JPH0485950U - - Google Patents
Info
- Publication number
- JPH0485950U JPH0485950U JP1990130368U JP13036890U JPH0485950U JP H0485950 U JPH0485950 U JP H0485950U JP 1990130368 U JP1990130368 U JP 1990130368U JP 13036890 U JP13036890 U JP 13036890U JP H0485950 U JPH0485950 U JP H0485950U
- Authority
- JP
- Japan
- Prior art keywords
- photoelectric conversion
- conversion element
- image sensor
- conductive pattern
- transmission member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 claims 2
- 239000004020 conductor Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Facsimile Heads (AREA)
Description
第１図はこの考案にかかる密着型リニアイメー
ジセンサの縦断面図、第２図は、従来の密着型リ
ニアイメージセンサの縦断面図、第３図はＦＡＰ
の構造を示す部分斜視図である。
１……ＦＡＰ、３……光源、５……ガラスフア
イバー、６……光電変換素子、９……透明樹脂、
１８……導体パターン、１９……ガラスプレート
。
Fig. 1 is a vertical cross-sectional view of a contact type linear image sensor according to this invention, Fig. 2 is a longitudinal cross-sectional view of a conventional contact type linear image sensor, and Fig. 3 is a FAP.
FIG. 2 is a partial perspective view showing the structure of FIG. 1... FAP, 3... Light source, 5... Glass fiber, 6... Photoelectric conversion element, 9... Transparent resin,
18...Conductor pattern, 19...Glass plate.
Claims (1)
を光電変換素子で受光するように構成された密着
型リニアイメージセンサにおいて、前記イメージ
伝送部材に導体パターンを形成し、この導体パタ
ーンに光電変換素子を接合して、光電変換素子の
周囲を透明な樹脂で封止したことを特徴とする密
着型イメージセンサ。 In a contact type linear image sensor configured so that a photoelectric conversion element receives reflected light from a document through an image transmission member, a conductive pattern is formed on the image transmission member, and a photoelectric conversion element is bonded to the conductive pattern. A close-contact image sensor is characterized in that the periphery of a photoelectric conversion element is sealed with a transparent resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990130368U JPH0485950U (en) | 1990-11-29 | 1990-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990130368U JPH0485950U (en) | 1990-11-29 | 1990-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0485950U true JPH0485950U (en) | 1992-07-27 |
Family
ID=31877718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990130368U Pending JPH0485950U (en) | 1990-11-29 | 1990-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0485950U (en) |
-
1990
- 1990-11-29 JP JP1990130368U patent/JPH0485950U/ja active Pending