JPH0487558U

JPH0487558U -

Info

Publication number: JPH0487558U
Application number: JP40068590U
Authority: JP
Priority date: 1990-12-14
Filing date: 1990-12-14
Publication date: 1992-07-29

Description

[Brief explanation of drawings]

第１図は、本考案の電子部品半田付け装置の外
観斜視図。第２図は、本考案の電子部品半田付け
装置の側面図で、第２図ａは、ホルダーに取り付
けられた電子部品が昇降するリニアヘツドにより
半田槽に降ろされる所を示す側面図、第２図ｂは
、電子部品のリード線が半田槽に浸漬される側面
図。第２図ｃは、横方向移動リニアヘツドにより
電子部品リード線を半田槽に浸漬したまま半田面
上をリニアヘツドによりプツシヤを押し込んだ側
面図。１……ホルダー、２……テーブル、３……プツ
シヤ、４，５……スライドシヤフト、６……ベー
ス、７……上板、８，９……リニアヘツド、１０
……半田槽、１１……ばね、１２……リード線、
１３……電子部品。 FIG. 1 is an external perspective view of the electronic component soldering apparatus of the present invention. FIG. 2 is a side view of the electronic component soldering apparatus of the present invention, and FIG. b is a side view of a lead wire of an electronic component immersed in a solder bath; FIG. 2c is a side view of the electronic component lead wire being immersed in the solder bath and the pusher being pushed onto the solder surface by the linear head moving in the lateral direction. 1... Holder, 2... Table, 3... Pusher, 4, 5... Slide shaft, 6... Base, 7... Top plate, 8, 9... Linear head, 10
... Solder tank, 11 ... Spring, 12 ... Lead wire,
13...Electronic parts.

Claims

[Scope of utility model registration request]

A holder with electronic components attached is assembled on a table with a pusher driven by a linear head that moves vertically on the solder bath surface and a linear head that moves horizontally, and the linear head moves vertically and moves horizontally. 1. An electronic component soldering apparatus characterized in that the electronic component soldering part is dipped in solder by a linear head that moves the soldering surface of the electronic component.