JPH048291U

JPH048291U -

Info

Publication number: JPH048291U
Application number: JP4666290U
Authority: JP
Priority date: 1990-05-02
Filing date: 1990-05-02
Publication date: 1992-01-24

Description

[Brief explanation of the drawing]

第１図は本考案の実施例を示すＩＣソケツトの
構造を示す断面図、第２図はＩＣ及びＥＭＩ対策
部品の実装状態を示す断面図、第３図は従来のＥ
ＭＩ対策部品の実装状態を示す図、第４図は従来
の他のＥＭＩ対策部品の実装状態を示す図である
。１０……ＩＣソケツト、１１……絶縁本体、１
２……隔壁、１３……突出壁、１４……突出外壁
、１５……深い凹所、１６……浅い凹所、１７…
…バネ性を有する接触ピン、１７ａ，１８ａ，１
８ｂ……バネ性を有する接触部、１７ｂ……導出
部、１８……接触子、１８ｃ……立ち上がり部、
１９……覆い部、２０……ＩＣ、２１……ピン、
２２……ＥＭＩ対策部品、２２ａ……一方の極、
２２ｂ……他方の極、３０……プリント基板、３
１……スルーホール、３２……半田。 Fig. 1 is a sectional view showing the structure of an IC socket according to an embodiment of the present invention, Fig. 2 is a sectional view showing the mounting state of the IC and EMI countermeasure components, and Fig. 3 is a sectional view of the conventional EMI socket.
FIG. 4 is a diagram showing the mounting state of the MI countermeasure component, and FIG. 4 is a diagram showing the mounting state of another conventional EMI countermeasure component. 10...IC socket, 11...Insulation body, 1
2... Partition wall, 13... Projecting wall, 14... Projecting outer wall, 15... Deep recess, 16... Shallow recess, 17...
...Contact pins with spring properties, 17a, 18a, 1
8b...Contact part having spring properties, 17b...Leading part, 18...Contactor, 18c...Rising part,
19...cover part, 20...IC, 21...pin,
22...EMI countermeasure component, 22a...one pole,
22b...other pole, 30...printed circuit board, 3
1...Through hole, 32...Solder.

Claims

[Scope of Claim for Utility Model Registration] In the IC socket mounted on the board, (a) the contact part with the IC pin fixed above the insulating body and mounted, and one pole of the chip-type electromagnetic radiation noise suppression component; (b) a contact element having a spring property and having a contact portion with the insulating body;
(c) a contact pin having a spring property having a contact portion with the other pole of the countermeasure component and a lead-out portion connected to a pattern on the board; (c) an IC mounted above the countermeasure component mounted below the insulating body; The structure of an IC socket that implements.