JPH0480084U - - Google Patents
Info
- Publication number
- JPH0480084U JPH0480084U JP12473690U JP12473690U JPH0480084U JP H0480084 U JPH0480084 U JP H0480084U JP 12473690 U JP12473690 U JP 12473690U JP 12473690 U JP12473690 U JP 12473690U JP H0480084 U JPH0480084 U JP H0480084U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- board
- array body
- pin array
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
第１図は本考案に係る回路基板の反り矯正装置
の一実施例を示す横断面図、第２図は本実施例で
用いる基板押圧具の要部分解斜視図、第３図は従
来の回路基板の反り矯正装置の横断面図である。
１……チエーンコンベア、２……矯正箇所、３
……回路基板、４……基板押え具、５……基板押
圧具、６……センターピン列体、６ａ……ピンホ
ルダー、６ｂ……ピン、７……押圧用昇降体、８
……サイドピン列体、８ａ……ピンホルダー、８
ｂ……ピン、８ｃ……補助板、８ｄ……長孔、９
……ベース板。
Fig. 1 is a cross-sectional view showing an embodiment of the circuit board warpage correction device according to the present invention, Fig. 2 is an exploded perspective view of the main parts of the board pressing tool used in this embodiment, and Fig. 3 is a conventional circuit. FIG. 2 is a cross-sectional view of the substrate warpage correction device. 1... Chain conveyor, 2... Correction location, 3
...Circuit board, 4... Board holding tool, 5... Board pressing tool, 6... Center pin array, 6a... Pin holder, 6b... Pin, 7... Lifting body for pressing, 8
...Side pin array body, 8a...Pin holder, 8
b...pin, 8c...auxiliary plate, 8d...long hole, 9
...Base board.
Claims (1)
で支えられて矯正箇所に搬送されて来た回路基板
の左右の上面を左右の基板押え具で押えた状態で
該矯正箇所の加熱雰囲気中で該回路基板を加熱し
つつその突出側の反り面を基板押圧具で押圧して
矯正する回路基板の反り矯正装置において、前記
基板押圧具はセンターピン列体と、その両側に配
置されたサイドピン列体とを備え、これらは共通
のベース板上に前記センターピン列体を固定とし
、前記サイドピン列体を前記センターピン列体と
の間隔を可変として載置され、前記ベース板はこ
れを昇降させる押圧用昇降体で支持された構造に
なつていることを特徴とする回路基板の反り矯正
装置。 The left and right lower surfaces of the circuit board are supported by the left and right conveyors in the conveyance direction, and the left and right upper surfaces of the circuit board are being conveyed to the correction area by the left and right board holders while being held in the heated atmosphere of the correction area. In a circuit board warping correction device that corrects a curved surface of a protruding side of a circuit board by pressing it with a board pressing tool while heating the circuit board, the board pressing tool includes a center pin row and side pin rows arranged on both sides thereof. The center pin array body is fixed on a common base plate, and the side pin array body is placed with a variable distance from the center pin array body, and the base plate lifts and lowers the side pin array body. A device for correcting warpage of a circuit board, characterized in that the device is supported by a lifting body for pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12473690U JPH0480084U (en) | 1990-11-27 | 1990-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12473690U JPH0480084U (en) | 1990-11-27 | 1990-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0480084U true JPH0480084U (en) | 1992-07-13 |
Family
ID=31872370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12473690U Pending JPH0480084U (en) | 1990-11-27 | 1990-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0480084U (en) |
-
1990
- 1990-11-27 JP JP12473690U patent/JPH0480084U/ja active Pending