JPH0488051U - - Google Patents
Info
- Publication number
- JPH0488051U JPH0488051U JP1990400502U JP40050290U JPH0488051U JP H0488051 U JPH0488051 U JP H0488051U JP 1990400502 U JP1990400502 U JP 1990400502U JP 40050290 U JP40050290 U JP 40050290U JP H0488051 U JPH0488051 U JP H0488051U
- Authority
- JP
- Japan
- Prior art keywords
- gear
- cylinder
- gear holder
- gear train
- communication space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990400502U JP2504262Y2 (ja) | 1990-12-13 | 1990-12-13 | 半導体モジュ―ル |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990400502U JP2504262Y2 (ja) | 1990-12-13 | 1990-12-13 | 半導体モジュ―ル |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0488051U true JPH0488051U (da) | 1992-07-30 |
| JP2504262Y2 JP2504262Y2 (ja) | 1996-07-10 |
Family
ID=31878737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990400502U Expired - Lifetime JP2504262Y2 (ja) | 1990-12-13 | 1990-12-13 | 半導体モジュ―ル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2504262Y2 (da) |
-
1990
- 1990-12-13 JP JP1990400502U patent/JP2504262Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2504262Y2 (ja) | 1996-07-10 |