JPH048947B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention particularly relates to a heat pipe type cooling device used for cooling semiconductor elements such as thyristors.

[Conventional technology]

Conventionally, a heat pipe type cooling device used for cooling thyristors, etc., which is a type of semiconductor device, has a cylindrical pipe filled with a working fluid in two phases: gas and liquid, as shown in Figure 2 A and B. One or more heat dissipating heat pipes 2 each having an evaporating section 5 at one end and a condensing section 6 at the other end are made of a block made of copper or other material with good heat conduction properties to facilitate the collection or dispersion of heat. The evaporating section 5 is press-fitted into a concave hole in the evaporating section 1 and joined together, and the condensing section 6 is provided with a large number of fins 7 and connected to each other.

Such a heat pipe type cooling device efficiently removes the heat generated from the thyristor or the like by bringing the thyristor or the like to be cooled into close contact with the block 1.

In addition, as for the equipment actually used, for example, two devices with a maximum heat output of 1000W as shown in Figure 2 are used.
When cooling the GTO thyristor 4, three heat pipes made of copper with a diameter of 15.88 mm and a length of 400 mm and a length of 150 mm are installed in their condensing parts.
A large number of Al fins of mm x width 35 mm x thickness 0.2 mm are bonded together, and the evaporation section is installed in a copper block measuring 100 x 100 x 30 mm.
GTO thyristor 4 is sandwiched in and used.

[Problem to be solved by the invention]

However, in the conventional heat pipe type cooling device, the block has the effect of dispersing the heat from the semiconductor element to the evaporation portion of a plurality of heat dissipation heat pipes provided inside the block. Therefore, a block larger than the element was installed, and the number of heat pipes for heat dissipation was determined according to the amount of heat dissipated.

However, in recent years, the capacity of semiconductor devices has increased and the amount of heat dissipated has increased, but the size has also become smaller. The operating temperatures will vary greatly, and the heat dissipation performance of each heat pipe will deteriorate. Especially for devices that dissipate heat through natural convection,
Even though the temperature of the heat pipe at the center of the block is highest, the free space is far away, so the effect of natural convection is slight, resulting in a high thermal resistance.

[Means to solve the problem]

In view of this, and as a result of various studies, the present invention has developed a heat pipe type cooling device that solves the above problems and achieves improved performance.

That is, the present invention provides a heat pipe type cooling device in which one or more evaporating parts of heat pipes for heat dissipation are provided in a block, and an object to be cooled is cooled by bringing it into close contact with the block. It is characterized by having a pipe,
It is effective to provide the heat pipe for uniform heat dissipation in a direction perpendicular to the evaporation section of the heat pipe for heat dissipation.

[Effect]

The purpose of providing a heat-uniforming heat pipe in a block in this way is to equalize the temperature of the block itself by the heat-uniforming heat pipe, and as a result, the operating temperature of each heat-dissipating heat pipe is the same. This makes it possible to prevent a decline in heat dissipation performance.

By arranging the heat dissipation heat pipe in a direction perpendicular to the direction of the evaporation section of the heat dissipation heat pipe provided in the block, the effect of making the block temperature uniform can be further improved.

Note that the diameter of the heat pipe for heat dissipation is usually smaller than that of the heat pipe for heat dissipation.

Therefore, according to the apparatus of the present invention, it is possible to efficiently cope with the cooling of elements that are expected to become smaller in the future.

〔Example〕

Next, one embodiment of the present invention will be described.

As shown in Figure 1 A and B, 100 ×
15.88mm in diameter in copper block 1 of 100×30mm
The evaporation parts of three 400 mm long copper heat pipes 2 using water as the working fluid are arranged in parallel in one direction, and blocks are placed on both sides of these heat pipes 2 in a direction perpendicular to the evaporation parts. 5 per drilled side
Heat-uniforming heat pipes 3 made of copper with a diameter of 4 mm and using water as a working fluid were fitted into the through-holes of the book to produce a heat pipe type cooling device.

Using three such heat pipe type cooling devices, 42 GTO thyristors with a maximum heat output of 1000 W were sandwiched between block 1 of these devices as shown in Fig. 2, and cooled by placing them in close contact with the surfaces of each block. The temperature difference between the three heat dissipation heat pipes in the device located in the center was 0°C. On the other hand, as shown in Figure 2, when two GTO thyristors with the same maximum heat output of 1000W were cooled using three conventional heat pipe type cooling devices, the three heat dissipating heat pipes in the device located in the center The temperature difference between them was 5°C.

In this way, according to the device of the present invention, the temperature at the highest temperature point of the heat pipe in the device can be lowered,
Furthermore, we were able to improve performance. Furthermore, it has become clear that the reduction in temperature at the highest temperature point is sufficient to support miniaturization of the device.

In this embodiment, the heat pipes for heat dissipation are provided in the block on both sides of the heat pipe for heat dissipation, and this is effective when the object to be cooled is placed in close contact with both sides of the block, but it is effective when the object to be cooled is placed close to both sides of the block. In cases where the objects to be cooled are not placed in close contact with each other, it is also possible to provide a heat radiating heat pipe on only one side of the heat radiating heat pipe within the block.

It is also possible to change the number of heat pipes for heat radiation depending on the amount of heat radiation, and the diameter of the heat pipes can also be increased depending on the thickness of the block.

〔Effect of the invention〕

As described above, according to the present invention, the cooling performance of the heat pipe type cooling device is improved, and failures of semiconductor elements and equipment can be significantly reduced, and even when the elements are miniaturized, sufficient cooling performance can be obtained. It has remarkable industrial effects.

[Brief explanation of drawings]

Figures 1A and 1B show an embodiment of the present invention, where A is a front view and B is a side view. Figure 2A and 2B show a conventional example, where A is a front view and B is a side view. be. 1...Block, 2...Heat pipe for heat dissipation,
3... Heat pipe for heat dissipation, 4... Thyristor,
5... Evaporation section, 6... Condensation section, 7... Fin.

Claims (1)

[Scope of Claims] 1. In a heat pipe type cooling device in which the evaporating parts of one or more heat dissipating heat pipes are provided in a block and the object to be cooled is cooled by bringing it into close contact with the block, there is no heat uniformity within the block. A heat pipe type cooling device characterized by having a heat pipe for use. 2. Claim 1, wherein the heat pipe for uniform heating is provided in a direction perpendicular to the evaporation part of the heat pipe for heat radiation.
The heat pipe cooling device described.