JPH0480659U - - Google Patents

Info

Publication number
JPH0480659U
JPH0480659U JP12273490U JP12273490U JPH0480659U JP H0480659 U JPH0480659 U JP H0480659U JP 12273490 U JP12273490 U JP 12273490U JP 12273490 U JP12273490 U JP 12273490U JP H0480659 U JPH0480659 U JP H0480659U
Authority
JP
Japan
Prior art keywords
wiring board
pin
claws
support base
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12273490U
Other languages
English (en)
Other versions
JPH084210Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990122734U priority Critical patent/JPH084210Y2/ja
Publication of JPH0480659U publication Critical patent/JPH0480659U/ja
Application granted granted Critical
Publication of JPH084210Y2 publication Critical patent/JPH084210Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Description

【図面の簡単な説明】
第１図および第２図は本考案の一実施例を示し
ており、第１図は配線基板３に装着されたＩＣに
対して引抜部材と加熱ブロツクとを当接させた状
態を示す説明図、第２図は加熱ブロツクの構造を
示す拡大斜視図である。 １……ＩＣ、２……ピン、３……配線基板、４
……配線、５……開孔部、６……ランド部、７…
…半田、８……引抜部材、１０……支持基部、１
１……支軸部、１２……爪部、１３……操作アー
ム、１４……凹部、１５……付勢手段、１６……
加熱ブロツク、１７……ピン列、１８……溝、２
１……パツケージ。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 配線基板の開孔にピンを挿通して該ピンの
    突出側の配線基板上に設けられたランド部と上記
    ピンとを半田付けしたＩＣを上記配線基板から取
    り外すＩＣ抜取治具であつて、 パツケージと配線基板表面との間を拡開する方
    向に付勢されて挿入される爪部を有する引抜部材
    と、 上記ピンの突出側の配線基板に当接させる、複
    数のピン列をそれぞれ収容する溝部を備えた加熱
    ブロツクとからなるＩＣ抜取治具。 (2) 上記爪部は支持基部の両端に設けられた支
    軸部を中心に回動可能であり、付勢方向の回動終
    端においてＩＣのパツケージを上記爪部と支持基
    部とで保持可能であることを特徴とする請求項１
    記載のＩＣ抜取治具。
JP1990122734U 1990-11-22 1990-11-22 Ｉｃ抜取治具 Expired - Lifetime JPH084210Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990122734U JPH084210Y2 (ja) 1990-11-22 1990-11-22 Ｉｃ抜取治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990122734U JPH084210Y2 (ja) 1990-11-22 1990-11-22 Ｉｃ抜取治具

Publications (2)

Publication Number Publication Date
JPH0480659U true JPH0480659U (ja) 1992-07-14
JPH084210Y2 JPH084210Y2 (ja) 1996-02-07

Family

ID=31870490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990122734U Expired - Lifetime JPH084210Y2 (ja) 1990-11-22 1990-11-22 Ｉｃ抜取治具

Country Status (1)

Country Link
JP (1) JPH084210Y2 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5384174A (en) * 1976-12-30 1978-07-25 Oki Yunibatsuku Kk Method of drawing electronic part soldered from printed board and device therefor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5384174A (en) * 1976-12-30 1978-07-25 Oki Yunibatsuku Kk Method of drawing electronic part soldered from printed board and device therefor

Also Published As

Publication number Publication date
JPH084210Y2 (ja) 1996-02-07

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