JPH0485745U - - Google Patents
Info
- Publication number
- JPH0485745U JPH0485745U JP1990126372U JP12637290U JPH0485745U JP H0485745 U JPH0485745 U JP H0485745U JP 1990126372 U JP1990126372 U JP 1990126372U JP 12637290 U JP12637290 U JP 12637290U JP H0485745 U JPH0485745 U JP H0485745U
- Authority
- JP
- Japan
- Prior art keywords
- tab
- semiconductor chip
- back side
- lead frame
- inner lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案のリードフレームの下面図、第
２図は第１図の断面図である。
１……アウターリード、２……インナーリード
、３……タブ吊りリード、４……タブ、５……絶
縁板、６……半導体チツプ、７……ボンデイング
ワイヤー。
FIG. 1 is a bottom view of the lead frame of the present invention, and FIG. 2 is a sectional view of FIG. 1. 1... Outer lead, 2... Inner lead, 3... Tab hanging lead, 4... Tab, 5... Insulating plate, 6... Semiconductor chip, 7... Bonding wire.
Claims (1)
または絶縁膜を設け、タブ裏面にインナーリード
先端を接着剤で貼り付け固定したことを特徴とす
るリードフレーム。 ２ 請求項１記載のインナーリードは、半導体チ
ツプ、及びタブにボンデイングワイヤーが接触し
ないように段差部を設けたことを特徴とするリー
ドフレーム。[Scope of Claim for Utility Model Registration] 1. A lead frame characterized in that an insulating plate or insulating film is provided on the back side of a tab on which a semiconductor chip is attached, and inner lead tips are affixed and fixed to the back side of the tab with an adhesive. 2. The lead frame according to claim 1, wherein the inner lead is provided with a stepped portion to prevent the bonding wire from coming into contact with the semiconductor chip and the tab.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990126372U JPH0485745U (en) | 1990-11-30 | 1990-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990126372U JPH0485745U (en) | 1990-11-30 | 1990-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0485745U true JPH0485745U (en) | 1992-07-24 |
Family
ID=31873931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990126372U Pending JPH0485745U (en) | 1990-11-30 | 1990-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0485745U (en) |
-
1990
- 1990-11-30 JP JP1990126372U patent/JPH0485745U/ja active Pending