JPH0476064U - - Google Patents
Info
- Publication number
- JPH0476064U JPH0476064U JP1990119757U JP11975790U JPH0476064U JP H0476064 U JPH0476064 U JP H0476064U JP 1990119757 U JP1990119757 U JP 1990119757U JP 11975790 U JP11975790 U JP 11975790U JP H0476064 U JPH0476064 U JP H0476064U
- Authority
- JP
- Japan
- Prior art keywords
- emitting element
- light emitting
- case
- light
- peripheral area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Description
第１図はこの考案に係るチツプ部品型ＬＥＤラ
ンプの構成を示した図であり、同図Ａは平面図、
同図Ｂは正面図、同図Ｃは側面図である。また、
第２図は従来のＬＥＤランプの構成を示した図で
あり、同図Ａ〜Ｃはそれぞれ異なるＬＥＤランプ
の構成を示している。
１……基板、２……配線パターン、３……発光
素子、４……光反射樹脂のケース、５……光透過
性樹脂。
Fig. 1 is a diagram showing the configuration of a chip component type LED lamp according to this invention, and Fig. 1A is a plan view;
Figure B is a front view, and Figure C is a side view. Also,
FIG. 2 is a diagram showing the structure of a conventional LED lamp, and FIG. 2A to C each show a different structure of the LED lamp. 1... Board, 2... Wiring pattern, 3... Light emitting element, 4... Light reflective resin case, 5... Light transmitting resin.
Claims (1)
光素子と、 光反射性樹脂からなり、前記発光素子周辺部を
除く部分で基板の上下面を挟持するケースと、 光透過性樹脂からなり、前記発光素子周辺部に
おいて発光素子およびケースに密着される封止部
と、 を備えるチツプ部品型ＬＥＤランプ。[Scope of Claim for Utility Model Registration] A light emitting element bonded to a wiring pattern on a board, a case made of a light reflective resin and sandwiching the upper and lower surfaces of the board except for the peripheral area of the light emitting element, and a light transmitting case. A chip component type LED lamp comprising: a sealing part made of resin and tightly attached to a light emitting element and a case in a peripheral area of the light emitting element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990119757U JPH0476064U (en) | 1990-11-14 | 1990-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990119757U JPH0476064U (en) | 1990-11-14 | 1990-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0476064U true JPH0476064U (en) | 1992-07-02 |
Family
ID=31867693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990119757U Pending JPH0476064U (en) | 1990-11-14 | 1990-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0476064U (en) |
-
1990
- 1990-11-14 JP JP1990119757U patent/JPH0476064U/ja active Pending