP2544459Y2 (en) | 1990-10-31 | 1990-10-31 | Printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0472675U true JPH0472675U (en) | 1992-06-26 |
| JP2544459Y2 JP2544459Y2 (en) | 1997-08-20 |
Family
ID=31862918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990115175U Expired - Fee Related JP2544459Y2 (en) | 1990-10-31 | 1990-10-31 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2544459Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5961566U (en) * | 1982-10-14 | 1984-04-23 | 三洋電機株式会社 | printed wiring board |
-
1990
- 1990-10-31 JP JP1990115175U patent/JP2544459Y2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5961566U (en) * | 1982-10-14 | 1984-04-23 | 三洋電機株式会社 | printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2544459Y2 (en) | 1997-08-20 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |