JPH05116264A - Manufacture of phenol-resin laminated board - Google Patents
Manufacture of phenol-resin laminated boardInfo
- Publication number
- JPH05116264A JPH05116264A JP28170791A JP28170791A JPH05116264A JP H05116264 A JPH05116264 A JP H05116264A JP 28170791 A JP28170791 A JP 28170791A JP 28170791 A JP28170791 A JP 28170791A JP H05116264 A JPH05116264 A JP H05116264A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- component
- cresol
- phenol
- aldehyde
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000005011 phenolic resin Substances 0.000 title claims description 9
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims abstract description 46
- 150000001299 aldehydes Chemical class 0.000 claims abstract description 14
- 238000001035 drying Methods 0.000 claims abstract description 12
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000003054 catalyst Substances 0.000 claims abstract description 8
- 239000003377 acid catalyst Substances 0.000 claims abstract description 7
- 150000002989 phenols Chemical class 0.000 claims abstract description 5
- 229920005989 resin Polymers 0.000 claims description 36
- 239000011347 resin Substances 0.000 claims description 36
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 claims description 14
- 150000001896 cresols Chemical class 0.000 claims description 10
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 8
- 229930003836 cresol Natural products 0.000 claims description 8
- 229920001568 phenolic resin Polymers 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 abstract description 27
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 abstract description 12
- 239000003921 oil Substances 0.000 abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 8
- 229920003987 resole Polymers 0.000 abstract description 7
- 229930040373 Paraformaldehyde Natural products 0.000 abstract description 5
- 229920002866 paraformaldehyde Polymers 0.000 abstract description 5
- 229920003986 novolac Polymers 0.000 abstract description 4
- 239000003960 organic solvent Substances 0.000 abstract description 4
- 239000002383 tung oil Substances 0.000 abstract description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 10
- 239000000203 mixture Substances 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 235000019256 formaldehyde Nutrition 0.000 description 8
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 8
- 238000003786 synthesis reaction Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 238000004080 punching Methods 0.000 description 6
- 239000004744 fabric Substances 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RCHKEJKUUXXBSM-UHFFFAOYSA-N n-benzyl-2-(3-formylindol-1-yl)acetamide Chemical compound C12=CC=CC=C2C(C=O)=CN1CC(=O)NCC1=CC=CC=C1 RCHKEJKUUXXBSM-UHFFFAOYSA-N 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- NUJGJRNETVAIRJ-UHFFFAOYSA-N octanal Chemical compound CCCCCCCC=O NUJGJRNETVAIRJ-UHFFFAOYSA-N 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 241000894007 species Species 0.000 description 2
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 235000010678 Paulownia tomentosa Nutrition 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- SQYNKIJPMDEDEG-UHFFFAOYSA-N paraldehyde Chemical compound CC1OC(C)OC(C)O1 SQYNKIJPMDEDEG-UHFFFAOYSA-N 0.000 description 1
- 229960003868 paraldehyde Drugs 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は印刷配線基板、電気絶縁
基板等に用いられるフェノール樹脂積層板の製造法に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a phenol resin laminate used for printed wiring boards, electrically insulating boards and the like.
【0002】[0002]
【従来の技術】最近、絶縁材料、特に通信機および電子
機器に使用される積層板および銅張積層板は、加工設備
の自動化、省エネルギー等の観点から常温又は常温付近
の比較的低温での打抜き加工性の優れたものが要求され
ている。このため、通常、積層板用樹脂としては各種の
アルキルフェノールをフェノールと併用し、乾性油等で
変性したフェノール・ホルムアルデヒド樹脂が使用され
ている。2. Description of the Related Art Recently, insulating materials, especially laminated plates and copper-clad laminated plates used for communication devices and electronic equipment, are punched at room temperature or at a relatively low temperature near room temperature from the viewpoint of automation of processing equipment and energy saving. Those with excellent workability are required. For this reason, a phenol / formaldehyde resin obtained by modifying various alkylphenols with phenol and modifying them with a drying oil is usually used as the resin for the laminate.
【0003】しかし、乾性油で変性したフェノール・ホ
ルムアルデヒド樹脂は乾性油による変性のため硬化速度
が遅く、架橋密度も低下するため、積層板中の樹脂は硬
化不足になりやすく、耐熱性、機械強度、耐水性、等の
特性が低下する。また、打抜き加工の際には、架橋密度
が低いため層間剥離等が発生しやすい。即ち、従来の乾
性油ーフェノール類の反応物は乾性油に対するフェノー
ルの付加モル数が低く、また乾性油の重合物を生成する
ため、ホルムアルデヒドとの反応、即ち樹脂化反応及び
硬化反応において、反応速度及び硬化速度が低下し、諸
特性低下の原因になっていた。However, the phenol-formaldehyde resin modified with a drying oil has a slow curing rate due to the modification with a drying oil and the crosslink density is lowered, so that the resin in the laminated plate is apt to be insufficiently cured, and the heat resistance and the mechanical strength thereof are high. , Water resistance, etc. are deteriorated. Also, during punching, delamination and the like are likely to occur due to the low crosslink density. That is, since the conventional drying oil-phenols reaction product has a low number of moles of phenol added to the drying oil and produces a polymer of the drying oil, the reaction rate in the reaction with formaldehyde, that is, the resinification reaction and the curing reaction, is high. In addition, the curing speed was lowered, which was a cause of deterioration of various properties.
【0004】この硬化性改良法としてフェノールとホル
ムアルデヒドとを酸触媒の存在下で反応させた反応生成
物を乾性油変性フェノール・ホルムアルデヒド樹脂に添
加する方法(特開昭61ー121932号公報)が提案
されている。この方法により若干の硬化性向上はみられ
るが、打抜き加工性、強靱性等の点において最近積層板
に要求されているレベルに対し未だ不十分なものであ
る。As a method for improving the curability, a method is proposed in which a reaction product obtained by reacting phenol and formaldehyde in the presence of an acid catalyst is added to a drying oil-modified phenol-formaldehyde resin (JP-A-61-21932). Has been done. Although a slight improvement in curability can be observed by this method, it is still insufficient in terms of punching workability, toughness, etc. with respect to the level recently demanded for laminated sheets.
【0005】[0005]
【発明が解決しようとする課題】本発明は、硬化性に優
れ、打抜き加工性、耐水性、電気的特性、機械的特性の
良好なフェノール樹脂積層板の製造法を提供するもので
ある。DISCLOSURE OF THE INVENTION The present invention provides a method for producing a phenol resin laminate having excellent curability, punching workability, water resistance, electrical properties and mechanical properties.
【0006】[0006]
【課題を解決するための手段】本発明は、積層板用基材
に含浸する樹脂として下記(A)成分を下記(B)成分
に添加した樹脂成分を使用するものである。 (A)クレゾール類とアルデヒド類とを酸触媒存在下で
反応させてノボラック型クレゾール・アルデヒド樹脂を
合成し、さらにそれとアルデヒド類とを塩基性触媒存在
下で反応させて得られるレゾール型クレゾール・アルデ
ヒド樹脂、(B)乾性油変性フェノール・ホルムアルデ
ヒド樹脂。The present invention uses a resin component obtained by adding the following component (A) to the following component (B) as the resin with which the base material for a laminated plate is impregnated. (A) Resol-type cresol-aldehyde obtained by reacting cresols and aldehydes in the presence of an acid catalyst to synthesize a novolak-type cresol-aldehyde resin, and further reacting it with an aldehyde in the presence of a basic catalyst Resin, (B) Dry oil modified phenol / formaldehyde resin.
【0007】ノボラック型クレゾール・アルデヒド樹脂
は、クレゾール類、アルデヒド類、及び酸触媒の混合物
を60から150℃で30分から5時間反応させる方
法、あるいはクレゾール類と酸触媒の混合物を60から
150℃に昇温後、アルデヒド類を15分から3時間か
けて滴下し、さらに反応させる方法等の通常の方法で合
成することができる。クレゾール類としては、o−クレ
ゾール、m−クレゾール及びp−クレゾールから選ばれ
る1種以上が用いられるが、硬化性の点よりクレゾール
類中にm−クレゾールを25%以上含むことが好まし
い。m−クレゾール含有量が25%未満では硬化性が遅
くなる。アルデヒド類としては、ホルマリン、パラホル
ムアルデヒド、トリオキサン等のホルムアルデヒド類や
パラアセトアルデヒド、ブチルアルデヒド、オクチルア
ルデヒド、ベンズアルデヒド等が用いられ、特にホルマ
リン、パラホルムアルデヒドが好ましい。ノボラック型
クレゾール・アルデヒド樹脂を合成する時のクレゾール
類とアルデヒド類の反応モル比は、アルデヒド種、触媒
種、反応温度、反応時間、により異なるが、クレゾール
類1に対してアルデヒド類を0.2から1モル反応させ
るのが好ましい。さらに好ましくは0.3から0.8で
ある。The novolac type cresol-aldehyde resin is prepared by reacting a mixture of cresols, aldehydes and an acid catalyst at 60 to 150 ° C. for 30 minutes to 5 hours, or a mixture of cresols and an acid catalyst at 60 to 150 ° C. After the temperature is raised, aldehydes may be added dropwise over 15 minutes to 3 hours, and further reaction may be performed to synthesize the aldehydes. As the cresols, one or more selected from o-cresol, m-cresol and p-cresol is used, but it is preferable that the cresols contain 25% or more of m-cresol from the viewpoint of curability. If the m-cresol content is less than 25%, the curability will be slow. As the aldehydes, formaldehydes such as formalin, paraformaldehyde and trioxane, paraacetaldehyde, butyraldehyde, octylaldehyde, benzaldehyde and the like are used, and formalin and paraformaldehyde are particularly preferable. The reaction molar ratio of cresols and aldehydes when synthesizing a novolac type cresol-aldehyde resin varies depending on the aldehyde species, the catalyst species, the reaction temperature, and the reaction time. It is preferable to react from 1 to 1 mol. More preferably, it is 0.3 to 0.8.
【0008】レゾール型クレゾール・アルデヒド樹脂
は、前記の反応で得られたノボラック型クレゾール・ア
ルデヒド樹脂とホルマリン、パラホルムアルデヒド等の
アルデヒド類とを塩基性触媒存在下に40〜120℃の
所定温度で反応させた後、メタノール、トルエン等の有
機溶剤で希釈することにより得られる。メタノール、エ
タノール、プロパノール、ブタノール等のアルコール類
やベンゼン、トルエン、キシレン等の芳香族炭化水素系
類、アセトン、メチルエチルケトン、メチルイソブチル
ケトン等のケトン類等の有機溶剤類を反応溶媒として用
いてもよい。The resole-type cresol-aldehyde resin is obtained by reacting the novolak-type cresol-aldehyde resin obtained by the above reaction with aldehydes such as formalin and paraformaldehyde at a predetermined temperature of 40 to 120 ° C. in the presence of a basic catalyst. After that, it is obtained by diluting with an organic solvent such as methanol or toluene. Alcohols such as methanol, ethanol, propanol and butanol, aromatic hydrocarbons such as benzene, toluene and xylene, and organic solvents such as ketones such as acetone, methyl ethyl ketone and methyl isobutyl ketone may be used as a reaction solvent. ..
【0009】アルデヒド類の添加量は、第1段目反応時
の仕込クレゾール類1モルに対してあるいは反応後に未
反応クレゾール類を除去した場合には未反応クレゾール
類除去後の反応混合物中のクレゾール類1モルに対して
0.1〜2.0が好ましく、さらには0.6〜1.4が
好ましい。塩基性触媒としては、アンモニア、トリエチ
ルアミン、エチレンジアミン、ヘキサメチレンテトラミ
ン、トリエタノールアミン等のアミン類、水酸化ナトリ
ウム、水酸化カリウム等のアルカリ金属水酸化物、水酸
化バリウム等が使用できるが、反応生成物中にイオン性
物質を残さないことから、アンモニアおよびアミン類が
好適に用いられる。The amount of aldehyde added is based on 1 mol of the cresols charged during the first step reaction, or when unreacted cresols are removed after the reaction, cresol in the reaction mixture after removal of unreacted cresols. 0.1 to 2.0 is preferable, and 0.6 to 1.4 is more preferable for 1 mol of the group. As the basic catalyst, ammonia, triethylamine, ethylenediamine, hexamethylenetetramine, amines such as triethanolamine, alkali metal hydroxides such as sodium hydroxide and potassium hydroxide, barium hydroxide and the like can be used. Ammonia and amines are preferably used because they do not leave ionic substances in the product.
【0010】乾性油変性フェノール・ホルムアルデヒド
樹脂は、例えば桐油等の乾性油とフェノール類とを酸触
媒で反応させ、さらにホルムアルデヒドと塩基性触媒存
在下で反応させてレゾール化することにより合成でき
る。The dry oil-modified phenol-formaldehyde resin can be synthesized, for example, by reacting a dry oil such as tung oil with a phenol with an acid catalyst, and further reacting formaldehyde with a basic catalyst in the presence of a resol.
【0011】本発明による積層板は、以上のようにして
得られたレゾール型クレゾール・アルデヒド樹脂を有機
溶剤に溶解した後、あるいはそのまま乾性油変性フェノ
ール・ホルムアルデヒド樹脂に添加溶解してワニスと
し、クラフト紙、リンター紙、ガラス布ガラス不織布、
ポリエステル繊維布、アラミド繊維布、帆布等の基材に
含浸乾燥し、通常3〜10枚積層して加熱加圧成形する
ことにより得ることができる。The laminated sheet according to the present invention is prepared by dissolving the resol-type cresol-aldehyde resin obtained as described above in an organic solvent or by directly adding it to a drying oil-modified phenol-formaldehyde resin to form a varnish. Paper, linter paper, glass cloth glass non-woven cloth,
It can be obtained by impregnating and drying a base material such as a polyester fiber cloth, an aramid fiber cloth, and a sail cloth, and usually laminating 3 to 10 sheets and heating and pressing.
【0012】乾性油変性フェノール・ホルムアルデヒド
樹脂に対するレゾール型クレゾール・アルデヒド樹脂の
添加量は、乾性油変性フェノール・ホルムアルデヒド樹
脂100重量部に対して3から50重量部が好ましく、
さらに好ましくは10から35重量%である。3重量部
より少ないと硬化性向上効果が殆どなく、50重量部を
越えると打抜き加工性が低下する。The amount of the resol-type cresol / aldehyde resin added to the dry oil-modified phenol / formaldehyde resin is preferably 3 to 50 parts by weight with respect to 100 parts by weight of the dry oil-modified phenol / formaldehyde resin,
More preferably, it is 10 to 35% by weight. If it is less than 3 parts by weight, there is almost no effect of improving the curability, and if it exceeds 50 parts by weight, the punching workability is deteriorated.
【0013】なお、本発明において、(A)成分及び
(B)成分以外の樹脂を全樹脂成分中50%以内で配合
してもよい。このような樹脂としては未変性のレゾール
樹脂、アルキルフェノールのレゾール樹脂などである。In the present invention, resins other than the components (A) and (B) may be blended within 50% of all resin components. Such resins include unmodified resole resins and alkylphenol resole resins.
【0014】[0014]
【作用】本発明で得られるフェノール樹脂積層板は、そ
のワニス用樹脂成分中に乾性油と結合していない高反応
性のm−クレゾール及び/あるいは可撓性を付与するo
−クレゾール及び/あるいはp−クレゾールを含んでお
り、その高い反応性と可撓性のため硬化性に優れ、打抜
き加工性、耐水性、電気的特性及び機械的特性が良好と
なっていると考えられる。また本発明で用いるレゾール
型クレゾール・アルデヒド樹脂はノボラック型クレゾー
ル・アルデヒド樹脂とアルデヒド類とを反応させて得た
ものであり、通常の合成法で得られるレゾール型クレゾ
ール・アルデヒド樹脂に比べ高分子量になっていると考
えられ、それが一層硬化性を良くしていると考えられ
る。The phenolic resin laminate obtained by the present invention imparts highly reactive m-cresol and / or flexibility which is not combined with the drying oil to the resin component for varnish.
-It contains cresol and / or p-cresol, and is considered to have excellent curability due to its high reactivity and flexibility, and good punching processability, water resistance, electrical properties and mechanical properties. Be done. Further, the resole-type cresol-aldehyde resin used in the present invention is obtained by reacting a novolac-type cresol-aldehyde resin with aldehydes, and has a higher molecular weight than the resol-type cresol-aldehyde resin obtained by an ordinary synthesis method. It is thought that the curability is further improved.
【0015】[0015]
【実施例】以下、実施例をあげて本発明を説明する。
「%」は「重量%」を示す。 (合成例1)m−クレゾール/p−クレゾール比が60/
40のクレゾール混合物3456g、37%ホルマリン
1298g、蓚酸20gの混合物を100℃で3時間反
応後、減圧下で内温が160℃になるまで脱水してノボ
ラック型クレゾール・ホルムアルデヒド樹脂を合成し、
これにメタノール400gを加えて溶解後、トリエチル
アミン40gと37%ホルマリン650gを加えて80
℃で30分間反応させた後メタノール1750gを加え
て冷却し、樹脂分51重量%のレゾール型クレゾール・
アルデヒド樹脂(樹脂1)5470gを得た。EXAMPLES The present invention will be described below with reference to examples.
“%” Indicates “% by weight”. (Synthesis example 1) m-cresol / p-cresol ratio is 60 /
A mixture of 3456 g of cresol mixture of 40, 1298 g of 37% formalin and 20 g of oxalic acid was reacted at 100 ° C. for 3 hours and then dehydrated under reduced pressure until the internal temperature reached 160 ° C. to synthesize a novolac type cresol-formaldehyde resin,
To this, 400 g of methanol was added and dissolved, and then 40 g of triethylamine and 650 g of 37% formalin were added to 80
After reacting at 0 ° C for 30 minutes, 1750 g of methanol was added and cooled to obtain a resol type cresol having a resin content of 51 wt%
5470 g of aldehyde resin (Resin 1) was obtained.
【0016】(合成例2)o−クレゾール/m−クレゾ
ール/p−クレゾール比が67/20/13のクレゾー
ル混合物を用いた以外は合成例1と同様にして樹脂分5
0重量%のレゾール型クレゾール・アルデヒド樹脂(樹
脂2)5490gを得た。(Synthesis Example 2) A resin component 5 was prepared in the same manner as in Synthesis Example 1 except that a cresol mixture having an o-cresol / m-cresol / p-cresol ratio of 67/20/13 was used.
5490 g of 0 wt% resol type cresol aldehyde resin (resin 2) was obtained.
【0017】(合成例3)フェノール940g、37%
ホルマリン649g、35%塩酸2gの混合物を4時間
還流温度で反応後、減圧下で内温が160℃になるまで
脱水し、これをメタノールで溶解して樹脂分50重量%
のフェノール・ホルムアルデヒド樹脂(樹脂3)を得
た。(Synthesis Example 3) 940 g of phenol, 37%
A mixture of 649 g of formalin and 2 g of 35% hydrochloric acid was reacted at reflux temperature for 4 hours, dehydrated under reduced pressure until the internal temperature reached 160 ° C, and dissolved in methanol to obtain a resin content of 50% by weight.
To obtain a phenol-formaldehyde resin (resin 3).
【0018】(合成例4)フェノール1200g、桐油
800g、パラトルエンスルホン酸5gの混合物を80
℃で3時間反応させた。次いでこれにトルエン800g
とトリエタノールアミン20gを添加して希釈、中和
後、パラホルムアルデヒド500g、25%アンモニア
水30gを添加し、90から100℃で4時間反応さ
せ、次いで減圧下、脱水、脱トルエンを行ない、トルエ
ン1000gとメタノール1000gを添加して希釈
し、樹脂分50重量%の桐油変性フェノール・ホルムア
ルデヒド樹脂(樹脂4)を得た。(Synthesis Example 4) 80 g of a mixture of 1200 g of phenol, 800 g of tung oil and 5 g of paratoluenesulfonic acid was used.
The reaction was carried out at ℃ for 3 hours. Then 800 g of toluene
After diluting and neutralizing by adding 20 g of triethanolamine, 500 g of paraformaldehyde and 30 g of 25% ammonia water are added, and the mixture is reacted at 90 to 100 ° C. for 4 hours, then dehydrated and detoluene under reduced pressure. 1000 g and 1000 g of methanol were added and diluted to obtain a tung oil-modified phenol-formaldehyde resin (resin 4) having a resin content of 50% by weight.
【0019】(合成例5)フェノール1000g、37
%ホルマリン9800g、トリエチルアミン20gを混
合して60℃で2時間反応させ、次いで減圧下で濃縮
し、これをメタノール/水=80/20の混合溶剤で希
釈して樹脂分50重量%の水溶性低分子フェノール・ホ
ルムアルデヒド樹脂(樹脂5)を得た。(Synthesis Example 5) Phenol 1000 g, 37
% Formalin 9800 g and triethylamine 20 g are mixed and reacted at 60 ° C. for 2 hours, then concentrated under reduced pressure and diluted with a mixed solvent of methanol / water = 80/20 to reduce the water content of the resin content of 50% by weight. A molecular phenol / formaldehyde resin (resin 5) was obtained.
【0020】[実施例1,2及び比較例1,2]合成例
5で得られた樹脂5をクラフト紙に含浸して乾燥し、樹
脂分10.5%の処理基材を得た。次いでこの処理基材
に表1の配合で、それぞれ別々に調製した上塗りワニス
(樹脂1〜樹脂4)を含浸して乾燥し、全樹脂分56%
のプリプレグを得た。これを8枚積層し、片側に35μ
mの銅箔を重ね合わせ、160℃、80kg/cm2 で
60分間加熱加圧し、厚さ1.6mmのフェノール樹脂
積層板を得た。Examples 1, 2 and Comparative Examples 1, 2 Kraft paper was impregnated with the resin 5 obtained in Synthesis Example 5 and dried to obtain a treated substrate having a resin content of 10.5%. Then, the treated base material was impregnated with the top coating varnish (resin 1 to resin 4) prepared separately according to the composition shown in Table 1 and dried to obtain a total resin content of 56%.
I got a prepreg of. 8 pieces of this are laminated and 35μ on one side
m copper foils were superposed and heated and pressed at 160 ° C. and 80 kg / cm 2 for 60 minutes to obtain a phenol resin laminate having a thickness of 1.6 mm.
【0021】表1に各上塗りワニスの150℃熱盤上で
のゲル化時間と実施例および比較例で得られた積層板の
特性を示す。Table 1 shows the gelling time of each topcoat varnish on a 150 ° C. hot platen and the characteristics of the laminates obtained in Examples and Comparative Examples.
【表1】 [Table 1]
【0022】[0022]
【発明の効果】本発明の製造方法によるフェノール樹脂
積層板は、表1の結果から明らかのように、硬化性に優
れ、打抜加工性、耐水性、電気的特性、機械的特性が良
好であり、印刷配線板、電気絶縁板等に好適に用いるこ
とができる。As is clear from the results shown in Table 1, the phenol resin laminate obtained by the production method of the present invention has excellent curability, punching workability, water resistance, electrical characteristics and mechanical characteristics. Therefore, it can be suitably used for a printed wiring board, an electrical insulating board, and the like.
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成4年1月7日[Submission date] January 7, 1992
【手続補正1】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0019[Name of item to be corrected] 0019
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【0019】(合成例5)フェノール1000g、37
%ホルマリン980g、トリエチルアミン20gを混合
して60℃で2時間反応させ、次いで減圧下で濃縮し、
これをメタノール/水=80/20の混合溶剤で希釈し
て樹脂分50重量%の水溶性低分子フェノール・ホルム
アルデヒド樹脂(樹脂5)を得た。(Synthesis Example 5) Phenol 1000 g, 37
% Formalin 980 g and triethylamine 20 g are mixed and reacted at 60 ° C. for 2 hours, then concentrated under reduced pressure,
This was diluted with a mixed solvent of methanol / water = 80/20 to obtain a water-soluble low molecular weight phenol-formaldehyde resin (resin 5) having a resin content of 50% by weight.
フロントページの続き (72)発明者 伊藤 幹雄 東京都千代田区内幸町1丁目2番2号 住 友ベークライト株式会社内Front page continuation (72) Inventor Mikio Ito 1-2-2 Uchisaiwaicho, Chiyoda-ku, Tokyo Sumitomo Bakelite Co., Ltd.
Claims (3)
した樹脂成分を積層板用基材に含浸乾燥し、積層成形す
ることを特徴とするフェノール樹脂積層板の製造方法。 (A)クレゾール類とアルデヒド類とを酸触媒存在下で
反応させてノボラック型クレゾール・アルデヒド樹脂を
合成し、更にこれをアルデヒド類と塩基性触媒存在下で
反応させて得られるレゾール型クレゾール・アルデヒド
樹脂、(B)乾性油変性フェノール・ホルムアルデヒド
樹脂。1. A method for producing a phenol resin laminate, which comprises impregnating and drying a resin component obtained by adding the following component (A) to the following component (B) into a substrate for a laminate, and forming the laminate. (A) Resol-type cresol-aldehyde obtained by reacting cresols and aldehydes in the presence of an acid catalyst to synthesize a novolak-type cresol-aldehyde resin, and further reacting this with an aldehyde in the presence of a basic catalyst Resin, (B) Dry oil modified phenol / formaldehyde resin.
ゾールを25%以上含有することを特徴とする請求項1
記載のフェノール樹脂積層板の製造方法。2. The cresol of the component (A) contains 25% or more of m-cresol.
A method for producing a phenolic resin laminate as described.
が(B)成分100重量部に対して3から50重量部で
あることを特徴とする請求項1及び2記載のフェノール
樹脂積層板の製造方法。3. The phenol resin laminate according to claim 1, wherein the amount of the component (A) added to the component (B) is 3 to 50 parts by weight with respect to 100 parts by weight of the component (B). Method of manufacturing a plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28170791A JPH05116264A (en) | 1991-10-28 | 1991-10-28 | Manufacture of phenol-resin laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28170791A JPH05116264A (en) | 1991-10-28 | 1991-10-28 | Manufacture of phenol-resin laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05116264A true JPH05116264A (en) | 1993-05-14 |
Family
ID=17642862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28170791A Pending JPH05116264A (en) | 1991-10-28 | 1991-10-28 | Manufacture of phenol-resin laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05116264A (en) |
-
1991
- 1991-10-28 JP JP28170791A patent/JPH05116264A/en active Pending
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