JPH0493146U - - Google Patents
Info
- Publication number
- JPH0493146U JPH0493146U JP1990406679U JP40667990U JPH0493146U JP H0493146 U JPH0493146 U JP H0493146U JP 1990406679 U JP1990406679 U JP 1990406679U JP 40667990 U JP40667990 U JP 40667990U JP H0493146 U JPH0493146 U JP H0493146U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990406679U JPH0493146U (2) | 1990-12-25 | 1990-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990406679U JPH0493146U (2) | 1990-12-25 | 1990-12-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0493146U true JPH0493146U (2) | 1992-08-13 |
Family
ID=31883822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990406679U Pending JPH0493146U (2) | 1990-12-25 | 1990-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0493146U (2) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016171284A (ja) * | 2015-03-16 | 2016-09-23 | デクセリアルズ株式会社 | 接続構造体、及び接続構造体の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62103795A (ja) * | 1985-10-30 | 1987-05-14 | アマノ株式会社 | 防犯防災機能付タイムレコ−ダ |
| JPH0222834A (ja) * | 1988-07-11 | 1990-01-25 | Matsushita Electric Ind Co Ltd | 半導体素子の実装方法 |
-
1990
- 1990-12-25 JP JP1990406679U patent/JPH0493146U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62103795A (ja) * | 1985-10-30 | 1987-05-14 | アマノ株式会社 | 防犯防災機能付タイムレコ−ダ |
| JPH0222834A (ja) * | 1988-07-11 | 1990-01-25 | Matsushita Electric Ind Co Ltd | 半導体素子の実装方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016171284A (ja) * | 2015-03-16 | 2016-09-23 | デクセリアルズ株式会社 | 接続構造体、及び接続構造体の製造方法 |