JPH0511677A - Hologram transfer method and transfer sheet used therefor - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To provide a hologram transfer method capable of easily and accurately performing hologram transfer, and a transfer sheet used therefor. A hologram transfer layer is formed on one surface of a support sheet, and the hologram transfer layer is punched into a predetermined pattern. The punching is performed so that the punching holes penetrate the hologram transfer layer and reach the surface of the support sheet. The hologram transfer layer defined by the punched holes is heated and pressed to transfer it onto the transfer material.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer method for transferring a hologram onto a transfer material and a transfer sheet used for the transfer method.

[0002]

2. Description of the Related Art In recent years, in order to improve the decoration of cards such as credit cards, those having a hologram formed on the surface thereof have been used. As a method for forming a hologram, a hologram transfer sheet is used. A method of transferring and forming a hologram on a material to be transferred is used.
As a conventional hologram transfer sheet of this type, one having a hologram transfer layer provided on one surface of a support sheet is used.

[0003]

In carrying out hologram transfer, the technical problem is how to transfer the hologram easily and accurately, but an effective means to solve it has not been established yet. .

[0004]

In order to solve the above-mentioned problems, the present invention forms a hologram transfer layer on a support sheet and punches the hologram transfer layer, thereby punching the hologram transfer layer. It is designed to transfer only the part that has been marked. That is, according to the hologram transfer method of the present invention, when a hologram transfer sheet formed by forming a hologram transfer layer on one surface of a support sheet is used to transfer a hologram onto a material to be transferred, a punching hole penetrates the hologram transfer layer. Then, punching is performed so as to reach the surface of the support sheet, and the hologram transfer layer defined by the punching holes is transferred to the material to be transferred. The hologram transfer sheet of the present invention comprises a support sheet and a hologram transfer layer formed on one surface of the support sheet, and the hologram transfer layer is defined by punching holes provided through the hologram transfer layer. The present invention is characterized in that it has a transferred transfer part.

[0005]

Embodiments of the present invention will now be described with reference to the drawings. As shown in FIG. 1, the hologram transfer sheet 1 of the present invention comprises a support sheet 2 and a hologram transfer layer 3 formed on one surface of the support sheet 2, and the hologram transfer layer 3 is arranged from the support sheet side. It has a laminated structure in which the protective layer 4, the hologram forming layer 5, the light reflecting layer 6, the reinforcing layer 7, and the adhesive layer 8 are laminated in this order.

The support sheet 2 may be made of the same synthetic resin as that used in the conventional transfer sheet, but is preferably made of polyester having both tensile strength and heat resistance.

The material of the protective layer 4 is, for example, a mixture of polymethylmethacrylate resin and other thermoplastic resin such as vinyl chloride / vinyl acetate copolymer or nitrocellulose resin, a mixture of polymethylmethacrylate resin and polyethylene wax. A mixture of a cellulose acetate resin and a thermosetting resin such as an epoxy resin, a phenol resin, a thermosetting acrylic resin or a melamine resin is preferable. The hologram forming layer 5 is a thermoplastic resin such as vinyl chloride, acrylic acid or methacrylic acid resin (for example, methyl methacrylate), polystyrene, polycarbonate; unsaturated polyester resin, melamine resin,
Epoxy resin, polyester acrylate or methacrylate, polyurethane acrylate or methacrylate, epoxy acrylate or methacrylate,
Thermosetting resins such as polyether acrylates or methacrylates, polyol acrylates or methacrylates, melamine acrylates or methacrylates, triazine acrylates; or the above thermoplastic resins,
The hologram forming layer 5 is made of a mixture of thermosetting resins.
The hologram may be formed after forming the resin layer on the protective layer 4, or may be attached to the protective layer 4 after forming the hologram on the resin film or sheet.

The material of the light reflection layer 6 is aluminum,
Examples of the metal include silver, gold, nickel, copper, tin, cobalt and indium, and aluminum is preferable. The light reflecting layer 6 is formed by vapor-depositing the above metal on the hologram forming layer 5 or adhering these metal foils.

The reinforcing layer 7 reinforces the hologram transfer layer 3,
The hologram transfer layer 3 is prevented from being damaged when the transfer sheet is peeled off so that the transfer operation can be performed smoothly. The adhesiveness between the reinforcing layer 7 and other layers in contact with the hologram transfer layer 3 is high, and the tensile strength and tearing are high. It can be formed by selecting a resin having high strength and applying these resins in the form of paint. When the reinforcing layer 7 is formed by applying a paint-like resin, a cellulosic resin having a relatively high tensile strength (tensile strength of about 1000 kg / cm ² )
Vinyl chloride / vinyl acetate copolymers, polyester resins, polyurethane resins, polycaprolactone resins, epoxy resins, phenol resins, melamine resins, etc. can be used. Among them, in terms of adhesiveness with the light reflection layer 6 and the adhesive layer 8. Good vinyl chloride / vinyl acetate copolymers, polyurethane resins, polycaprolactone resins, and polyester resins are preferable. The thickness of the reinforcing layer 7 is preferably 10 to 50 μm in consideration of the total thickness of the hologram transfer layer 3, tensile strength, tear strength and tensile strength of the reinforcing layer 7 itself. If it is less than 10 μm, it is difficult to obtain a desired strength, and if it exceeds 50 μm, the thickness of the hologram transfer layer 3 becomes large, and the hologram transfer sheet 1 becomes bulky when stacked.
This causes problems such as the inclination of the transfer sheet 1, and even after the hologram transfer layer 3 is transferred to the transfer material 10, the transfer sheet 1 is not flush with the transfer material 10.

The reinforcing layer 7 may be formed by laminating a plastic film or a metal foil via an adhesive layer. In this case, as the plastic film, polyethylene, polypropylene, ionomer, cellulose acetate, polyvinyl chloride, polyamide (eg nylon 6, nylon 11
Etc.), polyester, polyurethane, biaxially oriented polyester, polycarbonate and the like, and examples of the metal foil include copper, aluminum and the like. However, the metal foil must be punchable. Among the above-mentioned plastic films, a biaxially stretched polyester resin film is preferable in consideration of tensile strength, tear strength and economical efficiency (price). The tensile strength of the biaxially stretched polyester resin film is 2000 to 4000 kg / cm ² , and the tensile strength of plastic films other than the biaxially stretched polyester film is 20 to 4000 kg / cm ^2.
It is 900 kg / cm ² . The thickness of the plastic film and the metal foil is 10 including the film and the adhesive layer as in the case where the reinforcing layer 7 is formed by applying a paint-like resin.
It is preferably about 50 μm.

The adhesive layer 8 is made of a synthetic resin having a heat-sensitive adhesive property with the material 10 to be transferred, and examples of these resins include polyvinyl acetate resin, vinyl chloride / vinyl acetate copolymer resin, vinyl chloride / propionic acid copolymer. Examples thereof include polymers, rubber resins, cyanoacrylate resins, cellulose resins, ionomer resins, polyolefin copolymers, acrylic resins, alkyd resins and polyvinyl acetal resins.

As described above, on one surface of the support sheet 2, the protective layer 4, the hologram forming layer 5, the light reflecting layer 6, the reinforcing layer 7,
Punching is performed on a sheet obtained by sequentially laminating the adhesive layers 8. This punching is performed so that the punching holes 9 penetrate the hologram transfer layer 3 and reach the surface of the support sheet 2.
As a result of the punching, the transfer structure portion 3a having a desired pattern defined by the punching holes 9 is formed.

In carrying out hologram transfer using the transfer sheet of the present invention, first, as shown in FIG. 2, the transfer sheet 1 of the present invention is superposed on the transfer material 10. Then
The transfer constituent portion 3a of the hologram transfer layer 3 that is partitioned and formed into a desired pattern is heated and pressed to adhere it onto the transfer material 10, and then the transfer sheet 1 is peeled off as shown in FIG. Transfer component 3a of hologram transfer layer 3
Transfer sheet 1 because only the
When peeled off, the transfer component 3a becomes the hologram transfer layer 3
From the transfer component 10 and left on the material 10 to be transferred.
Transfer of a is performed. In this way, the hologram transfer layer having a desired pattern can be transferred onto the transfer material,
If a large number of transfer components 3a are formed at predetermined intervals, the transfer operation can be performed continuously. Therefore, when this is applied to the manufacture of a card with hologram, for example, there is an advantage that continuous production is possible.

[0014]

According to the hologram transfer method of the present invention, the hologram transfer layer is punched and only the hologram transfer layer partitioned by the punched holes is transferred, so that the transfer operation is easy and accurate. There is an effect that can be done. Further, since the hologram transfer layer to be transferred is formed by punching, the hologram transfer layer to be transferred can be easily patterned, and the working efficiency can be improved and continuous production can be performed. Therefore, similarly to the above, the hologram transfer sheet of the present invention has an effect that the hologram transfer operation can be performed easily and accurately and the operation efficiency can be improved.

[Brief description of drawings]

FIG. 1 is a vertical sectional view of a hologram transfer sheet of the present invention.

FIG. 2 is a vertical cross-sectional view showing a state in which the hologram transfer sheet of the present invention is superposed on a transfer material.

FIG. 3 is a perspective view showing a state in which a transfer sheet is peeled off from a transfer material and a hologram layer having a desired pattern is transferred onto the transfer material.

[Explanation of symbols]

1 Hologram transfer sheet 2 Support sheet 3 Hologram transfer layer 3a Transfer component 9 punched holes 10 Transfer material

Claims (2)

[Claims] 1. When a hologram transfer sheet is formed by forming a hologram transfer layer on one surface of a support sheet to transfer a hologram to a material to be transferred, a punching hole penetrates the hologram transfer layer to form a support sheet. And a hologram transfer layer partitioned by the punched holes is transferred to a material to be transferred. 2. A transfer structure comprising a support sheet and a hologram transfer layer formed on one surface of the support sheet, the hologram transfer layer being defined by punching holes penetrating the hologram transfer layer. A hologram transfer sheet having a portion.