JPH0477263U - - Google Patents
Info
- Publication number
- JPH0477263U JPH0477263U JP12090590U JP12090590U JPH0477263U JP H0477263 U JPH0477263 U JP H0477263U JP 12090590 U JP12090590 U JP 12090590U JP 12090590 U JP12090590 U JP 12090590U JP H0477263 U JPH0477263 U JP H0477263U
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- hole
- copper
- clad laminate
- glass cloth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims 1
Landscapes
- Multi-Conductor Connections (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂは本考案の一実施例の平面図及び
Ａ−Ａ′線断面図、第２図は従来のプラスチツク
ＰＧＡ用パツケージの一例の平面図である。
１……ガラス布エポキシ銅張積層板、２……キ
ヤビテイ、３……内部リード、４……スルーホー
ルのランド部、５……外部リード、６……銅配線
、７，１７……ランド配線引き出し部。
1A and 1B are a plan view and a sectional view taken along the line A-A' of an embodiment of the present invention, and FIG. 2 is a plan view of an example of a conventional plastic PGA package. 1...Glass cloth epoxy copper-clad laminate, 2...Cavity, 3...Internal lead, 4...Through hole land portion, 5...External lead, 6...Copper wiring, 7, 17...Land wiring Drawer section.
Claims (1)
スルーホールからの配線引き出し部を前記スルー
ホールを中心とし、銅配線の延長方向に長軸を持
つ長円形状に形成したことを特徴とするプラスチ
ツクＰＧＡ用パツケージ。 For plastic PGA, characterized in that the wiring lead-out portion from the through hole of the wiring pattern of the glass cloth epoxy copper clad laminate is formed into an oval shape with the through hole as the center and the long axis in the extending direction of the copper wiring. Packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12090590U JPH0477263U (en) | 1990-11-19 | 1990-11-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12090590U JPH0477263U (en) | 1990-11-19 | 1990-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0477263U true JPH0477263U (en) | 1992-07-06 |
Family
ID=31868787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12090590U Pending JPH0477263U (en) | 1990-11-19 | 1990-11-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0477263U (en) |
-
1990
- 1990-11-19 JP JP12090590U patent/JPH0477263U/ja active Pending
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