JPH0488054U - - Google Patents

Info

Publication number
JPH0488054U
JPH0488054U JP1990400454U JP40045490U JPH0488054U JP H0488054 U JPH0488054 U JP H0488054U JP 1990400454 U JP1990400454 U JP 1990400454U JP 40045490 U JP40045490 U JP 40045490U JP H0488054 U JPH0488054 U JP H0488054U
Authority
JP
Japan
Prior art keywords
accumulation chamber
pressure accumulation
pressure
accumulator
hydraulic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990400454U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990400454U priority Critical patent/JPH0488054U/ja
Publication of JPH0488054U publication Critical patent/JPH0488054U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP1990400454U 1990-12-12 1990-12-12 Pending JPH0488054U (mo)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990400454U JPH0488054U (mo) 1990-12-12 1990-12-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990400454U JPH0488054U (mo) 1990-12-12 1990-12-12

Publications (1)

Publication Number Publication Date
JPH0488054U true JPH0488054U (mo) 1992-07-30

Family

ID=31878697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990400454U Pending JPH0488054U (mo) 1990-12-12 1990-12-12

Country Status (1)

Country Link
JP (1) JPH0488054U (mo)

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