JPH0481969U - - Google Patents
Info
- Publication number
- JPH0481969U JPH0481969U JP12754890U JP12754890U JPH0481969U JP H0481969 U JPH0481969 U JP H0481969U JP 12754890 U JP12754890 U JP 12754890U JP 12754890 U JP12754890 U JP 12754890U JP H0481969 U JPH0481969 U JP H0481969U
- Authority
- JP
- Japan
- Prior art keywords
- plating
- tool
- cylindrical sealing
- cylindrical
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 4
- 239000013013 elastic material Substances 0.000 claims 1
- 239000007921 spray Substances 0.000 claims 1
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
第１図は本考案の実施例を示す正面断面図であ
る。
１は被メツキ体、１′はメツキを必要とする被
メツキ体端面、２はゴム弾性体でできた円筒シー
ル具、６は円筒シール具２を保持する噴射具、４
はメツキ液を噴射するメツキ液噴射管、５はエア
を噴射するエア噴射管、７は円筒スール具２の内
径に配したリング状陽電極である。
第２図は従来の具体的実施例を示す正面図であ
る。ａは被メツキ体、ａ１，ａ２はメツキを必要
とする被メツキ体端面、ａ３はメツキを必要とし
ないマスキング処理部分である。
FIG. 1 is a front sectional view showing an embodiment of the present invention. 1 is a body to be plated, 1' is an end face of the body to be plated which requires plating, 2 is a cylindrical sealing tool made of a rubber elastic body, 6 is a spraying tool that holds the cylindrical sealing tool 2, and 4
5 is a plating liquid injection pipe for ejecting plating liquid, 5 is an air injection pipe for ejecting air, and 7 is a ring-shaped positive electrode disposed on the inner diameter of the cylindrical suture tool 2. FIG. 2 is a front view showing a specific conventional embodiment. a is the object to be plated, a 1 and a 2 are the end faces of the object to be plated that require plating, and a 3 is a masked portion that does not require plating.
Claims (1)
リング状陽電極を挿入して成る円筒シール具と、
この円筒シール具が回転せしめるようにベアリン
グを介して保持し、リング状陽電極に向けてメツ
キ液とエアを噴射する噴射具と、この噴射具を移
動させることで円筒シール具の円筒端面を被メツ
キ体の端面に軸方向に押し当てて被メツキ体を支
持し、さらに陰電極に接続させた被メツキ体と円
筒シール具を回転せしめる支持具を備え、この円
筒シール具の内径に挿入しているリング状陽電極
と被メツキ体の間にメツキ液を噴射して通電させ
ることにより、円筒シール具で囲まれた部分にの
みメツキを行い、メツキ終了後はエアを噴射して
、滞留したメツキ液を除くことを特徴とする部分
メツキ装置。 A cylindrical sealing device made of a rubber elastic material and having a cylindrical shape and having a ring-shaped positive electrode inserted into its inner diameter;
This cylindrical sealing tool is held via a bearing so as to rotate, and there is a spraying tool that sprays plating liquid and air toward the ring-shaped positive electrode, and a spraying tool that moves the spraying tool to cover the cylindrical end face of the cylindrical sealing tool. The object to be plated is supported by pressing it in the axial direction against the end face of the plating body, and a support is provided to rotate the body to be plated connected to the negative electrode and the cylindrical sealing tool, and the support tool is inserted into the inner diameter of the cylindrical sealing tool. By injecting plating liquid and energizing between the ring-shaped positive electrode and the object to be plated, plating is performed only in the area surrounded by the cylindrical sealing tool. After plating, air is injected to remove the accumulated plating. A partial plating device characterized by removing liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12754890U JPH0481969U (en) | 1990-11-28 | 1990-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12754890U JPH0481969U (en) | 1990-11-28 | 1990-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0481969U true JPH0481969U (en) | 1992-07-16 |
Family
ID=31875042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12754890U Pending JPH0481969U (en) | 1990-11-28 | 1990-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0481969U (en) |
-
1990
- 1990-11-28 JP JP12754890U patent/JPH0481969U/ja active Pending
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