JPH051076Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor mounting case suitable for application to, for example, a mounting case for a high-power semiconductor device.

Conventionally, flat cases and stand-type cases are commonly used as mounting methods for high-power semiconductor devices, but devices using these cases are used under pressure of several hundred kilograms or more per square centimeter. It is normal to do so.

In addition, when brazing semiconductor elements with temperature compensating plates such as Mo and W, and case metal plates, use
So-called hard solders such as AuSi, ApSb, or AlSi are often used.

Generally, when mounting these high-power semiconductor devices, extremely high thickness accuracy, ie, parallelism, of the device and other metal plates is generally required because high pressure loads are applied.

The above are points to keep in mind when mounting one element, but when a plurality of elements are mounted in parallel in the same case, it becomes extremely difficult to manufacture using conventional methods.

In view of these points, the present invention provides a case for semiconductor mounting that has a structure that allows mounting of multiple elements in the same case extremely easily without having to worry about parallelism as much as in the past. The main purpose is to

The subject matter of the present invention is a semiconductor mounting case comprising a hemispherical metal block to which a semiconductor device is brazed, and a metal plate having a hemispherical recess having the same curvature as the metal block.

An embodiment of the present invention will be further described in detail below with reference to the drawings.

1 and 2 show an exploded view and a sectional view, respectively, of a mounting case for a single device according to the present invention. In the figure, 1 is a semiconductor element, 2 is a temperature compensation plate, 3 is a concave hemispherical metal block (for example, Cu, etc.), and 4 is block 3.
2' is an upper temperature compensating plate, and 6 is an upper metal plate (upper electrode).

Figure 3 shows a case for mounting three elements in parallel.
The structure is such that the electrodes are arranged in parallel on a large lower electrode 4'.

FIG. 4 is a diagram for explaining the state in which pressure is applied to one element. Figure A shows a case where the thickness of the solder material 7 is unevenly distributed, and a load F is applied to the upper electrode plate 6. This is a diagram to be added. Figure B shows a state in which the load F is completely applied and the element and temperature compensating plate 2 are pressed between the upper electrode 6 and the lower electrode 4. In this case, the hemispherical block 3 rotates in the direction of the arrow along the curved surface 5 of the lower electrode 4, and the main planes of the upper electrode plate 6 and the lower electrode plate 4 become exactly parallel. Then, the weight F is divided into normal components f of the weight in the normal direction perpendicular to the plane at the curvature surface 5 portion.

Note that the above example can be applied not only to the case of a flat case but also to the case of a stud case, and the hemispherical metal block does not necessarily have to be a hemisphere.
It goes without saying that the same effect can be obtained if it has a surface that fits the curvature surface 5 of.

As described above, according to the present invention, a hemispherical metal block to which a semiconductor device is brazed, a lower electrode plate having a hemispherical recess having the same curvature as the hemispherical surface of the metal block and sliding relative to each other, and a semiconductor device In a semiconductor mount case composed of an upper electrode plate that is pressed in contact with the upper surface, when the contact surface with the semiconductor device is inclined when the upper electrode plate is pressed, the hemispherical surface of the hemispherical metal block is pressed against the lower electrode plate. Since the structure was configured so that the pressure force from the upper electrode plate was evenly applied to the semiconductor device by causing slippage on the hemispherical concave surface and eliminating the above-mentioned inclination, the parallelism of each part due to brazing was outside the permissible range. Even if a hemispherical metal block is used, since the hemispherical metal block slides against the lower electrode to eliminate the inclination, there is no need to ensure strict brazing accuracy during the manufacturing stage, resulting in a reduction in man-hours. Become. Furthermore, no matter how the thickness distribution of the mounted semiconductor device, upper and lower temperature compensator plates, and solder material is, it is ensured that they are all equally pressurized, and there is no need to pay attention to thickness accuracy like in the past. No,
The solder material does not necessarily have to be hard solder,
A reduction in working temperature is also possible.

Furthermore, in the case of mounting a plurality of high-power semiconductor devices in parallel in the same case with the aim of achieving even higher power, this method is extremely effective since it is possible to apply an equal load to all the devices.

[Brief explanation of the drawing]

Figures 1 and 2 are an exploded view and a sectional view of a case for mounting a single element, Figure 3 is a schematic diagram of the case of the present invention for mounting three elements in parallel as an example of mounting multiple elements in parallel, and Figure 4 A and B are schematic diagrams for explaining the state when a load is applied to the element mounted on the case of the present invention. 1... Semiconductor element, 2, 2'... Temperature compensation plate,
3... Hemispherical metal block, 4, 4'... Lower electrode metal block, 5... Curved surface, 6... Upper electrode metal, 7... Brazing material.

Claims (1)

[Claims for Utility Model Registration] 1. A hemispherical metal block to which a semiconductor device is brazed, a lower electrode plate having a hemispherical recess that has the same curvature as the hemispherical surface of the metal block and slides against each other, and a semiconductor device. In a case for a semiconductor mount consisting of an upper electrode plate that is pressed in contact with the upper surface, when the contact surface with the semiconductor device is tilted when the upper electrode plate is pressed, the hemispherical surface of the hemispherical metal block is pressed against the hemispherical surface of the lower electrode plate. 1. A case for a semiconductor mount, characterized in that the case is configured to cause sliding on a concave surface to eliminate the above-mentioned inclination so that a pressing force from an upper electrode plate is evenly applied to a semiconductor device. 2. The semiconductor mount according to claim 1, wherein the lower electrode plate has a plurality of hemispherical recesses on which a plurality of hemispherical metal blocks each having an upper electrode plate and a semiconductor device brazed thereon are formed. Case.