JPH0476062U - - Google Patents
Info
- Publication number
- JPH0476062U JPH0476062U JP11928390U JP11928390U JPH0476062U JP H0476062 U JPH0476062 U JP H0476062U JP 11928390 U JP11928390 U JP 11928390U JP 11928390 U JP11928390 U JP 11928390U JP H0476062 U JPH0476062 U JP H0476062U
- Authority
- JP
- Japan
- Prior art keywords
- light
- lead
- receiving element
- view
- mold resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004593 Epoxy Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 1
Description
第１図は本考案の第１の実施例の斜視図、第２
図は第１図のＸ−Ｘ′線断面図、第３図は本考案
の受光素子側リードフレームの平面図、第４図は
、本考案の第２の実施例の斜視図、第５図は、最
大許容コレクタ損失曲線を示す図、第６図は、従
来の光結合装置の斜視図、第７図は、第６図のＹ
−Ｙ′線断面図である。
１１，４１……放熱板、１２，４２，６１……
アノードリード、１３，４３，６２……カソード
リード、１４，４５，６４……エミツタリード、
１５，４６，６３……コレクタリード、１６，４
８，６５……エポキシ系モールド樹脂（黒色）、
２０，６７……エポキシ系モールド樹脂（白色）
、１７，４９……凹み、２１，６９……Ａｕワイ
ヤー、２２，７０……シリコン樹脂、４４……ノ
ンコネクシヨン、４７……ベースリード。
Fig. 1 is a perspective view of the first embodiment of the present invention;
The figures are a sectional view taken along the line X-X' in Fig. 1, Fig. 3 is a plan view of the lead frame on the light receiving element side of the present invention, Fig. 4 is a perspective view of the second embodiment of the present invention, and Fig. 5 is a diagram showing the maximum allowable collector loss curve, FIG. 6 is a perspective view of a conventional optical coupling device, and FIG. 7 is a diagram showing the maximum allowable collector loss curve.
-Y' line sectional view. 11, 41... Heat sink, 12, 42, 61...
Anode lead, 13, 43, 62... Cathode lead, 14, 45, 64... Emitter lead,
15, 46, 63... Collector lead, 16, 4
8,65...Epoxy mold resin (black),
20,67...Epoxy mold resin (white)
, 17, 49... recess, 21, 69... Au wire, 22, 70... silicone resin, 44... non-connection, 47... base lead.
Claims (1)
した光結合装置において、前記受光素子のコレク
タリードと同電位のリードをエポキシ系モールド
樹脂より外に引き出した放熱板を有するこを特徴
とする光結合装置。 An optical coupling device in which a light-emitting element and a light-receiving element are housed in the same package, characterized by having a heat sink in which a lead having the same potential as the collector lead of the light-receiving element is drawn out from an epoxy mold resin. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11928390U JPH0476062U (en) | 1990-11-14 | 1990-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11928390U JPH0476062U (en) | 1990-11-14 | 1990-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0476062U true JPH0476062U (en) | 1992-07-02 |
Family
ID=31867251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11928390U Pending JPH0476062U (en) | 1990-11-14 | 1990-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0476062U (en) |
-
1990
- 1990-11-14 JP JP11928390U patent/JPH0476062U/ja active Pending