JPH0473423U - - Google Patents
Info
- Publication number
- JPH0473423U JPH0473423U JP11586790U JP11586790U JPH0473423U JP H0473423 U JPH0473423 U JP H0473423U JP 11586790 U JP11586790 U JP 11586790U JP 11586790 U JP11586790 U JP 11586790U JP H0473423 U JPH0473423 U JP H0473423U
- Authority
- JP
- Japan
- Prior art keywords
- diamond
- layer
- diamond bead
- hard layer
- saw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910003460 diamond Inorganic materials 0.000 claims description 23
- 239000010432 diamond Substances 0.000 claims description 23
- 239000011324 bead Substances 0.000 claims description 22
- 239000011162 core material Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 2
- 239000003082 abrasive agent Substances 0.000 claims 1
- 239000011230 binding agent Substances 0.000 claims 1
- 239000007767 bonding agent Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
第１図は本考案のダイヤモンドビーズの実施例
を断面によつて示す。第２図は本考案に係るダイ
ヤモンドビーズの摩耗状態を比較例と共に示す図
である。第３図は本考案に係るダイヤモンドビー
ズの負荷電流の変化を比較例と共に示す図である
。第４図は本考案に係るダイヤモンドビーズによ
る被切断材の平坦度の変化を比較例と共に示す図
である。第５図はダイヤモンドビーズソーの基本
構造を示す図である。
１……ビーズ基体、２……ワイヤ芯材、３……
環状のダイヤモンドビーズ、４……樹脂被覆材、
１０……ダイヤモンドビーズ、１１……前部層、
１２……後部層。
FIG. 1 shows, in cross section, an embodiment of the diamond beads of the present invention. FIG. 2 is a diagram showing the wear state of the diamond beads according to the present invention together with a comparative example. FIG. 3 is a diagram showing changes in the load current of the diamond beads according to the present invention together with a comparative example. FIG. 4 is a diagram showing the change in flatness of a material to be cut by diamond beads according to the present invention together with a comparative example. FIG. 5 is a diagram showing the basic structure of a diamond bead saw. 1... Bead base, 2... Wire core material, 3...
Ring-shaped diamond beads, 4...Resin coating material,
10...Diamond beads, 11...Front layer,
12... Posterior layer.
Claims (1)
で嵌着したダイヤモンドビーズソーにおいて、ダ
イヤモンドビーズがダイヤモンドビーズの進行方
向に向かつて前部に硬質層を形成すると共に後部
に軟質層を形成した２層構造を有するダイヤモン
ドビーズソー。 ２ 請求項１に記載のダイヤモンドビーズの前部
の硬質層が、その長さにおいて、ダイヤモンドビ
ーズ全長の約１０〜５０％であるダイヤモンドビ
ーズソー。 ３ 請求項１に記載のダイヤモンドビーズの前部
の硬質層が、後部層に比べて５〜５０％高い耐摩
耗性を有する金属結合剤を使用してなるダイヤモ
ンドビーズソー。 ４ 請求項１に記載のダイヤモンドビーズの前部
の硬質層が、後部層に比べてダイヤモンド砥材の
集中度を１０〜５０％高くしてなるダイヤモンド
ビーズソー。 ５ 請求項１に記載のダイヤモンドビーズの前部
の硬質層が、後部層に比べて５〜５０％高耐摩耗
性を有する金属結合剤を使用すると共に、ダイヤ
モンド砥材の集中度を１０〜５０％高くしてなる
ダイヤモンドビーズソー。[Scope of Claim for Utility Model Registration] 1. In a diamond bead saw in which annular diamond beads are fitted at regular intervals on a core material, the diamond beads form a hard layer at the front part as they face in the direction of travel of the diamond beads, and at the same time form a hard layer at the rear part. A diamond bead saw with a two-layer structure with a soft layer. 2. A diamond bead saw according to claim 1, wherein the hard layer at the front of the diamond bead is about 10-50% of the total length of the diamond bead in length. 3. A diamond bead saw according to claim 1, wherein the front hard layer of the diamond bead uses a metal bonding agent having wear resistance 5 to 50% higher than that of the rear layer. 4. A diamond bead saw in which the front hard layer of the diamond bead according to claim 1 has a concentration of diamond abrasive material 10 to 50% higher than that in the rear layer. 5. The front hard layer of the diamond bead according to claim 1 uses a metal binder having wear resistance 5 to 50% higher than that of the rear layer, and the concentration of the diamond abrasive is 10 to 50%. % higher diamond bead saw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990115867U JPH074893Y2 (en) | 1990-11-01 | 1990-11-01 | Diamond beads saw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990115867U JPH074893Y2 (en) | 1990-11-01 | 1990-11-01 | Diamond beads saw |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0473423U true JPH0473423U (en) | 1992-06-26 |
| JPH074893Y2 JPH074893Y2 (en) | 1995-02-08 |
Family
ID=31863672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990115867U Expired - Lifetime JPH074893Y2 (en) | 1990-11-01 | 1990-11-01 | Diamond beads saw |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH074893Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5286791U (en) * | 1975-12-24 | 1977-06-28 | ||
| EP0160625A2 (en) * | 1984-04-27 | 1985-11-06 | Emilio Brocco | Diamond wire for cutting stone and marble |
| JPH0224910U (en) * | 1988-08-03 | 1990-02-19 |
-
1990
- 1990-11-01 JP JP1990115867U patent/JPH074893Y2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5286791U (en) * | 1975-12-24 | 1977-06-28 | ||
| EP0160625A2 (en) * | 1984-04-27 | 1985-11-06 | Emilio Brocco | Diamond wire for cutting stone and marble |
| JPH0224910U (en) * | 1988-08-03 | 1990-02-19 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH074893Y2 (en) | 1995-02-08 |
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