JPH0476050U - - Google Patents
Info
- Publication number
- JPH0476050U JPH0476050U JP1990119444U JP11944490U JPH0476050U JP H0476050 U JPH0476050 U JP H0476050U JP 1990119444 U JP1990119444 U JP 1990119444U JP 11944490 U JP11944490 U JP 11944490U JP H0476050 U JPH0476050 U JP H0476050U
- Authority
- JP
- Japan
- Prior art keywords
- power semiconductor
- terminal
- semiconductor device
- nickel
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例による電力半導体装
置の斜視図、第２図は第１図の電力半導体装置を
Ａ方向から見た側面図、第３図は本考案の一実施
例による端子の斜視図、第４図は従来例による電
力半導体装置の斜視図である。
１……基板、３……電力半導体素子、６……ア
ルミワイヤー、８……端子、１０……ニツケルメ
ツキ、１１……ニツケルメツキ部。
FIG. 1 is a perspective view of a power semiconductor device according to an embodiment of the present invention, FIG. 2 is a side view of the power semiconductor device of FIG. 1 viewed from direction A, and FIG. 3 is a terminal according to an embodiment of the present invention. FIG. 4 is a perspective view of a conventional power semiconductor device. DESCRIPTION OF SYMBOLS 1... Board, 3... Power semiconductor element, 6... Aluminum wire, 8... Terminal, 10... Nickel plating, 11... Nickel plating part.
Claims (1)
の端子を固定してなる電力半導体装置において、 前記端子にニツケルメツキを施し、該ニツケル
メツキ部と前記電力半導体素子とをアルミワイヤ
ーにより接続してなることを特徴とする電力半導
体装置。[Claims for Utility Model Registration] A power semiconductor device in which a terminal for external connection is fixed to a substrate on which a power semiconductor element is mounted, wherein the terminal is plated with nickel, and the nickel plated part and the power semiconductor element are made of aluminum. A power semiconductor device characterized by being connected by wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990119444U JPH0476050U (en) | 1990-11-14 | 1990-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990119444U JPH0476050U (en) | 1990-11-14 | 1990-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0476050U true JPH0476050U (en) | 1992-07-02 |
Family
ID=31867401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990119444U Pending JPH0476050U (en) | 1990-11-14 | 1990-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0476050U (en) |
-
1990
- 1990-11-14 JP JP1990119444U patent/JPH0476050U/ja active Pending