JPH0485741U - - Google Patents
Info
- Publication number
- JPH0485741U JPH0485741U JP12647290U JP12647290U JPH0485741U JP H0485741 U JPH0485741 U JP H0485741U JP 12647290 U JP12647290 U JP 12647290U JP 12647290 U JP12647290 U JP 12647290U JP H0485741 U JPH0485741 U JP H0485741U
- Authority
- JP
- Japan
- Prior art keywords
- engaging
- solder coating
- lead frame
- pressing
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 210000000078 claw Anatomy 0.000 claims description 5
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図〜第３図はこの考案の一実施例を示すも
ので、第１図ａ，ｂは電子部品の保持装置の形状
を示す正面図と側面図、第２図は電子部品の形状
を拡大して示す斜視図、第３図ａ，ｂは電子部品
のはんだ被覆装置の概略の構成を示す平面図と側
面図、第４図〜第６図は、第１図の動作を示す正
面図である。
図中、１は電子部品、２はリード線、３はリー
ドフレーム、４は係合部、１１は係合装置、１２
はチエーン体、１３はピン、１４は圧縮ばね、１
６は押圧具、１７は台座、１８は係合爪、２２は
押圧片、２５は第１の係合体、２６は第２の係合
体、４１ははんだ被覆装置である。
Figures 1 to 3 show an embodiment of this invention. Figures 1a and b are front and side views showing the shape of the electronic component holding device, and Figure 2 shows the shape of the electronic component. FIGS. 3a and 3b are plan views and side views showing the general structure of the solder coating device for electronic components; FIGS. 4 to 6 are front views showing the operation of FIG. 1; FIGS. It is. In the figure, 1 is an electronic component, 2 is a lead wire, 3 is a lead frame, 4 is an engagement part, 11 is an engagement device, 12
is a chain body, 13 is a pin, 14 is a compression spring, 1
6 is a pressing tool, 17 is a base, 18 is an engaging claw, 22 is a pressing piece, 25 is a first engaging body, 26 is a second engaging body, and 41 is a solder coating device.
Claims (1)
したリードフレームの両端に形成した係合部をガ
イドレールに沿つて走行する一対のチエーン体に
形成された係合爪に係合してはんだ被覆を行うは
んだ被覆装置であつて、前記各チエーン体を構成
するピンを上下動可能で長尺状に形成し、かつこ
のピンを常時上方へ保持するように設けた圧縮ば
ねと、前記ピンの下端部に固着した台座と、この
台座の下方に前記リードフレムの前記係合部に係
合する回動可能の係合爪と、前記台座の上部に前
記係合爪によつて前記係合部が係合された電子部
品の上面を押圧する回動可能の押圧片とを前記一
対のチエーン体に対向してそれぞれ設けた係合装
置と；一方、前記ピンを押圧して下降させる押圧
具と、この押圧具の駆動で前記ピンを下降させる
ことにより前記係合爪を回動せしめて前記リード
フレームの係合を離脱させる上下動可能の第１の
係合体と、前記ピンの下降により前記押圧片を回
動せしめて前記電子部品の上面の押圧の解除を行
う第２の係合体と；を前記一対のチエーン体の走
行方向に対して前記はんだ被覆装置の前段と後段
にそれぞれ設けたことを特徴とする電子部品のは
んだ被覆装置。 Engaging portions formed at both ends of a lead frame that integrally connects lead terminals of multiple electronic components are engaged with engaging claws formed on a pair of chain bodies running along a guide rail to apply solder coating. A solder coating device for performing solder coating, wherein the pins constituting each of the chain bodies are vertically movable and formed into a long shape, and a compression spring provided to always hold the pins upward, and a lower end of the pins. a pedestal fixed to the lead frame; a rotatable engagement claw below the pedestal that engages with the engagement portion of the lead frame; and an upper portion of the pedestal where the engagement portion is engaged by the engagement claw. an engaging device having rotatable pressing pieces for pressing the upper surface of the assembled electronic components, each facing the pair of chain bodies; a pressing tool for pressing the pin to lower the pin; a vertically movable first engaging body that rotates the engaging claw to disengage the lead frame by lowering the pin by driving a pressing tool; A second engaging body that rotates to release the pressure on the upper surface of the electronic component is provided at the front stage and the rear stage of the solder coating device, respectively, with respect to the running direction of the pair of chain bodies. Solder coating equipment for electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12647290U JP2527420Y2 (en) | 1990-11-30 | 1990-11-30 | Soldering equipment for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12647290U JP2527420Y2 (en) | 1990-11-30 | 1990-11-30 | Soldering equipment for electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0485741U true JPH0485741U (en) | 1992-07-24 |
| JP2527420Y2 JP2527420Y2 (en) | 1997-02-26 |
Family
ID=31874028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12647290U Expired - Fee Related JP2527420Y2 (en) | 1990-11-30 | 1990-11-30 | Soldering equipment for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2527420Y2 (en) |
-
1990
- 1990-11-30 JP JP12647290U patent/JP2527420Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2527420Y2 (en) | 1997-02-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |