JPH0472676U - - Google Patents
Info
- Publication number
- JPH0472676U JPH0472676U JP11584290U JP11584290U JPH0472676U JP H0472676 U JPH0472676 U JP H0472676U JP 11584290 U JP11584290 U JP 11584290U JP 11584290 U JP11584290 U JP 11584290U JP H0472676 U JPH0472676 U JP H0472676U
- Authority
- JP
- Japan
- Prior art keywords
- holes
- copper foil
- common
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 241000784732 Lycaena phlaeas Species 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例におけるプリント配
線基板の下面図、第２図は同プリント配線基板の
側断面図、第３図、第４図は本考案の他の実施例
の下面図、第５図は従来のプリント配線基板の下
面図、第６図は同プリント配線基板の側断面図、
第７図、第８図は従来の他のプリント配線基板の
下面図である。
１ａ〜１ｇ……孔、２……プリント配線基板、
３ｂ〜３ｆ，３ｂ′〜３ｆ′……ランド、３ｈ，
３ｉ……共通のランド、４ｂ〜４ｆ，４ｂ′〜４
ｆ′……銅箔部、４ｈ，４ｉ……共通の銅箔部、
５……レジスト、６……ダブルレジスト層、７…
…電子部品、８ａ〜８ｇ……リード端子、９ａ〜
９ｉ……半田。
FIG. 1 is a bottom view of a printed wiring board according to an embodiment of the present invention, FIG. 2 is a side sectional view of the same printed wiring board, and FIGS. 3 and 4 are bottom views of other embodiments of the present invention. Figure 5 is a bottom view of a conventional printed wiring board, Figure 6 is a side sectional view of the same printed wiring board,
7 and 8 are bottom views of other conventional printed wiring boards. 1a to 1g...hole, 2...printed wiring board,
3b to 3f, 3b' to 3f'...land, 3h,
3i... common land, 4b to 4f, 4b' to 4
f′...Copper foil part, 4h, 4i...Common copper foil part,
5...Resist, 6...Double resist layer, 7...
...Electronic components, 8a~8g...Lead terminals, 9a~
9i...Handa.
Claims (1)
孔と、上記複数の孔の内の両端部の複数の孔の孔
縁部を含む共通な銅箔部及び共通のランドと、他
の孔の孔縁部にそれぞれ独立に形成された銅箔部
及びランドとを具備してなるプリント配線基板。 (2) 平行な線上に形成された複数の孔の内、各
線上の両端の孔の孔縁部を含む共通な銅箔部及び
共通のランドを形成してなる請求項第１項記載の
プリント配線基板。 (3) 平行な線上に千鳥上に形成された複数の孔
の内、各線上の両端の孔の孔縁部を含む共通な銅
箔部及び共通のランドを形成してなる請求項第１
項記載のプリント配線基板。[Scope of Claim for Utility Model Registration] (1) A plurality of holes into which lead terminals of electronic components are inserted, a common copper foil portion including the hole edges of the plurality of holes at both ends of the plurality of holes, and A printed wiring board comprising a common land, and copper foil parts and lands formed independently at the edge of each hole. (2) The print according to claim 1, wherein a common copper foil portion including the hole edges of the holes at both ends of each line among the plurality of holes formed on parallel lines and a common land are formed. wiring board. (3) Claim 1, which is formed by forming a common copper foil part including the hole edges of the holes at both ends of each line among a plurality of holes formed in a staggered manner on parallel lines, and a common land.
Printed wiring board as described in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11584290U JPH0472676U (en) | 1990-11-02 | 1990-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11584290U JPH0472676U (en) | 1990-11-02 | 1990-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0472676U true JPH0472676U (en) | 1992-06-26 |
Family
ID=31863645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11584290U Pending JPH0472676U (en) | 1990-11-02 | 1990-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0472676U (en) |
-
1990
- 1990-11-02 JP JP11584290U patent/JPH0472676U/ja active Pending