JPH0488033U - - Google Patents

Info

Publication number
JPH0488033U
JPH0488033U JP1990403615U JP40361590U JPH0488033U JP H0488033 U JPH0488033 U JP H0488033U JP 1990403615 U JP1990403615 U JP 1990403615U JP 40361590 U JP40361590 U JP 40361590U JP H0488033 U JPH0488033 U JP H0488033U
Authority
JP
Japan
Prior art keywords
housing
shaft
plates
oil chamber
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990403615U
Other languages
Japanese (ja)
Other versions
JPH079375Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990403615U priority Critical patent/JPH079375Y2/en
Publication of JPH0488033U publication Critical patent/JPH0488033U/ja
Application granted granted Critical
Publication of JPH079375Y2 publication Critical patent/JPH079375Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は粘性継手の、軸の軸線を含む面で切断
した断面図で上半分を示し、第２図は軸の軸線に
直交する面で切断した要部の断面図、第３図は経
時的に変化する圧力とトルクとを定性的に示す特
性図である。 １０：粘性継手、１２：ハウジング、１４：軸
、１６，１８：プレート、２０：スペーサリング
、２４：収容室、２６：エラストマー、３０：油
室。 Figure 1 is a cross-sectional view of the viscous joint taken along a plane that includes the axis of the shaft, showing the upper half, Figure 2 is a cross-sectional view of the main part taken along a plane perpendicular to the axis of the shaft, and Figure 3 shows the aging of the joint. FIG. 2 is a characteristic diagram qualitatively showing pressure and torque that change over time. 10: Viscous joint, 12: Housing, 14: Shaft, 16, 18: Plate, 20: Spacer ring, 24: Accommodation chamber, 26: Elastomer, 30: Oil chamber.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ハウジングと、該ハウジングに回転可能に取り
付けられ、前記ハウジングと相まつて油室を画定
する軸と、前記ハウジングに回転不可にかつ軸の
軸線方向へ移動可能に装着され、前記油室内に配
置された複数の第１のプレートと、前記軸に回転
不可にかつ前記軸の軸線方向へ移動可能に装着さ
れ、前記第１のプレートと互い違いとなるように
前記油室内に配置された複数の第２のプレートと
を備えた粘性継手であつて、前記ハウジングは前
記油室に連通する収容室を有し、該収容室内にエ
ラストマーを収容した、粘性継手。 a housing; a shaft rotatably attached to the housing and defining an oil chamber together with the housing; a plurality of first plates; and a plurality of second plates, which are non-rotatably mounted on the shaft and movable in the axial direction of the shaft, and are arranged in the oil chamber so as to alternate with the first plates. A viscous joint comprising a plate, wherein the housing has a housing chamber communicating with the oil chamber, and an elastomer is housed in the housing chamber.
JP1990403615U 1990-12-18 1990-12-18 Wafer bonding device Expired - Lifetime JPH079375Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990403615U JPH079375Y2 (en) 1990-12-18 1990-12-18 Wafer bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990403615U JPH079375Y2 (en) 1990-12-18 1990-12-18 Wafer bonding device

Publications (2)

Publication Number Publication Date
JPH0488033U true JPH0488033U (en) 1992-07-30
JPH079375Y2 JPH079375Y2 (en) 1995-03-06

Family

ID=31881367

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990403615U Expired - Lifetime JPH079375Y2 (en) 1990-12-18 1990-12-18 Wafer bonding device

Country Status (1)

Country Link
JP (1) JPH079375Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009131920A (en) * 2007-11-29 2009-06-18 Ebara Corp Polishing apparatus and method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4675929B2 (en) * 2007-04-05 2011-04-27 シャープ株式会社 Inkjet head manufacturing apparatus and inkjet head manufacturing method using the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5932135A (en) * 1982-08-18 1984-02-21 Toshiba Corp Bonding device for semiconductor wafer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5932135A (en) * 1982-08-18 1984-02-21 Toshiba Corp Bonding device for semiconductor wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009131920A (en) * 2007-11-29 2009-06-18 Ebara Corp Polishing apparatus and method

Also Published As

Publication number Publication date
JPH079375Y2 (en) 1995-03-06

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term