JPH049749U - - Google Patents
Info
- Publication number
- JPH049749U JPH049749U JP5167290U JP5167290U JPH049749U JP H049749 U JPH049749 U JP H049749U JP 5167290 U JP5167290 U JP 5167290U JP 5167290 U JP5167290 U JP 5167290U JP H049749 U JPH049749 U JP H049749U
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- thermal head
- wiring
- place
- external circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は一実施例を示す垂直断面図、第２図は
同実施例の底面図であり、第１図は第２図のＡ−
Ａ線位置で切断した状態を表わしている。第３図
は同実施例の端子の一例を示す図、第４図は同実
施例における等倍センサ部を示す回路図、第５図
は同実施例におけるサーマルヘツド部の一例を示
す回路図である。
２……支持フレーム、４……ＬＥＤアレー、８
……センサＩＣチツプ、１０……プリント配線板
、１２……収束性ロツドレンズアレイ、１４……
サーマルヘツドの駆動用ＩＣチツプ、１６……発
熱基板、１８……封止用樹脂、２０，２６……電
子部品、３０，３４……コネクタ。
FIG. 1 is a vertical sectional view showing one embodiment, FIG. 2 is a bottom view of the same embodiment, and FIG.
It shows the state cut at the A line position. FIG. 3 is a diagram showing an example of a terminal in the same embodiment, FIG. 4 is a circuit diagram showing an equal-size sensor section in the same embodiment, and FIG. 5 is a circuit diagram showing an example of a thermal head section in the same embodiment. be. 2... Support frame, 4... LED array, 8
...Sensor IC chip, 10...Printed wiring board, 12...Convergent rod lens array, 14...
IC chip for driving the thermal head, 16... heat generating board, 18... sealing resin, 20, 26... electronic component, 30, 34... connector.
Claims (1)
ムに取りつけ、等倍センサのセンサＩＣとサーマ
ルヘツドの双方の信号用配線と給電用配線を同一
プリント配線板により形成している読取り書込み
装置。 (2) センサＩＣとサーマルヘツドの双方の信号
用配線の入力端子及び出力端子を一箇所に集めて
共通のコネクタを介して外部回路と接続されるよ
うにし、センサＩＣとサーマルヘツドの双方の給
電用配線の入力端子も一箇所に集めて共通のコネ
クタを介して外部回路と接続されるようにした請
求項１に記載の読取り書込み装置。[Scope of claim for utility model registration] (1) A 1-size sensor and a thermal head are mounted on the same frame, and signal wiring and power supply wiring for both the sensor IC of the 1-size sensor and the thermal head are formed on the same printed wiring board. read/write device. (2) Gather the input and output terminals of the signal wiring for both the sensor IC and the thermal head in one place and connect them to the external circuit via a common connector to supply power to both the sensor IC and the thermal head. 2. The reading/writing device according to claim 1, wherein the input terminals of the wiring are also gathered in one place and connected to an external circuit via a common connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5167290U JPH049749U (en) | 1990-05-16 | 1990-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5167290U JPH049749U (en) | 1990-05-16 | 1990-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH049749U true JPH049749U (en) | 1992-01-28 |
Family
ID=31571317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5167290U Pending JPH049749U (en) | 1990-05-16 | 1990-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH049749U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019034465A (en) * | 2017-08-15 | 2019-03-07 | アオイ電子株式会社 | Thermal head |
-
1990
- 1990-05-16 JP JP5167290U patent/JPH049749U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019034465A (en) * | 2017-08-15 | 2019-03-07 | アオイ電子株式会社 | Thermal head |
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