JPH0475367A - wiring connection device - Google Patents
wiring connection deviceInfo
- Publication number
- JPH0475367A JPH0475367A JP18969190A JP18969190A JPH0475367A JP H0475367 A JPH0475367 A JP H0475367A JP 18969190 A JP18969190 A JP 18969190A JP 18969190 A JP18969190 A JP 18969190A JP H0475367 A JPH0475367 A JP H0475367A
- Authority
- JP
- Japan
- Prior art keywords
- connection device
- wiring
- wiring connection
- flexible
- input
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は配線接続装置、特にＬＳＩチップを実装した可
撓性の配線接続装置の構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wiring connection device, and particularly to the structure of a flexible wiring connection device mounting an LSI chip.
例えば液晶表示装置において液晶表示体と、その駆動制
御回路基板とを接続する場合、ＬＳＩ等の液晶駆動用の
工Ｃチップを実装した可撓性配線接続装置が多く用いら
れている。For example, when connecting a liquid crystal display body and its drive control circuit board in a liquid crystal display device, a flexible wiring connection device on which a C chip for driving the liquid crystal, such as an LSI, is mounted is often used.
第３図は従来の可撓性配線接続装置を示す一例で、同図
において１は図に省略した液晶表示体と、その駆動制御
回路基板とを接続するＦＰＣ（Ｆｌｅｘｉｂｌｅ Ｐｒ
１ｎｔｅｄ Ｃ１ｒｃｕｉｔ）等の可撓性配線液Ｍ ｉ
置であり、その配線接続装置上には、ＬＳＩ等の液晶
駆動用のＩＣチップ２がいわゆるＴ Ａ Ｂ （Ｔａｐ
ｅＡｕｔｏｍａｔｅｄ Ｂｏｎｄｉｎｇ）方式等で実験
されテイル。FIG. 3 shows an example of a conventional flexible wiring connection device. In the same figure, reference numeral 1 denotes an FPC (Flexible Pr
Flexible wiring liquid M i such as 1inted C1rcuit)
On the wiring connection device, an IC chip 2 for driving a liquid crystal such as an LSI is mounted on a so-called T A B (Tap
It has been experimented with eAutomated Bonding) method etc.
そして上記可撓性配線接続装置の入力配線の他端を不図
示の制御回路基板に半田付は等で接続し、出力配線を不
図示の液晶表示体の電極基板に異方性導電接着剤等で接
続するものである。Then, the other end of the input wiring of the flexible wiring connection device is connected to a control circuit board (not shown) by soldering, etc., and the output wiring is connected to an electrode board of a liquid crystal display (not shown) using an anisotropic conductive adhesive, etc. It is connected by .
第４図はＬＳＩを搭載した可撓性配線接続装置を、個々
の液晶表示体に使用するために切り離す際に−入力配線
の両端にあるＦＰＣを切り落としていた（但し、複数本
の入力端子の間隔を保持させるために入力端子部の先端
のＦＰＣは残しておく）可撓性配線接続装置である。Figure 4 shows that when separating a flexible wiring connection device equipped with an LSI to use it for each individual liquid crystal display, the FPC at both ends of the input wiring was cut off (however, the FPC at both ends of the input wiring was cut off). This is a flexible wiring connection device (the FPC at the tip of the input terminal section is left in place to maintain the spacing).
以上のような可撓性配線接続装置が一般的に知られてい
た。Flexible wiring connection devices such as those described above have been generally known.
しかし、上記のような従来の可撓性配線接続装置からな
る液晶表示装置では、可撓性配線接続装置の出力配線側
を異方性導電接着剤等で、液晶表示体の電極基板に接続
、固定され、入力配線側を制御回路基板に半田付けなど
で接続、固定されている、そのため液晶表示体または制
御回路基板の移動等によるストレスが可撓性配線接続装
置の特に入力配線側のエツジ部分にそってストレートに
加わってしまい入力配線の切れという問題を有していた
。そこで本発明の目的は上記の問題を解決し信頼性の向
上した配線接続装置を提供することにある。However, in the liquid crystal display device made of the conventional flexible wiring connection device as described above, the output wiring side of the flexible wiring connection device is connected to the electrode substrate of the liquid crystal display with an anisotropic conductive adhesive or the like. The input wiring side is connected and fixed to the control circuit board by soldering, etc. Therefore, stress due to movement of the liquid crystal display or control circuit board, etc., is applied to the flexible wiring connection device, especially at the edges of the input wiring side. There was a problem in that the input wiring was connected straight along the line, causing the input wiring to break. SUMMARY OF THE INVENTION An object of the present invention is to solve the above problems and provide a wiring connection device with improved reliability.
本発明の配線接続装置は、駆動用ＬＳＩチップを実装し
、そのＩＣチップへの入出力配線を可撓性基板上に配し
てなる配線接続装置において、半田付は出力配線部の両
端の接続端子に、全部または途中まで可撓性基板を残存
させたことを特徴とする。In the wiring connection device of the present invention, in which a driving LSI chip is mounted and input/output wiring to the IC chip is arranged on a flexible substrate, soldering is used to connect both ends of the output wiring portion. The terminal is characterized by having a flexible substrate remaining all or part way.
〔実施例１〕
以下、本発明を液晶表示装置に適用した実施例に基づい
てより具体的に説明する。[Example 1] Hereinafter, the present invention will be described in more detail based on an example in which the present invention is applied to a liquid crystal display device.
第１図は本発明による可撓性配線装置の正面図であり、
前記従来例と同様の機能を有する部分には同一の符号を
付して再度の説明を省略する。FIG. 1 is a front view of a flexible wiring device according to the present invention,
The same reference numerals are given to the parts having the same functions as those of the conventional example, and the explanation thereof will be omitted.
可撓性配線接続装置１は、ポリイミド樹脂などのシート
状の合成樹脂製可撓性基材１０の片面に銅泊等で入力配
線１１を形成したいわゆるＦＰＣよりなり、その可撓性
配線装置１上にＬＳＩ等の液晶駆動用のＩＣチップ２が
ＴＡＢ方式により実装されている。The flexible wiring connection device 1 is made of a so-called FPC in which an input wiring 11 is formed with copper foil or the like on one side of a flexible base material 10 made of a sheet-like synthetic resin such as polyimide resin. An IC chip 2 for driving a liquid crystal, such as an LSI, is mounted on top using the TAB method.
その可撓性配線装置１の可撓性基材１ｏを入力配線１１
の両側に残存させ、その外側に可撓性基材１０を固定さ
せるよう銅箔パターン４を構成させる、これによって入
力配線１１の切れは、可撓性基材１０を入力配線１１と
共に不図示の制御回路基板に接続、固定することで入力
配線１１だけにストレスが加わることがなくなり入力配
線１１の切れを防止することができる。The flexible base material 1o of the flexible wiring device 1 is connected to the input wiring 11.
The copper foil pattern 4 is configured so as to remain on both sides of the copper foil pattern 4 and fix the flexible base material 10 to the outside of the copper foil pattern 4. As a result, when the input wiring 11 is cut, the flexible base material 10 is removed along with the input wiring 11 (not shown). By connecting and fixing to the control circuit board, stress is not applied only to the input wiring 11, and breakage of the input wiring 11 can be prevented.
〔実施例２〕
第２図は上記実施例１の変形例であり可撓性配線接続装
置１の可撓性基材１ｏを途中まで残存させた図である残
存させた可撓性基材１ｏには銅箔パターン４を構成する
、これによってストレスを可撓性配線接続装置１と入力
配線１１のエツジにストレートに加えないようにしたも
のである。[Example 2] Fig. 2 is a modification of the above-mentioned Example 1, and is a diagram in which the flexible base material 1o of the flexible wiring connection device 1 is left halfway. A copper foil pattern 4 is constructed to prevent stress from being applied straight to the edges of the flexible wiring connection device 1 and the input wiring 11.
なお、上記実施例は本発明を液晶表示装置に適用した場
合を例にして説明したが、サーマルヘッドもしくはＥＬ
表示装置やプラズマ表示装置などにも適用可能である。Note that the above embodiment has been explained using the case where the present invention is applied to a liquid crystal display device, but it is also applicable to a thermal head or an EL
It is also applicable to display devices, plasma display devices, and the like.
本発明の上記構成によれば、入力配線の両側に可撓性基
材を残存させ接続、固定することで配線°接続装置の入
力配線の切れを防止し信頼性の向上した配線接続装置を
提供できるという効果を有している。According to the above configuration of the present invention, by leaving the flexible base material on both sides of the input wiring to connect and fix it, it is possible to prevent the input wiring of the wiring connection device from breaking, thereby providing a wiring connection device with improved reliability. It has the effect of being possible.
第１図は本発明による配線接続装置の一実施例を示す正
面図。FIG. 1 is a front view showing an embodiment of a wiring connection device according to the present invention.
第２図は他の実施例を示す正面図。FIG. 2 is a front view showing another embodiment.
第３図は従来のＩＣチップ搭載前の配線接続装置の正面
図。FIG. 3 is a front view of a conventional wiring connection device before mounting an IC chip.
第４図は従来のＩＣチップ搭載後の配線接続装置の正面
図。FIG. 4 is a front view of a conventional wiring connection device after mounting an IC chip.
１・−・可撓性配線接続装置
２・・・ＩＣチップ
３・・・残存させた可撓性配線基材
４・・・可撓性配線基材固定用銅箔パターン１１・・・
入力配線
１２・・・出力配線
以 上
出願人 セイコーエプソン株式会社
代理人 弁理士 絵本 喜三部 ｆｌｌ！！１名1... Flexible wiring connection device 2... IC chip 3... Remained flexible wiring base material 4... Copper foil pattern for fixing flexible wiring base material 11...
Input wiring 12... Output wiring and above Applicant Seiko Epson Co., Ltd. agent Patent attorney Picture book Kisanbe fll! ! 1 person
第２図 Figure 2
Claims (1)
出力配線を可撓性基板上に配してなる配線接続装置にお
いて、配線接続装置の半田付け入力配線部の両端の端子
に、全部または途中まで可撓性基材を残存させたことを
特徴とする配線接続装置。In a wiring connection device in which a driving LSI chip is mounted and input/output wiring to the IC chip is arranged on a flexible substrate, all or part of the terminals at both ends of the soldered input wiring part of the wiring connection device are A wiring connection device characterized in that a flexible base material remains until the end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18969190A JPH0475367A (en) | 1990-07-18 | 1990-07-18 | wiring connection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18969190A JPH0475367A (en) | 1990-07-18 | 1990-07-18 | wiring connection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0475367A true JPH0475367A (en) | 1992-03-10 |
Family
ID=16245575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18969190A Pending JPH0475367A (en) | 1990-07-18 | 1990-07-18 | wiring connection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0475367A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980026262A (en) * | 1996-10-08 | 1998-07-15 | 김광호 | Film Carrier in Tab Package |
| KR100235107B1 (en) * | 1993-02-12 | 1999-12-15 | 윤종용 | Tab package |
-
1990
- 1990-07-18 JP JP18969190A patent/JPH0475367A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100235107B1 (en) * | 1993-02-12 | 1999-12-15 | 윤종용 | Tab package |
| KR19980026262A (en) * | 1996-10-08 | 1998-07-15 | 김광호 | Film Carrier in Tab Package |
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