JPH04747U - - Google Patents
Info
- Publication number
- JPH04747U JPH04747U JP3959190U JP3959190U JPH04747U JP H04747 U JPH04747 U JP H04747U JP 3959190 U JP3959190 U JP 3959190U JP 3959190 U JP3959190 U JP 3959190U JP H04747 U JPH04747 U JP H04747U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- drying apparatus
- support
- main body
- piping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims 1
- 238000001514 detection method Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図は本考案の一実施例の概略の断面図、第
２図は従来の半導体ウエハー乾燥装置の概略の断
面図である。
１……乾燥装置本体の外囲容器のボール、２…
…回転シヤフト、３……クレードル、４……キヤ
リア、５……検出配管、６……水分除去用フイル
タ、７……パーテイクルカウンタ、８……アラー
ムブザー、９……アラームランプ、１０……半導
体ウエハー。
FIG. 1 is a schematic sectional view of an embodiment of the present invention, and FIG. 2 is a schematic sectional view of a conventional semiconductor wafer drying apparatus. 1...Ball of the outer container of the drying device main body, 2...
... Rotating shaft, 3 ... Cradle, 4 ... Carrier, 5 ... Detection piping, 6 ... Moisture removal filter, 7 ... Part-take counter, 8 ... Alarm buzzer, 9 ... Alarm lamp, 10 ... semiconductor wafer.
Claims (1)
ハーを前記支持体と共に高速回転し、遠心力によ
り前記半導体ウエハーの脱水乾燥を行う乾燥装置
本体部と、前記外囲容器に配管で接続され前記半
導体ウエハー割れを検知するためのパーテイクル
カウンタとを備えた半導体ウエハー乾燥装置にお
いて、前記配管の途中または端部に水分除去用の
フイルタを備えていることを特徴とする半導体ウ
エハー乾燥装置。 a drying apparatus main body that rotates a semiconductor wafer supported on a support at high speed together with the support in an envelope, and dehydrates and dries the semiconductor wafer by centrifugal force; A semiconductor wafer drying apparatus equipped with a particle counter for detecting semiconductor wafer cracks, characterized in that the semiconductor wafer drying apparatus is equipped with a filter for removing moisture in the middle or at the end of the piping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3959190U JPH04747U (en) | 1990-04-13 | 1990-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3959190U JPH04747U (en) | 1990-04-13 | 1990-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04747U true JPH04747U (en) | 1992-01-07 |
Family
ID=31548638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3959190U Pending JPH04747U (en) | 1990-04-13 | 1990-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04747U (en) |
-
1990
- 1990-04-13 JP JP3959190U patent/JPH04747U/ja active Pending
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