JPH0485813A - Vacuum treatment equipment - Google Patents
Vacuum treatment equipmentInfo
- Publication number
- JPH0485813A JPH0485813A JP2198796A JP19879690A JPH0485813A JP H0485813 A JPH0485813 A JP H0485813A JP 2198796 A JP2198796 A JP 2198796A JP 19879690 A JP19879690 A JP 19879690A JP H0485813 A JPH0485813 A JP H0485813A
- Authority
- JP
- Japan
- Prior art keywords
- vacuum
- semiconductor
- wafer
- load lock
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009489 vacuum treatment Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 claims description 38
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 235000012431 wafers Nutrition 0.000 description 42
- 238000010586 diagram Methods 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、半導体装置製造工程に用いる真空処理装置に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a vacuum processing apparatus used in a semiconductor device manufacturing process.
［従来の技術］
従来の技術としては、真空処理装置は、半導体ウェハの
キャリアを、大気圧下で、半導体装置製造装置から半導
体装置製造装置へ運搬・保管させる様な構造となってい
た。[Prior Art] As a conventional technology, a vacuum processing apparatus has a structure in which carriers of semiconductor wafers are transported and stored from one semiconductor device manufacturing apparatus to another semiconductor device manufacturing apparatus under atmospheric pressure.
［発明が解決しようとする課題及び目的］しかし、前述
の従来技術では、キャリア内の半導体ウェハが大気にさ
らされてしまうため、大気中の水蒸気・酸素が半導体ウ
ェハの表面に到達し、自然酸化膜の生成・吸湿等が起こ
り、半導体装置製造時に、接触抵抗の増大・膜質の悪化
等の問題を発生させていた。また、大気中に存在する異
物の半導体ウェハへの付着も完全には防ぐことが出来な
かった。さらに、真空処理を必要とする半導体装置の製
造装置では、処理前に半導体ウェハの置かれている雰囲
気を大気圧状態から減圧まで真空引きし、処理後には半
導体ウェハの置かれている雰囲気を真空状態から大気圧
状態まで戻す必要があり、真空引き及び大気圧状態への
移行に時間が費やされており、かつ、真空引き及び大気
圧状態への移行という圧力の変動は、異物の巻き上げ・
半導体ウェハへの付着を引き起こす場合もあった。[Problems and objects to be solved by the invention] However, in the above-mentioned conventional technology, the semiconductor wafer in the carrier is exposed to the atmosphere, so water vapor and oxygen in the atmosphere reach the surface of the semiconductor wafer, causing natural oxidation. Film formation and moisture absorption occur, causing problems such as increased contact resistance and deterioration of film quality during the manufacture of semiconductor devices. Furthermore, it has not been possible to completely prevent foreign matter present in the atmosphere from adhering to the semiconductor wafer. Furthermore, in semiconductor device manufacturing equipment that requires vacuum processing, the atmosphere in which the semiconductor wafer is placed is evacuated from atmospheric pressure to reduced pressure before processing, and the atmosphere in which the semiconductor wafer is placed is evacuated after processing. It is necessary to return the state from the state to the atmospheric pressure state, and time is spent on evacuation and transition to the atmospheric pressure state, and the pressure fluctuations during the evacuation and transition to the atmospheric pressure state may cause foreign matter to be rolled up or
In some cases, it caused adhesion to semiconductor wafers.
そこで、本発明は従来のこのような課題を解決するもの
で、半導体装置製造の単純化・安定化・スルーブツト上
昇及び、半導体装置製造時の半導体ウェハへの異物付着
防止を提供することを目的とする。SUMMARY OF THE INVENTION The present invention is intended to solve these conventional problems, and aims to simplify, stabilize, and increase throughput in semiconductor device manufacturing, and to prevent foreign matter from adhering to semiconductor wafers during semiconductor device manufacturing. do.
［課題を解決するための手段］
上記課題を解決するため、本発明の真空処理装置は、半
導体ウェハを真空状態中で維持し、半導体装置製造装置
から半導体装置製造装置への半導体ウェハの移動を、真
空中で行なうことを特徴とする。[Means for Solving the Problems] In order to solve the above problems, the vacuum processing apparatus of the present invention maintains the semiconductor wafer in a vacuum state and prevents the movement of the semiconductor wafer from one semiconductor device manufacturing device to another. , which is characterized by being carried out in a vacuum.
［実施例］
第１図は、本発明の真空処理装置に用いるウェハキャリ
アの概略図である。半導体ウェハ（６）を運搬・保管す
るウェハキャリア（１）は、帯電を防ぐため導電性材料
で作られた真空容器（２）と開閉可能な蓋（３）から成
り立っている。このＩＩ（３）は真空容器（２）と回転
式中心軸（８）を共有しており、さらに、この蓋（３）
を閉じると半導体ウェハ（６）はキャリア（１）内でほ
とんど、がたつかない様に作られている。真空容器（２
）には溝が切られており、この溝で半導体ウェハ（６）
を保持する。また真空容器（２）の蓋（３）と逆側には
、内部の半導体ウェハ（６）が確認できるように覗き窓
（４）が設けられている。[Example] FIG. 1 is a schematic diagram of a wafer carrier used in the vacuum processing apparatus of the present invention. A wafer carrier (1) for transporting and storing semiconductor wafers (6) is made up of a vacuum container (2) made of a conductive material to prevent charging and a lid (3) that can be opened and closed. This II (3) shares a rotary central shaft (8) with the vacuum container (2), and furthermore, this lid (3)
When the carrier (1) is closed, the semiconductor wafer (6) is made so that there is almost no wobbling within the carrier (1). Vacuum container (2
) has a groove cut into it, and the semiconductor wafer (6)
hold. Further, a viewing window (4) is provided on the opposite side of the vacuum container (2) from the lid (3) so that the semiconductor wafer (6) inside can be checked.
真空容器（２）と蓋（３）はＯリング（５）で真空シー
ルをすることができ、真空容器（２）と半導体装置のロ
ードロック室（７）の間もＯリング（１３）で真空シー
ルがａ来るようになっている。The vacuum container (2) and the lid (3) can be vacuum sealed with an O-ring (5), and the vacuum can be sealed with an O-ring (13) between the vacuum container (2) and the semiconductor device load lock chamber (7). The sticker is set to come a.
第２図に示すように、半導体ウェハをウェハキャリア（
１）内から製造装置にセットする場合には、内部を真空
状態に維持したウェハキャリア（１）をロードロック室
（７）に接続し、ロードロック室（７）と真空ポンプ（
９）間のバルブ（１０）を開いてロードロック室（７）
を真空引きする。As shown in Figure 2, the semiconductor wafer is placed on a wafer carrier (
1) When setting the wafer carrier into the manufacturing equipment from inside, connect the wafer carrier (1) whose interior is maintained in a vacuum state to the load lock chamber (7), and connect the load lock chamber (7) and the vacuum pump (
9) Open the valve (10) between the load lock chambers (7)
Vacuum.
真空になったところでロードロック室（７）内のロボッ
ト（８）によりウェハキャリア（１）の蓋（３）を開く
。半導体ウェハ（６）をロボット（８）によりウェハキ
ャリア（１）より取り出し、真空ポンプ（１５）により
真空引きされている反応室（１２）へ入れて、必要な処
理を行なう。When the vacuum is created, the robot (8) in the load lock chamber (7) opens the lid (3) of the wafer carrier (1). A semiconductor wafer (6) is taken out from the wafer carrier (1) by a robot (8), placed into a reaction chamber (12) that is evacuated by a vacuum pump (15), and subjected to necessary processing.
半導体ウェハをウェハキャリア（１）に入れる場合には
、ウェハキャリア（１）をロードロック室（７）に接続
し、ロードロック室（７）のロボット（８）にてウェハ
キャリア（１）の蓋（３）を開いた状態で、真空ポンプ
（９）とロードロック室（７）の間のバルブ（１０）を
開き、真空ポンプ（９）にてロードロック室（７）及び
ウェハキャリア（１）の内部を真空引きしておく。ロー
ドロック室（７）内のロボット（８）により、半導体ウ
ェハ（６）をウェハキャリア（１）内に入れる。半導体
ウェハ（６）がすべてウェハキャリア（１）内に収まっ
たところで、ロードロック室（７）内のロボット（８）
によりキャリアの蓋（３）を閉じ、バルブ（１０）を閉
じ真空引きも止め、ロードロック室（７）に接続された
窒素ガス（１４）のバルブ（１１）を開いてロードロッ
ク室（７）内を大気圧状態に戻す。その後ウェハキャリ
ア（１）を次工程の装置に移動させる。When loading a semiconductor wafer into the wafer carrier (1), connect the wafer carrier (1) to the load lock chamber (7), and use the robot (8) in the load lock chamber (7) to close the lid of the wafer carrier (1). With (3) open, open the valve (10) between the vacuum pump (9) and the load lock chamber (7), and use the vacuum pump (9) to move the load lock chamber (7) and wafer carrier (1). Vacuum the inside of the. The semiconductor wafer (6) is placed into the wafer carrier (1) by the robot (8) in the load lock chamber (7). Once all the semiconductor wafers (6) are in the wafer carrier (1), the robot (8) in the load lock chamber (7)
Close the lid (3) of the carrier, close the valve (10) and stop the vacuum, and open the valve (11) for nitrogen gas (14) connected to the load lock chamber (7) to open the load lock chamber (7). Return the interior to atmospheric pressure. Thereafter, the wafer carrier (1) is moved to a device for the next process.
上記のような用い方により、半導体ウェハは、大気中の
酸素・水蒸気・異物と接触したり、圧力の変動にさらさ
れたりすることもなくなり、また、真空引きや大気圧状
態への移行に余分な時間を費やす必要もない。By using the method described above, semiconductor wafers are not exposed to oxygen, water vapor, or foreign substances in the atmosphere, or to pressure fluctuations, and they are not exposed to excessive pressure during evacuation or transition to atmospheric pressure. There's no need to spend a lot of time.
［発明の効果］
以上述べたように発明によれば、半導体ウェハを真空状
態中で維持し、半導体装置製造装置から半導体装置製造
装置への半導体ウェハの移動を、真空中で行なうことに
より、半導体装置製造の単純化・安定化・スルーブツト
上昇及び、半導体装置製造時の半導体ウェハへの異物付
着防止という効果を有する。[Effects of the Invention] As described above, according to the invention, the semiconductor wafer is maintained in a vacuum state and the semiconductor wafer is transferred from one semiconductor device manufacturing device to another in a vacuum. This has the effect of simplifying and stabilizing device manufacturing, increasing throughput, and preventing foreign matter from adhering to semiconductor wafers during semiconductor device manufacturing.
第１図は本発明の真空処理装置に用いるウェハキャリア
の概略図
第２図は本発明の真空処理装置にウェハキャリアを接続
した状態の概略断面図
第３図は従来のウェハキャリアの概略図１ ・・・ウェ
ハキャリア
２ ・・・真空容器
６ ・・・半導体ウェハ
７ ・・・ロードロック室
８ ・・・ロボット
９ ・・・真空ボンブ
反応室
以上Fig. 1 is a schematic diagram of a wafer carrier used in the vacuum processing apparatus of the present invention. Fig. 2 is a schematic sectional view of the wafer carrier connected to the vacuum processing apparatus of the present invention. Fig. 3 is a schematic diagram of a conventional wafer carrier. ...Wafer carrier 2 ...Vacuum container 6 ...Semiconductor wafer 7 ...Load lock chamber 8 ...Robot 9 ...Vacuum bomb reaction chamber and above
Claims (1)
置から半導体装置製造装置への半導体ウェハの移動を、
真空中で行なうことを特徴とする真空処理装置。The semiconductor wafer is maintained in a vacuum state and the semiconductor wafer is moved from one semiconductor device manufacturing device to another.
Vacuum processing equipment that performs processing in a vacuum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2198796A JPH0485813A (en) | 1990-07-26 | 1990-07-26 | Vacuum treatment equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2198796A JPH0485813A (en) | 1990-07-26 | 1990-07-26 | Vacuum treatment equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0485813A true JPH0485813A (en) | 1992-03-18 |
Family
ID=16397049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2198796A Pending JPH0485813A (en) | 1990-07-26 | 1990-07-26 | Vacuum treatment equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0485813A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08279546A (en) * | 1995-03-28 | 1996-10-22 | Jenoptik Ag | Loading and unloading station for semiconductor processing equipment |
| US6869263B2 (en) | 2002-07-22 | 2005-03-22 | Brooks Automation, Inc. | Substrate loading and unloading station with buffer |
| US7677859B2 (en) | 2002-07-22 | 2010-03-16 | Brooks Automation, Inc. | Substrate loading and uploading station with buffer |
| KR101027376B1 (en) * | 2008-08-06 | 2011-04-11 | (주)울텍 | Bundle-type sample load lock system |
-
1990
- 1990-07-26 JP JP2198796A patent/JPH0485813A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08279546A (en) * | 1995-03-28 | 1996-10-22 | Jenoptik Ag | Loading and unloading station for semiconductor processing equipment |
| US6071059A (en) * | 1995-03-28 | 2000-06-06 | Brooks Automation Gmbh | Loading and unloading station for semiconductor processing installations |
| US6375403B1 (en) | 1995-03-28 | 2002-04-23 | Brooks Automation, Gmbh | Loading and unloading station for semiconductor processing installations |
| US6461094B1 (en) | 1995-03-28 | 2002-10-08 | Jenoptik Ag | Loading and unloading station for semiconductor processing installations |
| US6837663B2 (en) | 1995-03-28 | 2005-01-04 | Brooks Automation, Inc. | Loading and unloading station for semiconductor processing installations |
| US6869263B2 (en) | 2002-07-22 | 2005-03-22 | Brooks Automation, Inc. | Substrate loading and unloading station with buffer |
| US7677859B2 (en) | 2002-07-22 | 2010-03-16 | Brooks Automation, Inc. | Substrate loading and uploading station with buffer |
| US8454293B2 (en) | 2002-07-22 | 2013-06-04 | Brooks Automation, Inc. | Substrate loading and unloading station with buffer |
| US9670010B2 (en) | 2002-07-22 | 2017-06-06 | Brooks Automation, Inc. | Substrate loading and unloading station with buffer |
| KR101027376B1 (en) * | 2008-08-06 | 2011-04-11 | (주)울텍 | Bundle-type sample load lock system |
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