JPH0485801U

JPH0485801U -

Info

Publication number: JPH0485801U
Application number: JP12580790U
Authority: JP
Priority date: 1990-11-28
Filing date: 1990-11-28
Publication date: 1992-07-27

Description

[Brief explanation of the drawing]

第１図ないし第７図は本考案の一実施例による
電子部品の接続構造を説明するための図であり、
第１図はその接続構造が適用された結合基板の一
部の正面図、第２図はその平面図、第３図はその
分解斜視図、第４図はアンテナ共用器の分解斜視
図、第５図はその結合基板の平面図、第６図はそ
の平面図、第７図はその等価回路図、第８図ａ，
ｂはそれぞれ従来の接続構造を示す正面図、平面
図、第９図は従来の問題点を説明するための正面
図である。図において、４は結合基板、６ａは伝送線路、
２２は接続部（半田付け部）、２３はレジスト膜
、Ｃ１〜Ｃ６はチツプコンデンサ（電子部品）で
ある。 1 to 7 are diagrams for explaining a connection structure of electronic components according to an embodiment of the present invention,
Fig. 1 is a front view of a part of the coupling board to which the connection structure is applied, Fig. 2 is a plan view thereof, Fig. 3 is an exploded perspective view thereof, Fig. 4 is an exploded perspective view of the antenna duplexer, and Fig. 4 is an exploded perspective view of the antenna duplexer. Fig. 5 is a plan view of the bonded substrate, Fig. 6 is a plan view thereof, Fig. 7 is its equivalent circuit diagram, Fig. 8 a,
9b is a front view and a plan view showing a conventional connection structure, respectively, and FIG. 9 is a front view for explaining problems with the conventional connection structure. In the figure, 4 is a coupling board, 6a is a transmission line,
22 is a connection part (soldering part), 23 is a resist film, and C1 to C6 are chip capacitors (electronic parts).

Claims

[Scope of utility model registration request]

A connection structure for electronic components in which electronic components are reflow soldered to a transmission line patterned on a substrate, characterized in that a resist film is formed on the outer surface of the transmission line except for the soldered part. Connection structure of electronic components.