JPH0487767A - polishing equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Field of Application] The present invention provides a method for holding a carrier plate on which a material to be polished is fixed on the lower surface of the carrier plate while pressing the material to be polished onto a surface plate provided below the carrier plate. The present invention relates to a polishing device for polishing materials.

[Conventional technology]

Generally, silicon wafer is used as a substrate material for semiconductor devices such as ICs and LSIs. and,
The surface of this silicon waeno is mirror polished.

Conventionally, as such a silicon wafer polishing apparatus, one shown in FIG. 5 is known.

In this figure, reference numeral 1 is a surface plate, 2 is a carrier plate, and 3 is a mount head disposed on the upper part of the carrier plate.

The surface plate 1 is a rotating plate that is circular in plan view and has a polishing pad attached to its upper surface.

The carrier plate 2 is a circular plate made of ceramic or glass material, and both surfaces thereof are polished to have a flat surface. On one side of this carrier plate 2, a sixth
As shown in the figure, a plurality of (four in this figure) silicon wafers 4 are fixed at equally spaced positions when viewed from above. Methods for fixing this silicon wafer 4 to the carrier plate 2 include a wax method in which the silicon wafer 4 is attached to one side of the carrier plate 2 by applying wax to one side of the silicon wafer 4, a vacuum adsorption method, and a water bonding method. There is a waxless method in which bonding is performed using methods such as the following. The carrier plate 2, on which the silicon wafer 4 is fixed by these methods, is placed on the surface plate 1 with the surface on which the silicon wafer 4 is fixed facing downward.

A plurality of carrier plates 2 placed on the surface plate 1 are arranged on one surface plate 1. These carrier plates 2 are positioned at equal intervals in the circumferential direction when viewed from above. The upper part of the carrier plate 2 is fitted into the mount head 3, and the upper surface is in close contact with the inner surface of the mount head 3.

The pressure shaft 5 is connected to the center of the upper part of the mount helad 3, and the pressure shaft 5 is swingable and rotatable with respect to the pressure shaft 5.

To polish the silicon wafer 4 using the polishing apparatus configured as described above, first, polishing abrasive grains are dispersed in an alkaline suspension of floidal silica or the like on the surface plate 1. The carrier plate 2 to which the silicon wafer 4 is fixed is placed on the surface plate 1 thus constructed, with the surface to which the silicon wafer 4 is fixed facing downward. Then, the mount head 3 disposed above the carrier plate 2 is attached to the upper part of the carrier plate 2.

Thereafter, the silicon wafer 4 is pressed onto the upper surface of the surface plate 1 by pressing the pressure shaft 5 connected to the upper part of the mount head 3 downward using a pneumatic printer, a hydraulic cylinder, or the like. The surface plate 1 is rotated in this state. In this case, the relative speed at the contact surface between the surface plate 1 and the silicon wafer 4 becomes larger when the silicon wafer 4 is in contact with the surface plate 1 outside the surface plate 1, so it is fixed to the same carrier plate 2. Among the silicon wafers 4 that are being held, the silicon wafer 4 that is in contact with the surface plate 1 on the outside is dragged by the rotation of the surface plate 1, and the carrier plate 2 is fixed together with the mount head 3 mounted on the upper part of the silicon wafer 4. Rotates in the same direction as board 1.

In this way, the bottom surface of the silicon wafer 4 is placed on the surface plate 1.
Polished by abrasive grains dispersed on the top surface of the

[Problem to be solved by the invention]

By the way, in the conventional polishing apparatus described above, a lower surface plate is provided at the lower part of the inner surface of the U-shaped apparatus body, and an upper surface plate is provided at the upper part of the inner surface, and this upper surface plate is lowered by a cylinder device to form the lower surface plate. (For example, see Utility Model Publication No. 60-21174).
Alternatively, a structure is known in which an upper surface plate is provided on a lower surface plate so as to be rotatable up and down using one end thereof as a fulcrum. However, in polishing devices with these structures, one end of the upper surface plate is supported more strongly than the other end, so when the upper surface plate is pressed against the lower surface plate, the pressing force is biased. There is a problem that the entire surface cannot be uniformly suppressed.

The present invention has been made in view of the above circumstances, and its purpose is to move the entire upper part of the device up and down.
It is an object of the present invention to provide a polishing device that can make pressing force uniform and improve polishing accuracy.

[Means to solve the problem]

In order to achieve the above object, the polishing apparatus of the present invention is such that a lifting mechanism for moving the support member up and down is provided at both ends of a support member that supports a carrier plate.

[Effect]

In the polishing apparatus of the present invention, the support member that supports the carrier plate is smoothly moved up and down by the elevating mechanisms provided at both ends of the support member.

〔Example〕

Hereinafter, one embodiment of the present invention will be described based on FIGS. 1 to 4.

In these figures, reference numeral 11 is a device main body equipped with a lower surface plate, and above the device main body 11, an upper lid portion (supporting member) 12 that supports and presses the carrier plate is provided so as to be able to rise and fall freely. . That is, a motor with a brake 13 is installed horizontally on one side of the device main body 11,
A screw jack 14 is connected to the rotating shaft of this motor 13 with a brake. Further, a mounting member 16 is attached to the upper end of the screw shaft 15 of the screw jack 14.
One side portion of the upper lid portion 12 is attached via. A hevel gear hook 17 is connected to the horizontal shaft of the screw jack 14, and a bevel gear hook 18 is connected to the vertical shaft of the bevel gear box I7. Furthermore, the horizontal shaft of the bevel gear box 18 passes through the device main body 11 and is connected to a bevel gear box 19, and the vertical shaft of this bevel gear box 19 is connected to a bevel gear box 20.

A screw jack 21 is connected to the horizontal shaft of the bevel gear box 20, and this screw jack 21 is installed on the other side of the device main body 11, and the screw shaft 22 of the screw jack 21
The other side portion of the upper lid portion 12 is attached to the upper end of the upper lid portion 12 via an attachment member 23 . Furthermore, a pair of guide portions 24 are attached to each side of the device main body 11, and a guide shaft 2 is attached to each of these guide portions 24.
5 is attached so that it can be raised and lowered freely. The upper lid portion 12 is attached to the upper end of each guide shaft 25 via an attachment member 26. Note that the reference numeral 27 in the figure is a bellows-shaped cover that covers each screw shaft 15, 22 and guide shaft 25.

In the polishing apparatus configured as described above, the apparatus main body 1
1, when raising and lowering the upper cover part 12, by rotating the rotary shaft of the motor 13 with a brake, the screw shaft 15 of the screw jack 14 is raised and lowered, and the screw shaft 15 of the screw jack 14 is raised and lowered. The screw shaft 22 of the screw jack 21 is raised and lowered. As a result, the guide shaft 25 guided and supported by the guide portion 24 moves up and down, and each screw jack 14
．． The screw shafts 15 and 22 of 21 move up and down, and the upper lid part 1
2 moves up and down with respect to the device main body 11. In this way, the upper lid part 12 is connected to the screw shafts 15 and 22 of the screw jacks 14° 21 provided on both sides of the device main body 11.
By smoothly moving up and down while being supported and guided by the guide shaft 25 of the guide section 24, the carrier plate is evenly and reliably pressed by the upper lid section 12 against the lower surface plate of the apparatus main body 11.

〔Effect of the invention〕

As explained above, in the polishing apparatus of the present invention, a lifting mechanism for moving the support member up and down is provided at both ends of the support member that supports the carrier plate. By smoothly moving the support member up and down using the respective lifting mechanisms, it is possible to make the pressing force uniform and improve the polishing accuracy. The carrier plate can be easily carried in and out from both sides.

[Brief explanation of the drawing]

1 to 4 show an embodiment of the present invention,
Figure 1 is a plan view, Figure 2 is a front view, Figure 3 is a right side view,
Figure 4 is a left side view, Figure 5 is an external view of a conventional polishing device,
FIG. 6 is a layout diagram of silicon wafers attached to a carrier plate. 12... Upper lid part (supporting member), 14.21... Screwjar, key (elevating mechanism).

Claims (1)

[Claims] In a polishing apparatus that polishes a material to be polished while pressing a carrier plate having a material to be polished on the lower surface onto a surface plate provided below the carrier plate, both ends of a support member that supports the carrier plate are provided. and a polishing device, each of which is provided with an elevating mechanism for moving the support member up and down.