JPH0472796A - Cooling module - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Summary] To increase the condensation efficiency of a fluorocarbon liquid in a cooling module formed to cool an electronic device by immersing the electronic device in a fluorocarbon liquid housed in a container. With the aim of improving cooling capacity in
Water and gas are stored in a sealed container, a layer of the water is formed on the upper layer of the fluorocarbon liquid, a layer of the gas is further formed on the upper layer of the water, and the electronic device to be cooled is cooled. A condenser immersed in the fluorocarbon liquid and configured to condense the vapor of the fluorocarbon liquid by circulating cold water is disposed in the layer of water.

[Industrial application field]

The present invention relates to a cooling module configured to cool an electronic device by immersing the electronic device in a fluorocarbon liquid contained in a container.

In recent years, semiconductor elements used in electronic devices have become more densely packaged and faster, and in order to ensure stable operation of electronic devices, high cooling capacity is required.

Therefore, for boat fishing, cooling modules have been used which are configured to immerse such electronic devices in a liquid refrigerant and absorb the heat generated by the electronic devices using the heat of vaporization of the liquid.

[Conventional technology]

Conventionally, the structure was as shown in the conventional side cross-sectional view of FIG.

As shown in FIG. 3, a lid plate IA is fixed to the opening of a case IB made of a heat insulating material to store a fluorocarbon liquid 3 and a gas 5 in a sealed container 1.
A condenser 7 is installed inside the pipe 7A, which includes a pipe 7A through which cold water is circulated, and fins 7B fixed to the outer periphery of the pipe 7A.

Further, an electronic device 2 formed by mounting a semiconductor element 2B on a substrate 2A is formed to be immersed in the fluorocarbon liquid 3.

Therefore, the heat generated from the semiconductor element 2B boils the fluorocarbon liquid 3, and the vapor of the fluorocarbon liquid 3 generated by this boiling is condensed by the fins 7B of the condenser 7 and liquefied again.

Therefore, the heat generated by the semiconductor element 2B is cooled by the heat of vaporization being absorbed by the condenser 7 via the fins 7B.

In addition, air is usually used as the gas 5 in this case, and when the vapor pressure of the fluorocarbon liquid 3 becomes high, it is compressed, and when it becomes low, it expands, thereby fulfilling the role of a damper.

[Problem to be solved by the invention]

However, in such cooling in which the vapor of the fluorocarbon liquid 3 is liquefied again in the condenser 7, when the vapor of the fluorocarbon liquid 3 directly contacts the pipe 7A or the fins 7B of the condenser 7, the vapor of the fluorocarbon liquid 3 is condensed with the vapor of the fluorocarbon liquid 3 for the first time. Heat transfer occurs between the condenser 7 and the condenser 7, and almost no heat transfer occurs at locations that are not in direct contact with the pipe 7A or the fins 7B of the condenser 7.

Therefore, there was a problem that the condensation efficiency of the fluorocarbon liquid 3 against vapor was poor and the cooling capacity was low.

Therefore, an object of the present invention is to improve the cooling capacity by increasing the condensation efficiency of the fluorocarbon liquid.

[Means to solve the problem]

FIG. 1 is a diagram explaining the principle of the present invention.

As shown in FIG. 1, a fluorocarbon liquid 3, water 4, and gas 5 are stored in a sealed container 1, a layer of the water 4 is formed on the upper layer of the fluorocarbon liquid 3, and a layer of the water 4 is further added to the water 4. forming a layer of the gas 5 on the upper layer, and immersing the electronic device 2 to be cooled in the fluorocarbon liquid 3;
A condenser 7 for condensing the vapor of the fluorocarbon liquid 3 by circulating cold water 6 is arranged in the layer of the water 4.

With this configuration, the above-mentioned problem is solved.

[Effect]

That is, a fluorocarbon liquid 3 and water 4 are placed in a sealed container 1.
and gas 5, the electronic device 2 to be cooled is immersed in the fluorocarbon liquid 3, and the layer of water 4 is filled with cold water 6.
A condenser 7 is installed to condense the vapor of the orocarbon liquid 3 through circulation.

Therefore, condensation of the vapor of the orocarbon liquid 3 is carried out both by direct contact with the condenser 7 and by using water 4. In this case, the heat transfer efficiency is good, and compared to the conventional method in which steam is condensed only when it comes into contact with the condenser 7, the condensation efficiency can be increased and the cooling capacity can be improved.

〔Example〕

The present invention will be explained in detail below with reference to FIG.

FIG. 2 is a side sectional view of an embodiment according to the present invention. Like numbers refer to like objects throughout the design.

As shown in FIG. 2, a fluorocarbon liquid 3, water 4, and a gas 5 such as air are stored in a sealed container 1 consisting of a case IB and a lid plate IA.
The electronic device 2 is immersed in the water, and the condenser 7 is disposed in the water 4 layer above the fluorocarbon liquid 3.

Furthermore, in this case, due to the difference in specific gravity of the fluorocarbon liquid 3, water 4, and gas 5 stored in the container 1, and their immiscible nature, the water 4 is inevitably placed in the upper layer of the fluorocarbon liquid 3. The gas 5 is maintained in the upper layer of the water 4.

Therefore, the water 4 is cooled by circulating the cold water 6 through the condenser 7, and the vapor of the fluorocarbon liquid 3 that boils due to the heat generated by the semiconductor element 2B of the electronic device 2 is condensed in the layer of water 4, and the electronic device 2 cooling.

When a layer of water 4 is formed around the condenser 7 in this way, the water 4 has higher specific heat and thermal conductivity than the fluorocarbon liquid 3, so
This results in efficient heat transfer.

Therefore, condensation of the vapor of the fluorocarbon liquid 3 is not only carried out by direct contact of the vapor with the pipe 7A or the fin 7B, but also condensation is carried out by the water 4 when the vapor penetrates into the layer of water 4. Therefore, the condensation efficiency can be increased, and the cooling efficiency of electronic devices immersed in the fluorocarbon liquid 3 can be improved.

〔Effect of the invention〕

As explained above, according to the present invention, a water layer is formed on the upper layer of the fluorocarbon liquid, and a condenser is provided in the water layer to condense the vapor of the fluorocarbon liquid. , the condensation efficiency can be improved.

Therefore, compared to the conventional method, the condensation efficiency of the fluorocarbon liquid is increased, so that the cooling efficiency of electronic devices immersed in the fluorocarbon liquid can be improved, and the practical effect is great.

[Brief explanation of drawings]

FIG. 1 is a diagram explaining the principle of the present invention. FIG. 2 is a side sectional view of an embodiment according to the present invention. FIG. 3 shows a conventional side sectional view. In the figure, 1 is the container, 2 is the electronic device. 3 is fluorocarbon liquid, 4 is water. 5 is gas, 6 is cold water. 7 indicates a condenser. Diagram explaining the principle of this defense Figure 1 IAjL board A lid plate / Conventional cross-sectional view of the first side

Claims (1)

[Claims] Fluorocarbon liquid (3), water (4), and gas (5)
) is stored in a sealed container (1), a layer of the water (4) is formed on the upper layer of the fluorocarbon liquid (3), and a layer of the gas (5) is further formed on the upper layer of the water (4). and the electronic equipment to be cooled (2) is immersed in the fluorocarbon liquid (3).
), and a condenser (7) for condensing the vapor of the fluorocarbon liquid (3) by circulating cold water (6) is arranged in the layer of water (4). .