JPH05110268A - Sealed mounting printed wiring board - Google Patents
Sealed mounting printed wiring boardInfo
- Publication number
- JPH05110268A JPH05110268A JP26471291A JP26471291A JPH05110268A JP H05110268 A JPH05110268 A JP H05110268A JP 26471291 A JP26471291 A JP 26471291A JP 26471291 A JP26471291 A JP 26471291A JP H05110268 A JPH05110268 A JP H05110268A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- electronic
- cured
- injected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】
【目的】 同一距離に対する耐電圧特性が良好であると
ともに、熱放散性の良い、難燃構造の面実装用薄型小型
ボードに適した封止型実装印刷配線板を安価で得る。
【構成】 電子・電気部品を実装した印刷配線板の周囲
にケースをかん合させ、このケース内に同一距離に対す
る耐電圧特性を上げる必要のある空隙を充填するに足り
る必要最少限のシリコンゲルを注入して硬化させ、この
シリコンゲルの上に表面を覆うに足る必要最少限の難燃
性シリコンゴムを注入して硬化させる。
(57) [Abstract] [Purpose] An inexpensive encapsulation type printed wiring board suitable for thin surface mounting small boards with flame retardant structure that has good withstand voltage characteristics for the same distance and good heat dissipation. obtain. [Structure] A case is fitted around a printed wiring board on which electronic / electrical components are mounted, and the minimum necessary amount of silicon gel that is sufficient to fill the voids that need to improve the withstand voltage characteristics for the same distance in this case It is injected and cured, and the minimum necessary flame-retardant silicone rubber sufficient to cover the surface is injected and cured on the silicone gel.
Description
【０００１】[0001]
【産業上の利用分野】この発明は電子・電気部品を実装
し樹脂封止された封止型実装印刷配線板、特に面実装用
小型薄型ボードに適した封止型実装印刷配線板に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an encapsulation type printed wiring board on which electronic / electrical components are mounted and resin-encapsulated, and more particularly to an encapsulation type mounting printed wiring board suitable for a small thin board for surface mounting. is there.
【０００２】[0002]
【従来の技術】図２は、例えば特開昭６３−２８０５２
号に示された従来の樹脂封止型実装印刷配線板の断面図
である。図において、１は印刷配線板、２はケース、３
は印刷配線板１に印刷されたグランドパターン、４は印
刷配線板１に印刷された一次側回路パターン、５は印刷
配線板１に印刷された二次側回路パターン、６は一次側
に実装された電子・電気部品、７は二次側に実装された
電子・電気部品、８は二次側に実装されたトランスや縦
型コンデンサ等の比較的背の高い電子・電気部品、９は
これらの電子・電気部品６、７、８の電極、１０はケー
ス２内に注入されて硬化したシリコンゲル、１１はシリ
コンゲル１０の上に注入されて硬化したエポキシ樹脂で
ある。2. Description of the Related Art FIG. 2 shows, for example, JP-A-63-28052.
FIG. 7 is a cross-sectional view of a conventional resin-sealed type printed wiring board shown in FIG. In the figure, 1 is a printed wiring board, 2 is a case, and 3
Is a ground pattern printed on the printed wiring board 1, 4 is a primary side circuit pattern printed on the printed wiring board 1, 5 is a secondary side circuit pattern printed on the printed wiring board 1, and 6 is mounted on the primary side. Electronic / electrical parts, 7 is an electronic / electrical part mounted on the secondary side, 8 is a relatively taller electronic / electrical part such as a transformer or a vertical capacitor mounted on the secondary side, and 9 are these. Electrodes 10 of the electronic / electrical parts 6, 7 and 8 are silicon gels which are injected and cured in the case 2, and 11 is an epoxy resin which is injected and cured on the silicon gel 10.
【０００３】上記の封止型実装印刷配線板は、印刷配線
板１に印刷された一次側回路パターン４および二次側回
路パターン５に、電子・電気部品６、７、８の電極９を
接続する（以下、前記作業の終了した印刷配線板を実装
済配線板と呼ぶ）。前記実装済配線板における一次側回
路パターン４、および一次側回路パターン４に接続され
た電子・電気部品６の電極９、ならびにグランドパター
ン３および二次側回路パターン５に接続された電子・電
気部品７、８の電極９の耐電圧特性を上げるために、ケ
ース２を印刷配線板の周囲にかん合させ、シリコンゲル
１０を注入して硬化させる。次にシリコンゲル１０の上
にエポキシ樹脂１１を注入して硬化させる。In the above-mentioned sealed mounting printed wiring board, the electrodes 9 of the electronic / electrical components 6, 7, 8 are connected to the primary side circuit pattern 4 and the secondary side circuit pattern 5 printed on the printed wiring board 1. (Hereinafter, the printed wiring board on which the work has been completed is referred to as a mounted wiring board). The primary side circuit pattern 4 on the mounted wiring board, the electrode 9 of the electronic / electrical component 6 connected to the primary side circuit pattern 4, and the electronic / electrical component connected to the ground pattern 3 and the secondary side circuit pattern 5. In order to improve the withstand voltage characteristics of the electrodes 9 of 7 and 8, the case 2 is fitted around the printed wiring board, and the silicon gel 10 is injected and cured. Next, the epoxy resin 11 is injected onto the silicon gel 10 and cured.
【０００４】図３ないし図５は他の従来の封止型実装印
刷配線板の断面図である。図３では、図２と同様に電子
・電気部品６〜８を実装した印刷配線板１にケース２を
かん合させ、シリコンゲル１０を注入して硬化させてい
る。図４では、図３のケース２に、空隙１２を形成する
ように蓋１３を被せている。図５では、図３のシリコン
ゲル１０の代りにシリコンゴム１４を注入して硬化させ
ている。FIGS. 3 to 5 are sectional views of another conventional sealed mounting printed wiring board. In FIG. 3, as in FIG. 2, the case 2 is engaged with the printed wiring board 1 on which the electronic / electrical components 6 to 8 are mounted, and the silicon gel 10 is injected and cured. In FIG. 4, the case 2 of FIG. 3 is covered with the lid 13 so as to form the gap 12. In FIG. 5, instead of the silicon gel 10 of FIG. 3, silicon rubber 14 is injected and cured.
【０００５】[0005]
【発明が解決しようとする課題】従来の封止型実装印刷
配線板は以上のように構成されているので、図２の場合
は、エポキシ樹脂１１の硬化収縮、および温度差によっ
て生じる応力による特性劣化を避けるためにシリコンゲ
ル１０を厚くする必要がある。また図３の場合は、ホコ
リの付着による特性劣化が起こる。これを避けるために
は、図４のように蓋１３をする必要があるが、蓋１３を
した場合にはシリコンゲル１０と蓋１３の間に生じる空
隙１２による熱放散の劣化が生じる。図５の場合は密着
性が悪く、また流動性が悪いためボイドが発生し、これ
により、耐電圧特性の向上が低い等の問題点があった。Since the conventional encapsulation-type printed wiring board is constructed as described above, in the case of FIG. 2, the characteristics due to the curing shrinkage of the epoxy resin 11 and the stress caused by the temperature difference. It is necessary to make the silicon gel 10 thick in order to avoid deterioration. Further, in the case of FIG. 3, characteristic deterioration occurs due to adhesion of dust. In order to avoid this, it is necessary to cover the lid 13 as shown in FIG. 4. However, when the lid 13 is used, heat dissipation is deteriorated due to the void 12 generated between the silicon gel 10 and the lid 13. In the case of FIG. 5, voids are generated due to poor adhesion and poor fluidity, which causes problems such as low improvement in withstand voltage characteristics.
【０００６】この発明は上記のような問題点を解決する
ためになされたもので、同一距離に対する耐電圧特性が
良好であるとともに、熱放散性が良く、難燃構造の封止
型実装印刷配線板を得ることを目的としている。The present invention has been made in order to solve the above-mentioned problems, and has good withstand voltage characteristics at the same distance, good heat dissipation, and flame-retardant structure sealed type printed wiring. The purpose is to get a plate.
【０００７】[0007]
【課題を解決するための手段】この発明の封止型実装印
刷配線板は、電子・電気部品を実装した印刷配線板と、
前記電子・電気部品を囲むように印刷配線板の周囲に設
けられたケースと、前記印刷配線板の回路部分および実
装部品を封止するようにケース内に注入されて硬化した
シリコンゲルと、このシリコンゲルの表面を覆うように
ケース内に注入されて硬化した難燃性シリコンゴムとを
備えたものである。A sealed type printed wiring board according to the present invention is a printed wiring board on which electronic / electrical components are mounted,
A case provided around the printed wiring board so as to surround the electronic / electrical component, and a silicon gel which is injected and cured in the case so as to seal the circuit portion and the mounted components of the printed wiring board, And a flame-retardant silicone rubber which is injected into the case and cured so as to cover the surface of the silicone gel.
【０００８】[0008]
【作用】この発明の封止型実装印刷配線板は、電子・電
気部品を実装した印刷配線板にケースをかん合し、耐圧
特性の向上を必要とする空隙に、シリコンゲルの前記空
隙が充満するに足りる必要最少限度の量を注入して硬化
させ、硬化したシリコンゲルの上に難燃性シリコンゴム
を注入して、前記シリコンゲルの表面を難燃性シリコン
ゴムで覆い、これを硬化させて製造される。In the sealed printed wiring board of the present invention, the case is fitted to the printed wiring board on which electronic / electrical components are mounted, and the voids requiring improvement of pressure resistance are filled with the voids of silicon gel. Inject the minimum amount necessary to cure and cure, inject flame-retardant silicone rubber on the cured silicone gel, cover the surface of the silicone gel with flame-retardant silicone rubber, and cure it Manufactured.
【０００９】こうして得られる封止型実装印刷配線板
は、シリコンゲルの表面を難燃性シリコンゴムで覆って
いるため、難燃構造になっている。また、実装済配線板
はシリコンゲルと難燃性シリコンゴムで封止されている
ので、双方とも温度差および硬化収縮による電子・電気
部品に対する応力が少なく、応力による電子・電気部品
の特性劣化が小さい。The encapsulation-type printed wiring board thus obtained has a flame-retardant structure because the surface of silicon gel is covered with flame-retardant silicone rubber. In addition, since the mounted wiring board is sealed with silicon gel and flame-retardant silicone rubber, there is little stress on the electronic and electrical parts due to temperature difference and curing shrinkage. small.
【００１０】したがって印刷配線板に実装されている電
子・電気部品の高低に関係なく、耐圧特性の向上を必要
とする空隙が充満するに足りる必要最少限の量のシリコ
ンゲルを注入し、前記シリコンゲルの表面を覆う必要最
少限度の量の難燃性シリコンゴムを形成すれば良いた
め、小型、薄型化が可能となり、使用樹脂量も少なく、
製造費用も低減する。Therefore, regardless of the height of the electronic / electrical components mounted on the printed wiring board, the minimum necessary amount of silicon gel sufficient to fill the voids required to improve the pressure resistance is injected, and the silicon Since it is only necessary to form the minimum necessary amount of flame-retardant silicone rubber that covers the surface of the gel, it is possible to make it smaller and thinner, and use less resin.
Manufacturing costs are also reduced.
【００１１】また、この封止型実装印刷配線板は蓋を使
用していないため、設計上または作業のバラツキによっ
て生ずる蓋と封止樹脂との空隙による、電子・電気部品
より発生する熱のこもりもなく、放熱性の良い実装印刷
配線板が得られる。Further, since the lid of this encapsulation-type printed wiring board is not used, the heat from the electronic / electrical components is retained due to the gap between the lid and the encapsulation resin caused by the design or work variations. In addition, a mounted printed wiring board having good heat dissipation can be obtained.
【００１２】[0012]
【実施例】以下この発明の一実施例を図について説明す
る。図１は実施例の封止型実装印刷配線板を示す断面図
であり、図において、１は印刷配線板、２は印刷配線板
１の周囲にかん合するケース、３は印刷配線板１に印刷
されたグランドパターン、４は印刷配線板１に印刷され
た一次側回路パターン、５は印刷配線板１に印刷された
二次側回路パターン、６は一次側に実装された電子・電
気部品、７は二次側に実装された電子・電気部品、８は
二次側に実装されたトランスや縦型コンデンサ等の比較
的背の高い電子・電気部品、９は電子・電気部品６〜８
の電極、１０は印刷配線板１の回路部分および実装部品
を封入するようにケース２に注入されて硬化したシリコ
ンゲル、１５はシリコンゲル１０の表面を覆うようにケ
ース２内に注入されて硬化した難燃性シリコンゴムであ
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view showing a sealed mounting printed wiring board of the embodiment. In the figure, 1 is a printed wiring board, 2 is a case fitted around the printed wiring board 1, and 3 is a printed wiring board 1. A printed ground pattern, 4 is a primary side circuit pattern printed on the printed wiring board 1, 5 is a secondary side circuit pattern printed on the printed wiring board 1, 6 is an electronic / electrical component mounted on the primary side, 7 is an electronic / electrical component mounted on the secondary side, 8 is a relatively taller electronic / electrical component such as a transformer or a vertical capacitor mounted on the secondary side, 9 is an electronic / electrical component 6-8.
, 10 is a silicon gel that is injected and cured in the case 2 so as to enclose the circuit part and the mounting parts of the printed wiring board 1, and 15 is injected and cured in the case 2 so as to cover the surface of the silicon gel 10. Made of flame-retardant silicone rubber.
【００１３】上記の封止型実装印刷配線板は、図２ない
し図５と同様に、印刷配線板１に電子・電気部品６〜９
を実装し、これらの実装部品を囲むように、印刷配線板
１の周囲にケース２をかん合した実装済配線板に、一次
・二次回路およびグランド間の耐電圧特性を上げるため
に、一次側回路パターン４および一次側回路パターン４
に接続された電子・電気部品６の電極９、ならびにグラ
ンドパターン３および二次側回路パターン５、二次側回
路パターン５に接続された電子・電気部品７、８の電極
９が覆われ、かつ同一距離に対する耐電圧特性を上げる
必要のある空隙が充填されるに足る必要最少限度のシリ
コンゲル１０を注入して硬化させる。この作業終了後、
シリコンゲル１０の表面へのホコリの付着を少なくし、
かつ難燃構造にするために、前記シリコンゲルの表面を
覆うに足る必要最少限度の難燃性シリコンゴム１５を注
入して硬化させる。In the above-mentioned sealed type printed wiring board, electronic / electrical components 6 to 9 are provided on the printed wiring board 1 as in FIGS.
In order to improve the withstand voltage characteristics between the primary / secondary circuit and the ground on the mounted wiring board in which the case 2 is fitted around the printed wiring board 1 so as to surround these mounted components. Side circuit pattern 4 and primary side circuit pattern 4
The electrode 9 of the electronic / electrical component 6 connected to the, and the electrodes 9 of the ground / pattern 3 and the secondary side circuit pattern 5 and the electronic / electrical components 7 and 8 connected to the secondary side circuit pattern 5, and The minimum necessary amount of silicon gel 10 sufficient to fill the voids for which the withstand voltage characteristic needs to be improved for the same distance is injected and cured. After this work,
Reduces the adhesion of dust to the surface of the silicon gel 10,
In addition, in order to obtain a flame-retardant structure, the minimum necessary flame-retardant silicone rubber 15 sufficient to cover the surface of the silicone gel is injected and cured.
【００１４】[0014]
【発明の効果】以上のように、この発明によれば、実装
配線板にシリコンゲルを注入して硬化させ、その表面に
難燃性シリコンゴムを注入して硬化させるようにしたの
で、同一距離に対する耐電圧特性が良好で、熱放散性が
良く、難燃構造で、ホコリの付着による劣化がなく、薄
型、小型の表面実装ボードに適した封止型実装印刷配線
板が安価にできる効果がある。As described above, according to the present invention, the silicon gel is injected into the mounting wiring board to be cured, and the flame-retardant silicone rubber is injected to the surface of the mounting wiring board to be cured. It has good withstand voltage characteristics, good heat dissipation, flame-retardant structure, no deterioration due to dust adhesion, and the effect of being able to inexpensively make a sealed mounting printed wiring board suitable for thin and small surface mounting boards. is there.
【図１】一実施例の封止型実装印刷配線板の断面図。FIG. 1 is a cross-sectional view of a sealed mounting printed wiring board according to an embodiment.
【図２】従来の封止型実装印刷配線板の断面図。FIG. 2 is a cross-sectional view of a conventional sealed mounting printed wiring board.
【図３】従来の封止型実装印刷配線板の断面図。FIG. 3 is a cross-sectional view of a conventional sealed mounting printed wiring board.
【図４】従来の封止型実装印刷配線板の断面図。FIG. 4 is a cross-sectional view of a conventional sealed mounting printed wiring board.
【図５】従来の封止型実装印刷配線板の断面図。FIG. 5 is a cross-sectional view of a conventional sealed mounting printed wiring board.
１ 印刷配線板 ２ ケース ３ グランドパターン ４ 一次側回路パターン ５ 二次側回路パターン ６、７、８ 電子・電気部品 ９ 電極 １０ シリコンゲル １２ 空隙 １５ 難燃性シリコンゴム 1 Printed Wiring Board 2 Case 3 Ground Pattern 4 Primary Circuit Pattern 5 Secondary Circuit Pattern 6, 7, 8 Electronic / Electrical Parts 9 Electrode 10 Silicon Gel 12 Void 15 Flame Retardant Silicon Rubber
Claims (1)
と、前記電子・電気部品を囲むように印刷配線板の周囲
に設けられたケースと、前記印刷配線板の回路部分およ
び実装部品を封止するようにケース内に注入されて硬化
したシリコンゲルと、このシリコンゲルの表面を覆うよ
うにケース内に注入されて硬化した難燃性シリコンゴム
とを備えたことを特徴とする封止型実装印刷配線板。1. A printed wiring board on which electronic / electrical components are mounted, a case provided around the printed wiring board so as to surround the electronic / electrical components, a circuit portion of the printed wiring board, and mounted components are sealed. A sealing mold comprising: a silicone gel which is injected into the case so as to be stopped and cured; and a flame-retardant silicone rubber which is injected into the case and cured so as to cover the surface of the silicone gel. Mounted printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26471291A JPH05110268A (en) | 1991-10-14 | 1991-10-14 | Sealed mounting printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26471291A JPH05110268A (en) | 1991-10-14 | 1991-10-14 | Sealed mounting printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05110268A true JPH05110268A (en) | 1993-04-30 |
Family
ID=17407141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26471291A Pending JPH05110268A (en) | 1991-10-14 | 1991-10-14 | Sealed mounting printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05110268A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005057875A (en) * | 2003-08-04 | 2005-03-03 | Mitsubishi Electric Corp | Inverter device |
| JP2006316754A (en) * | 2005-05-16 | 2006-11-24 | Mitsubishi Heavy Ind Ltd | Vehicular motor-driven compressor |
| EP1729554A3 (en) * | 2005-05-31 | 2007-08-01 | Fujitsu Limited | Soldering method, electronic part, and part-exchanging method |
| WO2009090693A1 (en) * | 2008-01-15 | 2009-07-23 | Panasonic Corporation | Circuit board module and electronic apparatus |
| US8059411B2 (en) * | 2009-07-29 | 2011-11-15 | GM Global Technology Operations LLC | Vehicular electronics assembly |
| JP2015043366A (en) * | 2013-08-26 | 2015-03-05 | 株式会社デンソー | Electronic apparatus |
-
1991
- 1991-10-14 JP JP26471291A patent/JPH05110268A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005057875A (en) * | 2003-08-04 | 2005-03-03 | Mitsubishi Electric Corp | Inverter device |
| JP2006316754A (en) * | 2005-05-16 | 2006-11-24 | Mitsubishi Heavy Ind Ltd | Vehicular motor-driven compressor |
| EP1729554A3 (en) * | 2005-05-31 | 2007-08-01 | Fujitsu Limited | Soldering method, electronic part, and part-exchanging method |
| WO2009090693A1 (en) * | 2008-01-15 | 2009-07-23 | Panasonic Corporation | Circuit board module and electronic apparatus |
| US8154876B2 (en) | 2008-01-15 | 2012-04-10 | Panasonic Corporation | Circuit board module and electronic apparatus |
| US8059411B2 (en) * | 2009-07-29 | 2011-11-15 | GM Global Technology Operations LLC | Vehicular electronics assembly |
| JP2015043366A (en) * | 2013-08-26 | 2015-03-05 | 株式会社デンソー | Electronic apparatus |
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