JPH0497341U - - Google Patents
Info
- Publication number
- JPH0497341U JPH0497341U JP1991005074U JP507491U JPH0497341U JP H0497341 U JPH0497341 U JP H0497341U JP 1991005074 U JP1991005074 U JP 1991005074U JP 507491 U JP507491 U JP 507491U JP H0497341 U JPH0497341 U JP H0497341U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991005074U JP2513472Y2 (ja) | 1991-01-17 | 1991-01-17 | ワイヤ―ボンディング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991005074U JP2513472Y2 (ja) | 1991-01-17 | 1991-01-17 | ワイヤ―ボンディング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0497341U true JPH0497341U (th) | 1992-08-24 |
| JP2513472Y2 JP2513472Y2 (ja) | 1996-10-09 |
Family
ID=31735348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991005074U Expired - Lifetime JP2513472Y2 (ja) | 1991-01-17 | 1991-01-17 | ワイヤ―ボンディング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2513472Y2 (th) |
-
1991
- 1991-01-17 JP JP1991005074U patent/JP2513472Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2513472Y2 (ja) | 1996-10-09 |