JPH0474486U

JPH0474486U -

Info

Publication number: JPH0474486U
Application number: JP11790190U
Authority: JP
Priority date: 1990-11-07
Filing date: 1990-11-07
Publication date: 1992-06-30

Description

[Brief explanation of the drawing]

第１図はこの考案の一実施例による埋め込みネ
ジ部材を使用した装置を示す正面断面図、第２図
は第１図における要部の断面図、第３図は埋め込
みネジ部材を示しイは側面図ロは下面図、第４図
は異なる埋め込み部を示しイは側面図ロは下面図
、第５図は従来の電子部品取付方法を使用した装
置を示す斜視図、第６図は第５図の要部を示す断
面図である。図において、１はパワートランジスタ、２は絶
縁板、３は枠体、５はヒートシンク、８は埋め込
みネジ部材、８Ａはネジ部、８Ｂは埋め込み部、
９はスリツト溝、１０はリング溝、１１は止メナ
ツト、１２は段付穴部、１３は接着剤を示す。な
お、各図中同一符号は同一または相当部分を示す
。 Fig. 1 is a front sectional view showing a device using an embedded screw member according to an embodiment of the invention, Fig. 2 is a sectional view of the main part in Fig. 1, and Fig. 3 shows the embedded screw member. Figure B is a bottom view, Figure 4 shows a different embedded part, A is a side view, B is a bottom view, Figure 5 is a perspective view showing a device using the conventional electronic component mounting method, and Figure 6 is a FIG. In the figure, 1 is a power transistor, 2 is an insulating plate, 3 is a frame, 5 is a heat sink, 8 is an embedded screw member, 8A is a screw part, 8B is an embedded part,
9 is a slit groove, 10 is a ring groove, 11 is a locking nut, 12 is a stepped hole, and 13 is an adhesive. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims

[Scope of utility model registration request]

In an electronic component mounting device equipped with an insulating plate having good thermal conductivity, which is installed on a heat sink that absorbs and dissipates heat, and on which electronic components are placed, a part of the insulating plate is embedded in the insulating plate via an adhesive. An embedded screw member for an electronic component mounting device is characterized in that the embedded part has a groove for adhesive to run around, thereby fixing the mounted electronic component with a predetermined tightening torque while maintaining insulation properties. .