JPH0476039U

JPH0476039U -

Info

Publication number: JPH0476039U
Application number: JP11849690U
Authority: JP
Priority date: 1990-11-14
Filing date: 1990-11-14
Publication date: 1992-07-02

Description

[Brief explanation of the drawing]

第１図はこの考案の一実施例におけるキヤリア
テープの回路基板などの電子部品への実装前の状
態を示す平面図、第２図はこのキヤリアテープの
回路基板などの電子部品への実装中の状態を示す
平面図、第３図はこのキヤリアテープの回路基板
などの電子部品への実装後の状態を示す平面図、
第４図は従来のキヤリアテープの一例を示す平面
図、第５図は従来のキヤリアテープの他の例を示
す平面図である。Ａ……キヤリアテープ、１……ベーステープ、
２……半導体チツプ配置用開口、３……支持片、
４……リード突出用開口、５……キヤリアテープ
本体、６……フインガリード、７……半導体チツ
プ、１１……フインガリードの切断可能部、１２
……支持片の切断可能部。 Fig. 1 is a plan view showing the carrier tape in an embodiment of this invention before being mounted on an electronic component such as a circuit board, and Fig. 2 is a plan view showing the carrier tape being mounted on an electronic component such as a circuit board. Fig. 3 is a plan view showing the state of the carrier tape after it has been mounted on an electronic component such as a circuit board;
FIG. 4 is a plan view showing an example of a conventional carrier tape, and FIG. 5 is a plan view showing another example of the conventional carrier tape. A...Carrier tape, 1...Base tape,
2... Opening for semiconductor chip placement, 3... Support piece,
4... Opening for lead projection, 5... Carrier tape main body, 6... Finger lead, 7... Semiconductor chip, 11... Cuttable portion of finger lead, 12
... Cuttable part of the support piece.

Claims

[Claims for Utility Model Registration] An opening for arranging a semiconductor chip is formed in the base tape, and an opening for protruding leads is formed around the opening for arranging a semiconductor chip. A carrier tape body is formed between the carrier tape body and the lead protrusion opening, and a pattern is formed on the carrier tape body so that the ingare lead bridges at least the lead protrusion opening. A carrier tape characterized in that a cuttable part is provided in the middle of the finger lead.