JPH0484635A - Terminal forming equipment for electronic components - Google Patents
Terminal forming equipment for electronic componentsInfo
- Publication number
- JPH0484635A JPH0484635A JP2197225A JP19722590A JPH0484635A JP H0484635 A JPH0484635 A JP H0484635A JP 2197225 A JP2197225 A JP 2197225A JP 19722590 A JP19722590 A JP 19722590A JP H0484635 A JPH0484635 A JP H0484635A
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- die
- electronic component
- terminal
- cam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Wire Processing (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、リード端子を有する多品種の電子部品を、プ
リント基板への面実装用にリード端子を成形する電子部
品の端子成形装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a terminal forming apparatus for electronic components that forms lead terminals for surface mounting of various types of electronic components having lead terminals onto printed circuit boards. .
従来の技術
リード端子を有する電子部品を面実装用に端子２ ペー
ジ
成形する際には、第５図（２Ｌ） 、 （ｂ）に示すよ
うに、電子部品１の外径寸法に応じてリード端子１ａの
成形がなされていた。Conventional technology When molding electronic components with lead terminals for surface mounting, the lead terminals are formed according to the outer diameter of the electronic component 1, as shown in FIG. 5 (2L) and (b). 1a was being molded.
すなわち、第６図（’Ｌ） 、 （ｂ）、第７図（ａ）
、Φ）は、外形の異なる電子部品の端子成形の過程を示
す図である。図において、１は電子部品、１２Ｌはその
端子、３は電子部品１のリード端子部１ａの押え、５は
ポンチ、６はカッター、１０はダイを示す。That is, Fig. 6('L), (b), Fig. 7(a)
, Φ) are diagrams showing the process of forming terminals of electronic components having different external shapes. In the figure, 1 is an electronic component, 12L is its terminal, 3 is a holder for the lead terminal portion 1a of the electronic component 1, 5 is a punch, 6 is a cutter, and 10 is a die.
発明が解決しようとする課題
外形が異なる電子部品１を成形する際には、第６図、第
７図に示すように、電子部品１の外径寸法に応じて、ダ
イ１０の寸法も変わるため、各品種専用の成形金型が必
要となるものであった。Problem to be Solved by the Invention When molding electronic components 1 having different external shapes, the dimensions of the die 10 change depending on the outer diameter of the electronic component 1, as shown in FIGS. 6 and 7. , which required molding molds specifically for each type.
本発明は、このような課題に鑑み、成形金型の寸法を成
形する電子部品に応じて可変できる電子部品の端子成形
装置を提供するものである。In view of these problems, the present invention provides an apparatus for forming a terminal for an electronic component in which the dimensions of a molding die can be varied depending on the electronic component to be molded.
課題を解決するための手段
この課題を解決するために、本発明の技術的手段は、電
子部品を定位置に固定する保持力と、端子成形の際に設
定位置捷で上下動可能なダイとポ３ ヘ−ノ
ンチ及び成形後のリード端子を定寸法に切断するカッタ
ーから構成されている。Means for Solving the Problem In order to solve this problem, the technical means of the present invention provides a holding force for fixing electronic components in a fixed position, and a die that can be moved up and down depending on the set position during terminal molding. Port 3 Consists of a hench and a cutter that cuts the molded lead terminal into a fixed size.
作用 この技術的手段による作用は次のようになる。action The effect of this technical means is as follows.
すなわち、端子成形される電子部品は、部品本体側のリ
ード端子部を固定保持され、ダイか電子部品の外径に応
じた定位置まで上昇する。ダイか上昇後にポンチが電子
部品のリード端子底部がダイ上面に接するまで下降し、
ポンチが下降終了後、カッターが下降し、リード端子先
端を切断する。That is, the electronic component to be terminal-molded is fixedly held at the lead terminal portion on the component body side, and the die is raised to a fixed position according to the outer diameter of the electronic component. After the die rises, the punch descends until the bottom of the lead terminal of the electronic component touches the top of the die.
After the punch finishes descending, the cutter descends and cuts off the tip of the lead terminal.
この構成によって電子部品のリード端子部を面実装用に
成形することができる。With this configuration, the lead terminal portion of the electronic component can be molded for surface mounting.
実施例
以下、本発明の一実施例について図面を参照しながら説
明する。第１図および第２図は本発明の一実施例におけ
る電子部品の端子成形装置の全体図、第３図（８Ｌ）〜
（Ｃ）、第４図（２Ｌ）〜（Ｃ）は、外形の異なる電子
部品の端子成形の過程を示すものである。EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings. FIGS. 1 and 2 are general views of a terminal forming apparatus for electronic components according to an embodiment of the present invention, and FIGS. 3 (8L) to
4(C) and FIGS. 4(2L) to 4(C) show the process of forming terminals of electronic components having different external shapes.
第１図〜第４図において、１は電子部品、１ａはそのリ
ード端子、２は電子部品１のリード端子１ａの受け、３
は電子部品１のリード端子１ａを固定保持するだめの押
え、４は押え３に荷重を与えるバネ、５は端子成形部と
しての上型ポンチ、６はカッター、７は上型ポンチ５を
取り付けがつカッター６が上下動するように保持する上
型ブロック、８はカッター６に上下動作を与えるエアシ
リンダ、ｅＶｒ上型上型ブロック上下動作を与えるエア
シリンダ、１０は端子成形部としての下型ダイ、１１は
下型ダイ１０が取り付けられる下型ブロック、１２は下
型ブロック１１に取り付けられたカムフォロア、１３は
カムフォロア１２を介して下型ブロック１１に上下動作
を与えるためのカム、１４はカム１３のカム軸、１６お
よび１６はカム軸１４を受けるベアリング、１７は上型
ブロック７および下型ブロック１１が定位置全上下動さ
せるだめのシャフト、１８および１９はシャフト１７を
受けるベアリング、２０はカム軸１４［取υ付けられた
歯車、２１はカム軸１４に回転を与えるだめのパルスモ
ータ、２２はパルスモータ２１に取シ付けられ歯車２０
とかみあう歯車、２３はフレーム、２４は端子切断クズ
用シュートを示す。In FIGS. 1 to 4, 1 is an electronic component, 1a is its lead terminal, 2 is a receiver for the lead terminal 1a of the electronic component 1, and 3
4 is a spring that applies a load to the presser foot 3, 5 is an upper die punch as a terminal forming part, 6 is a cutter, and 7 is a place where the upper die punch 5 is attached. An upper mold block that holds the cutter 6 so that it can move up and down; 8 an air cylinder that allows the cutter 6 to move up and down; an air cylinder that allows the eVr upper mold upper block to move up and down; 10 a lower die that serves as a terminal forming section; , 11 is a lower die block to which the lower die 10 is attached, 12 is a cam follower attached to the lower die block 11, 13 is a cam for giving vertical movement to the lower die block 11 via the cam follower 12, and 14 is a cam 13. 16 and 16 are bearings that receive the camshaft 14, 17 is a shaft that allows the upper mold block 7 and lower mold block 11 to move up and down in fixed positions, 18 and 19 are bearings that receive the shaft 17, and 20 is a cam A gear 20 is attached to the shaft 14, 21 is a pulse motor that rotates the camshaft 14, and 22 is a gear 20 attached to the pulse motor 21.
23 is a frame, and 24 is a chute for cutting off terminals.
次に本発明の動作について説明する。Next, the operation of the present invention will be explained.
電子部品１のリード端子部１ａは、受け２と押え３によ
って固定保持される。次にパルスモータ２１が回転し歯
車２２、および歯車２２を介してカム軸１４およびカム
１３を所定の角度まで回転させる。このカム１３の回転
により下型ブロック１１がカムフォロア１２を介して上
昇し、第３図（ｂ）、第４図Ｃｂ）ＶＣ示すように下型
ダイ１Ｑが電子部品１の外径に応じた定位置まで上昇す
る。下型ダイ１０の上昇後、エアシリンダー９により上
型ブロックが押し下げられ、上型ポンチ５が電子部品１
のリード端子１ａの底部が下型ダイ１ｏの上面に接する
まで下降してリード端子１ａを折曲して成形する。上型
ポンチ５が下降終了後、エアシリンダー８がカッター６
を押し下げ、第３図（Ｃ）、第４図（Ｃ１に示すように
、υ〜ド端子１ａの先端をカックーロが切断する。以上
の動作によって電子部品１のリード端子部１１Ｌを面実
装用に成形することができる。The lead terminal portion 1a of the electronic component 1 is fixedly held by a receiver 2 and a presser foot 3. Next, the pulse motor 21 rotates to rotate the gear 22 and, via the gear 22, the camshaft 14 and the cam 13 to a predetermined angle. This rotation of the cam 13 causes the lower mold block 11 to rise via the cam follower 12, and the lower mold die 1Q moves to a fixed position according to the outer diameter of the electronic component 1, as shown in FIGS. rise to position. After the lower die 10 rises, the upper die block is pushed down by the air cylinder 9, and the upper die punch 5 punches the electronic component 1.
The lower die 1o is lowered until the bottom of the lead terminal 1a comes into contact with the upper surface of the lower die 1o, and the lead terminal 1a is bent and molded. After the upper punch 5 finishes descending, the air cylinder 8 moves the cutter 6
As shown in Figures 3 (C) and 4 (C1), the Kakuro cuts the tip of the υ~ terminal 1a. Through the above operations, the lead terminal part 11L of the electronic component 1 is made for surface mounting. Can be molded.
発明の効果
以上のように本発明によれば、成形金型の寸法を部品に
応じて設定できるため、多品種の電子部品の端子成形が
一つの装置で可能となシ、その実用効果は大なるものが
ある。Effects of the Invention As described above, according to the present invention, since the dimensions of the molding die can be set according to the parts, it is possible to mold terminals of a wide variety of electronic parts with one device, and its practical effects are great. There is something.
第１図は本発明の電子部品の端子膜形装置の一実施例の
斜視図、第２図は要部側面図、第３図（ａ）す説明図、
第６図＜ａ＞ 、 （ｂ＞ 、第−ｒ ｒａ＜ａ＞ １
（ｂ）は従来の端子成形動作を示す説明図である。
１・・・・・・電子部品、１ａ・・・・・・リード端子
、２・・・・・・受け、３・・・・・・押え、４・・・
・・・バネ、６・・・・・・上型ポンチ、ｅ・・・・・
・カッター、７・川・・上型ブロック、８・・・・・・
エアシリンダー、９・・・・・・エアシリンダー、１０
・・・・・・下型ダイ、１１・・・・・・下型ブロック
、１２・・・・・・カムツボロア、１３・・・・・・カ
ム、１４・・・・・・カム軸、１５・・・・・・ベアリ
ング、１６・・・・・・ベアリング、１７・・・・・・
シャフト、１８・・・・・・ベアリング、１９・・・・
・・ベア１１ング、２０・・・・・・歯車、２１・・・
・・・パルスモータ、７ ・＼
２２・・・・・・歯車、
２３・・・・・・フレーム、
２４・・・・・・ンユ
一ト。Fig. 1 is a perspective view of an embodiment of the terminal film type device for electronic components of the present invention, Fig. 2 is a side view of the main part, Fig. 3(a) is an explanatory view,
Figure 6 <a>, (b>, -r ra<a> 1)
(b) is an explanatory diagram showing a conventional terminal forming operation. 1...Electronic component, 1a...Lead terminal, 2...Receiver, 3...Presser, 4...
...Spring, 6...Upper punch, e...
・Cutter, 7・River...Upper die block, 8...
Air cylinder, 9...Air cylinder, 10
...Lower die, 11...Lower die block, 12...Cam tube lower, 13...Cam, 14...Cam shaft, 15 ...Bearing, 16...Bearing, 17...
Shaft, 18...Bearing, 19...
...bearing 11, 20...gear, 21...
...Pulse motor, 7 ・＼ 22 ... Gear, 23 ... Frame, 24 ... Unit.
Claims (1)
ブロックを取り付け、上型ブロックには、ポンチと上下
に摺動可能なカッターを設け、このポンチと相対向して
下型ブロックに下型ダイを設け、この下型ダイを上下動
させるために、下型ブロックの下方にカムフォロアを取
り付け、このカムフォロアと接するように回転可能な上
下動を与えるカムを設けた電子部品の端子成形装置。An upper die block and a lower die block are attached via a shaft so as to be able to slide up and down, and the upper die block is equipped with a punch and a cutter that is slidable up and down. This terminal molding device for electronic components is provided with a mold die, a cam follower is attached below the lower mold block in order to move the lower mold die up and down, and a cam that is rotatable and provides vertical movement is provided in contact with the cam follower.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19722590A JP2870147B2 (en) | 1990-07-25 | 1990-07-25 | Terminal forming equipment for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19722590A JP2870147B2 (en) | 1990-07-25 | 1990-07-25 | Terminal forming equipment for electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0484635A true JPH0484635A (en) | 1992-03-17 |
| JP2870147B2 JP2870147B2 (en) | 1999-03-10 |
Family
ID=16370923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19722590A Expired - Fee Related JP2870147B2 (en) | 1990-07-25 | 1990-07-25 | Terminal forming equipment for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2870147B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102737862A (en) * | 2012-06-30 | 2012-10-17 | 江苏云意电气股份有限公司 | Automatic shearing shaper for capacitor |
| WO2017219436A1 (en) * | 2016-06-20 | 2017-12-28 | 无锡鼎茂机械制造有限公司 | Electronic element cutting device with excellent fixing performance |
-
1990
- 1990-07-25 JP JP19722590A patent/JP2870147B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102737862A (en) * | 2012-06-30 | 2012-10-17 | 江苏云意电气股份有限公司 | Automatic shearing shaper for capacitor |
| WO2017219436A1 (en) * | 2016-06-20 | 2017-12-28 | 无锡鼎茂机械制造有限公司 | Electronic element cutting device with excellent fixing performance |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2870147B2 (en) | 1999-03-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |