JPH0499537U - - Google Patents

Info

Publication number
JPH0499537U
JPH0499537U JP1991006545U JP654591U JPH0499537U JP H0499537 U JPH0499537 U JP H0499537U JP 1991006545 U JP1991006545 U JP 1991006545U JP 654591 U JP654591 U JP 654591U JP H0499537 U JPH0499537 U JP H0499537U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1991006545U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1991006545U priority Critical patent/JPH0499537U/ja
Publication of JPH0499537U publication Critical patent/JPH0499537U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP1991006545U 1991-01-23 1991-01-23 Pending JPH0499537U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1991006545U JPH0499537U (ja) 1991-01-23 1991-01-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1991006545U JPH0499537U (ja) 1991-01-23 1991-01-23

Publications (1)

Publication Number Publication Date
JPH0499537U true JPH0499537U (ja) 1992-08-27

Family

ID=31737902

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1991006545U Pending JPH0499537U (ja) 1991-01-23 1991-01-23

Country Status (1)

Country Link
JP (1) JPH0499537U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994024699A1 (fr) * 1993-04-08 1994-10-27 Citizen Watch Co., Ltd. Dispositif semi-conducteur

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994024699A1 (fr) * 1993-04-08 1994-10-27 Citizen Watch Co., Ltd. Dispositif semi-conducteur

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