JPH0483395A - Thermal controller - Google Patents
Thermal controllerInfo
- Publication number
- JPH0483395A JPH0483395A JP19609090A JP19609090A JPH0483395A JP H0483395 A JPH0483395 A JP H0483395A JP 19609090 A JP19609090 A JP 19609090A JP 19609090 A JP19609090 A JP 19609090A JP H0483395 A JPH0483395 A JP H0483395A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- generator
- base
- wick
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】 [産業上の利用分野] 本発明は高発熱物の熱制御装置に関するものである。[Detailed description of the invention] [Industrial application field] The present invention relates to a heat control device for high-heat generating materials.
[従来の技術]
近年、電子機器の小型化が進み、これに伴い機器の発熱
密度が向上している。このため、発生する熱を機器外に
効率よく逃がす手段が必要とされる。これを解決する手
段としてヒートパイプによる熱輸送方法がある。[Background Art] In recent years, electronic devices have become smaller and the heat density of the devices has increased accordingly. Therefore, a means is needed to efficiently release the generated heat to the outside of the device. As a means to solve this problem, there is a heat transport method using a heat pipe.
ヒートパイプAによる一般的な排熱の方法は、第3図に
示す通りである。同図中、1は発熱物、2は発熱物1の
実装基!1〜3はヒートパイプ本体で内部に狭い間隙を
有するウィック4を内式りする中空状のパイプであり、
内部に冷媒液が含浸されたものである。5は放熱部であ
り、発熱物1で発生した熱は基盤2を介してヒートパイ
プ本体3の左端3aに達する。冷媒液は左端3aにおい
て、この熱で気化し、気体の状態でヒートパイプ本体3
内を通って右@3bに達し、熱は放熱部5に伝えられ外
部に放散される。熱を奪われた結果気化冷媒液は液化し
ウィック4の狭い間隙による毛細管現象により再びヒー
トパイプ本体3左端3aに達する。ヒートパイプ本体3
による排熱は、ヒートパイプ本体3内の熱抵抗が低く極
めて熱輸送効率に優れたものである。A general method of exhausting heat using heat pipe A is as shown in FIG. In the figure, 1 is a heating element, and 2 is a mounting base for the heating element 1! 1 to 3 are heat pipe bodies, which are hollow pipes in which a wick 4 having a narrow gap is inserted;
The inside is impregnated with refrigerant liquid. Reference numeral 5 denotes a heat dissipation section, in which heat generated by the heating element 1 reaches the left end 3a of the heat pipe main body 3 via the base 2. The refrigerant liquid is vaporized by this heat at the left end 3a, and is transferred to the heat pipe main body 3 in a gaseous state.
The heat passes through the inside and reaches the right side @3b, and is transmitted to the heat radiation section 5 and radiated to the outside. As a result of the heat removed, the vaporized refrigerant liquid liquefies and reaches the left end 3a of the heat pipe main body 3 again due to capillary action due to the narrow gap of the wick 4. Heat pipe body 3
The heat discharged by the heat pipe body 3 has low thermal resistance and has extremely high heat transport efficiency.
[発明が解決しようとする課題]
しかし、このような特徴を有するし−トパイプAであっ
ても、発熱物1は基盤2等を通じてヒートパイプ本体3
に接合されている為、基盤2自身の熱伝導度、基盤2の
接触抵抗が存する為、発熱物1とヒートパイプ本体3間
の熱抵抗が大きくなりヒートパイプAの特長を充分に活
かせないという欠点がある。[Problems to be Solved by the Invention] However, even with the heat pipe A having such characteristics, the heating element 1 is not connected to the heat pipe main body 3 through the base 2 or the like.
Since the base 2 has its own thermal conductivity and the contact resistance of the base 2 exists, the thermal resistance between the heating element 1 and the heat pipe body 3 increases, making it impossible to fully utilize the features of the heat pipe A. There are drawbacks.
当該欠点を解決するため、無底筺体をヒートパイプ化し
た所謂無底ヒート筺体内に発熱物自体を収納した熱制御
装置Bの例を第4図に示す、第4図は米国特許第4.0
47.198号の実施例を示したものである。同図中、
6は発熱物で1発熱要素6aを実装した基W17からな
り、8は無底ヒート筺体、9はヒート筺体8内ウイツク
、10はウィック11を内張すした平板形ヒートパイプ
、12は無底ヒート筺体8を載着した平板形ヒートパイ
プ10の取付は台である。ウィック9は発熱要素6aお
よび基盤7にも接して取り付けられている0発熱要素6
aから発生する熱は直接冷媒液の蒸発潜熱によってビー
ト筺体8内面に輸送され、ヒート筺体8外面より外部へ
、および基盤7を経由して平板形ヒートパイプ10内全
面にウィック11の作用で拡散されて取付は台12より
外部へ放熱される。このような構造となっているため、
発熱物6とウィック9間の熱抵抗を極めて低くできる。In order to solve this drawback, an example of a thermal control device B in which the heat generating material itself is housed in a so-called bottomless heat casing in which the bottomless casing is converted into a heat pipe is shown in FIG. 4. 0
This is an example of No. 47.198. In the same figure,
Reference numeral 6 is a heat generating element, which consists of a base W17 on which one heat generating element 6a is mounted, 8 is a bottomless heat casing, 9 is a wick inside the heat casing 8, 10 is a flat heat pipe lined with a wick 11, and 12 is a bottomless heat pipe. The flat heat pipe 10 on which the heat housing 8 is mounted is mounted on a stand. The wick 9 is attached to the heat generating element 6 which is also attached in contact with the heat generating element 6a and the base 7.
The heat generated from a is directly transported to the inner surface of the beat housing 8 by the latent heat of evaporation of the refrigerant liquid, and is diffused from the outer surface of the heat housing 8 to the outside and via the base 7 to the entire inside of the flat heat pipe 10 by the action of the wick 11. When mounted, heat is radiated from the base 12 to the outside. Due to this structure,
The thermal resistance between the heating element 6 and the wick 9 can be made extremely low.
ところで、一般に放熱面は制約されることが多く、たと
えば取付は台12のみが放熱部となる場合では、基盤7
の寸法が大きくなったり、数が増加すると、発生熱量は
蒸気が#111できる面積が減少するため、潜熱による
熱輸送は十分できす、基盤7を経由して放熱するように
なる。しかし、基盤7は熱伝導性が低く接触熱抵抗が高
いため、このように放熱に面積が十分に取れないために
放熱が不十分という欠点があった。By the way, in general, the heat radiation surface is often restricted. For example, when mounting the base 12 as the only heat radiation part, the base 7
When the size of the heat exchanger becomes larger or the number of heat exchangers increases, the amount of heat generated decreases in the area where steam can flow, so heat transport by latent heat is not sufficient, and the heat is radiated via the base plate 7. However, since the base plate 7 has low thermal conductivity and high contact thermal resistance, there is a drawback that heat radiation is insufficient because there is not enough area for heat radiation.
こ1において、本発明は、従来の発明の欠点に鑑み、発
熱物の取りつけ面の熱的な有効面積を最大限利用できる
ようにした熱制御装置を提供せんとするものである。In view of the shortcomings of the conventional inventions, the present invention aims to provide a thermal control device that makes maximum use of the thermally effective area of the mounting surface of the heat generating element.
1課題を解決するための手段]
前記課題の解決は、本発明が次の特徴的構成手段を採用
することにより達成される。Means for Solving 1 Problem] The above problem is achieved by the present invention employing the following characteristic configuration means.
即ち、本発明の特徴は、取付は台上に載着した無底ヒー
ト筺体の所望内面に発熱物を装着するとともに当該発熱
物を被包して前記筺体および前記筺体内取付は台上面全
域に亙り冷IIX液を含浸するウィックを内張すしてな
る熱制御装置である。That is, the feature of the present invention is that the heating element is attached to the desired inner surface of the bottomless heat casing placed on the table, and the heating element is encapsulated, and the installation of the casing and the inside of the casing is carried out over the entire top surface of the table. This is a thermal control device lined with a wick impregnated with cold liquid IIX.
[作 用]
本発明は前記のような手段を講じ、発熱物を内面に装着
する無底ヒート筺体と、該ヒート筺体を固定すると共に
発熱物から発生した熱を外部に放散させる取付は台と、
前記し−ト筺体内面に内張すしたウィック及びウィック
に含浸させた冷媒液からなり、該ウィックが発熱物に接
するようにし、該発熱物から発生する熱を冷媒液の蒸発
潜熱によって奪い、前記取付は台との接触面まで蒸気に
よって熱輸送し、排熱する。[Function] The present invention takes the above-mentioned measures, and includes a bottomless heat casing in which a heat generating material is mounted on the inner surface, and a mounting base that fixes the heat casing and radiates heat generated from the heat generating material to the outside. ,
The wick is made up of a wick lined on the inner surface of the casing and a refrigerant liquid impregnated into the wick, and the wick is brought into contact with a heat generating substance, and the heat generated from the heat generating substance is removed by the latent heat of vaporization of the refrigerant liquid. When installing, heat is transported by steam to the contact surface with the table and the heat is exhausted.
口実腫例〕 本発明の実施例を図面について説明する。Excuse tumor case] Embodiments of the present invention will be described with reference to the drawings.
第1図は本実施例の平面図、第2図は第1図■−■線視
断面図である0図中の番号は、第4図と同一のものにつ
いては同一の番号を付けた。FIG. 1 is a plan view of this embodiment, and FIG. 2 is a sectional view taken along the line ■--■ in FIG. 1. The same numbers in FIG. 0 are given to the same parts as in FIG.
同図において、Cは本実施例の熱制御装置、13は取付
は台14上に一体載着した無底ヒート筺体、15は発熱
物6を被包して筺体13および筺体13内取付は台14
1面全域に亙り内張すしたウィック、16はヒート筺体
13の取付はリムである。In the same figure, C is the heat control device of this embodiment, 13 is a bottomless heat casing that is mounted integrally on a stand 14, 15 is a bottomless heat casing that encloses a heating element 6, and is mounted inside the casing 13 and is mounted on a pedestal. 14
A wick is lined over the entire surface, and 16 is a rim to which the heat housing 13 is attached.
本実施例はこのようなn様を呈するので、発熱物6から
の発熱は発熱物6に接するウィック15の吸熱部15a
に含まれる冷媒液が蒸発するとき蒸発潜熱として蒸気に
取り込まれ、取付は台14に伝えられ、取付は台14か
ら外部へ放熱される。Since this embodiment exhibits such an n-like shape, the heat generated from the heating element 6 is absorbed by the heat absorbing portion 15a of the wick 15 that is in contact with the heating element 6.
When the refrigerant liquid contained in the refrigerant liquid evaporates, it is taken into the vapor as latent heat of vaporization, which is transmitted to the base 14, and the heat is radiated from the base 14 to the outside.
取付は台14は発熱物6の温度より低いために蒸気はそ
こで液体に相変化し、輸送してきた熱量をt線熱として
辷−ト筺体13に伝熱するので再び液体となってウィッ
ク15内を毛細管作用により連続的に吸熱部15aへと
循環する。During installation, since the temperature of the stand 14 is lower than that of the heating element 6, the vapor changes its phase to a liquid there, and the transferred heat is transferred to the sleeve case 13 as T-ray heat, so it becomes a liquid again and flows inside the wick 15. is continuously circulated to the heat absorption section 15a by capillary action.
[発明の効果]
かくして、本発明は、発熱物で発生した熱を効率よく取
付は台まで熱輸送することが可能になるため、従来技術
よりも格段に発熱物温度を低くすることができる。した
がって、高密度実装化した発熱量の大きな場合にも温度
制御が可能となるとともに、発熱が大きくなる出方の大
きい電子機器が実現できる。[Effects of the Invention] Thus, according to the present invention, the heat generated by the heat generating material can be efficiently transported to the mounting base, so that the temperature of the heat generating material can be made much lower than in the prior art. Therefore, temperature control is possible even in the case of high-density packaging and a large amount of heat generation, and an electronic device that generates a large amount of heat can be realized.
なお、本実施例では発熱物が一つの場合について示した
が、複数の場合でも同様の効果が得られる。又、発熱物
の装着面は上部に限定されるわけではなく、側部内面で
もよい、さらに、取付は台の熱放散効率を高めるため取
付は舎内部にヒートパイプを収容することもできる。Note that although the present example shows the case where there is one heating element, the same effect can be obtained even when there is a plurality of heating elements. Further, the mounting surface of the heat generating material is not limited to the upper part, but may be the inner surface of the side.Furthermore, a heat pipe can be mounted inside the building to improve the heat dissipation efficiency of the stand.
第1図は本発明の実施例を示す平面図、第2図は第1図
■−■線視断面図、第3図乃至第4図は従来例のビート
パイプおよび熱制御装置のそれぞれ構造説明図である。
A・・・ヒートパイプ B、C・・・熱制御装置1
.6・・・発熱物 2,7・・・基盤3・・・パ
イプ本体
4.9,11.15・・・ウィック
5・・・放熱部 6a・・・発熱要素8.1
3・・・無底ヒート筺体
10・・・平板形ヒートパイプFig. 1 is a plan view showing an embodiment of the present invention, Fig. 2 is a sectional view taken along the line ■-■ in Fig. 1, and Figs. 3 and 4 are structural explanations of a conventional beat pipe and a heat control device, respectively. It is a diagram. A...Heat pipe B, C...Heat control device 1
.. 6... Heating material 2, 7... Base 3... Pipe body 4.9, 11.15... Wick 5... Heat radiation part 6a... Heat generating element 8.1
3... Bottomless heat housing 10... Flat plate heat pipe
Claims (1)
面に発熱物を装着するとともに当該発熱物を被包して前
記筺体および前記筺体内取付け台上面全域に亙り冷媒液
を含浸するウイックを内張りしたことを特徴とする熱制
御装置1. A heating element is attached to a desired inner surface of a bottomless heat casing that is integrally mounted on a mounting base, and a wick that encloses the heating element and impregnates a refrigerant liquid over the entire upper surface of the casing and the mount inside the housing is lined. A thermal control device characterized by
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19609090A JPH0483395A (en) | 1990-07-26 | 1990-07-26 | Thermal controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19609090A JPH0483395A (en) | 1990-07-26 | 1990-07-26 | Thermal controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0483395A true JPH0483395A (en) | 1992-03-17 |
Family
ID=16352047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19609090A Pending JPH0483395A (en) | 1990-07-26 | 1990-07-26 | Thermal controller |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0483395A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6247525B1 (en) | 1997-03-20 | 2001-06-19 | Georgia Tech Research Corporation | Vibration induced atomizers |
| US6317321B1 (en) * | 1994-11-04 | 2001-11-13 | Compaq Computer Corporation | Lap-top enclosure having surface coated with heat-absorbing phase-change material |
-
1990
- 1990-07-26 JP JP19609090A patent/JPH0483395A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6317321B1 (en) * | 1994-11-04 | 2001-11-13 | Compaq Computer Corporation | Lap-top enclosure having surface coated with heat-absorbing phase-change material |
| US6247525B1 (en) | 1997-03-20 | 2001-06-19 | Georgia Tech Research Corporation | Vibration induced atomizers |
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