JPH04771U - - Google Patents
Info
- Publication number
- JPH04771U JPH04771U JP3954290U JP3954290U JPH04771U JP H04771 U JPH04771 U JP H04771U JP 3954290 U JP3954290 U JP 3954290U JP 3954290 U JP3954290 U JP 3954290U JP H04771 U JPH04771 U JP H04771U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- molded
- pillar
- circuit boards
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
Landscapes
- Structure Of Printed Boards (AREA)
Description
図−１および図−２は本考案の一実施例に係る
回路基板積層構造体の展開斜視図および断面図、
図−３は本考案の他の実施例に係る回路基板積層
構造体の断面図である。
１１……回路フイルム、１２，１３……絶縁基
板、１４，１５……第一、第二のモールド回路基
板、１６……支柱、１６ａ……小径部、１７……
係合部、２１〜２３……第一ないし第三のモール
ド回路基板、２４……突起、２５……非貫通穴、
２６……絶縁基板、２７……回路フイルム。
1 and 2 are a developed perspective view and a sectional view of a circuit board laminated structure according to an embodiment of the present invention,
FIG. 3 is a sectional view of a circuit board laminated structure according to another embodiment of the present invention. DESCRIPTION OF SYMBOLS 11... Circuit film, 12, 13... Insulating substrate, 14, 15... First and second molded circuit boards, 16... Support column, 16a... Small diameter portion, 17...
Engaging portion, 21-23...first to third molded circuit board, 24...protrusion, 25...non-through hole,
26...Insulating substrate, 27...Circuit film.
Claims (1)
層した回路基板積層構造体において、各回路基板
がモールド回路基板よりなり、少なくとも一部の
モールド回路基板に他のモールド回路基板を支持
するための支柱が絶縁基板と一体にモールド成形
されていて、前記他のモールド回路基板にはその
支柱に係合する係合部が形成されていることを特
徴とする回路基板積層構造体。 In a circuit board laminated structure in which a plurality of circuit boards are stacked with intervals between them, each circuit board is made of a molded circuit board, and at least some of the molded circuit boards support other molded circuit boards. 1. A laminated circuit board structure, characterized in that the pillar is integrally molded with an insulating substrate, and the other molded circuit board is formed with an engaging portion that engages with the pillar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3954290U JPH04771U (en) | 1990-04-16 | 1990-04-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3954290U JPH04771U (en) | 1990-04-16 | 1990-04-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04771U true JPH04771U (en) | 1992-01-07 |
Family
ID=31548545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3954290U Pending JPH04771U (en) | 1990-04-16 | 1990-04-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04771U (en) |
-
1990
- 1990-04-16 JP JP3954290U patent/JPH04771U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH04771U (en) | ||
| JPH01169083U (en) | ||
| JPH03120084U (en) | ||
| JPH0217879U (en) | ||
| JPH02102628U (en) | ||
| JPS63120522U (en) | ||
| JPS6245860U (en) | ||
| JPS6339988U (en) | ||
| JPS6416686U (en) | ||
| JPS62168677U (en) | ||
| JPH044776U (en) | ||
| JPS62157011U (en) | ||
| JPH04774U (en) | ||
| JPH0183911U (en) | ||
| JPS6312853U (en) | ||
| JPS6357772U (en) | ||
| JPH01146570U (en) | ||
| JPS63114084U (en) | ||
| JPS58147437U (en) | assembly shelf | |
| JPH03124676U (en) | ||
| JPH0247838U (en) | ||
| JPS6291471U (en) | ||
| JPH03124677U (en) | ||
| JPH0193758U (en) | ||
| JPS6134740U (en) | Power transistor mounting structure |