JPH0512311B2 - - Google Patents
Info
- Publication number
- JPH0512311B2 JPH0512311B2 JP28094189A JP28094189A JPH0512311B2 JP H0512311 B2 JPH0512311 B2 JP H0512311B2 JP 28094189 A JP28094189 A JP 28094189A JP 28094189 A JP28094189 A JP 28094189A JP H0512311 B2 JPH0512311 B2 JP H0512311B2
- Authority
- JP
- Japan
- Prior art keywords
- gas
- discharge
- plasma
- diamond
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910003460 diamond Inorganic materials 0.000 claims description 26
- 239000010432 diamond Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 15
- 238000005268 plasma chemical vapour deposition Methods 0.000 claims description 5
- 230000002194 synthesizing effect Effects 0.000 claims description 5
- 239000007789 gas Substances 0.000 description 45
- 239000000758 substrate Substances 0.000 description 25
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 18
- 238000006243 chemical reaction Methods 0.000 description 13
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 10
- 239000001257 hydrogen Substances 0.000 description 7
- 229910052739 hydrogen Inorganic materials 0.000 description 7
- 238000000151 deposition Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 150000002894 organic compounds Chemical class 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 229910052750 molybdenum Inorganic materials 0.000 description 5
- 239000011733 molybdenum Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 238000001556 precipitation Methods 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 239000012495 reaction gas Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical class [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- NEHMKBQYUWJMIP-UHFFFAOYSA-N chloromethane Chemical compound ClC NEHMKBQYUWJMIP-UHFFFAOYSA-N 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000011017 operating method Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 229910002090 carbon oxide Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229940050176 methyl chloride Drugs 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明はプラズマCVD法によるダイヤモンド
の合成法の改良に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to an improved method for synthesizing diamond by plasma CVD.
(従来の技術及び解決しようとする課題)
ダイヤモンドを熱力学的に準安定領域で合成す
る方法として、放電によるプラズマを用いる
CVD法は、現在では良く知られた方法となつて
いる。(Conventional technology and problems to be solved) A method for synthesizing diamond in a thermodynamically metastable region uses plasma generated by electrical discharge.
The CVD method is now a well-known method.
この方法には、グロー放電による低温プラズマ
を用いる方法と、より強い放電による高温或いは
熱プラズマを用いる方法の2種類の方法がある。 There are two methods for this: one uses low-temperature plasma due to glow discharge, and the other uses high-temperature or thermal plasma due to stronger discharge.
しかし、前者の方法では、ダイヤモンドの成長
速度が通常0.1〜数μm/hrと遅く、一方、後者
の方法では、成長速度は前者の百倍以上と速い
が、ガス温度が通常2000〜3000K以上と高いた
め、ダイヤモンドの成長には、ガス或いは基体温
度を何らかの方法で冷却する必要があつた。 However, in the former method, the growth rate of diamond is usually slow at 0.1 to several μm/hr, while in the latter method, the growth rate is more than 100 times faster than the former, but the gas temperature is usually high, at 2000 to 3000 K or more. Therefore, in order to grow diamond, it was necessary to cool the gas or substrate temperature by some method.
本発明者らは、この冷却法として、(1)ガス或い
は冷媒による気相、基体或いは基体ホルダーの冷
却法(特開昭62−158195号)、(2)気体の断熱膨張
による急冷法(特願昭61−252391号)を開発し
た。 The present inventors have proposed two methods for this cooling: (1) cooling of the gas phase, substrate, or substrate holder using gas or refrigerant (Japanese Patent Application Laid-open No. 158195/1983), (2) rapid cooling method using adiabatic expansion of gas (Special (Gan No. 61-252391) was developed.
しかしながら、(1)の方法においては、空間的に
一様な冷却及びそのコントロールが難しく、一
方、(2)の方法では、大きな容量の排気装置が必要
で、また成長速度もやや低下するという欠点があ
つた。 However, in method (1), spatially uniform cooling and its control are difficult, while in method (2), a large capacity exhaust system is required and the growth rate is also slightly reduced. It was hot.
本発明は、上記従来技術の欠点を解消して、プ
ラズマCVD法によりダイヤモンドを合成するに
際し、気体又は基体温度を効果的に冷却でき、成
長速度の低下を招くことなくダイヤモンドを合成
し得る方法を提供することを目的とするものであ
る。 The present invention solves the above-mentioned drawbacks of the prior art, and provides a method that can effectively cool the gas or substrate temperature when synthesizing diamond by plasma CVD, and can synthesize diamond without reducing the growth rate. The purpose is to provide
(課題を解決するための手段)
本発明者らは、プラズマCVD法によるダイヤ
モンド合成における上記欠点を解消し得る方策に
ついて鋭意研究した結果、振幅変調された電力を
放電に用いることにより、気体温度及び基体温度
の過度の上昇を防ぎ、しかも速い成長速度でダイ
ヤモンド合成が行えることを見い出し、本発明を
完成したものである。(Means for Solving the Problems) As a result of intensive research into measures that can eliminate the above-mentioned drawbacks in diamond synthesis using plasma CVD, the present inventors found that by using amplitude-modulated electric power for discharge, gas temperature and The present invention was completed by discovering that diamond synthesis can be performed at a high growth rate while preventing an excessive rise in substrate temperature.
すなわち、本発明は、プラズマCVD法により
ダイヤモンドを合成する方法において、該プラズ
マを振幅変調された電力により発生させることを
特徴とするダイヤモンドの合成法を要旨とするも
のである。 That is, the gist of the present invention is a method for synthesizing diamond by plasma CVD, which is characterized in that the plasma is generated by amplitude-modulated electric power.
以下に本発明を詳述する。 The present invention will be explained in detail below.
(作用)
前述のように、本発明は、要するに、炭化水素
ガス、水素ガス、酸素ガス、及び不活性ガスから
選ばれた単独ガス又は混合ガスに、振幅変調され
た電力を適用することによりプラズマを発生さ
せ、該プラズマ中で、有機化合物、酸化炭素類又
は炭素材を分解・蒸発・解離させて得られる気体
よりダイヤモンドを析出させるものである。(Operation) As described above, the present invention, in short, generates plasma by applying amplitude-modulated electric power to a single gas or a mixture of gases selected from hydrocarbon gas, hydrogen gas, oxygen gas, and inert gas. is generated, and diamond is precipitated from the gas obtained by decomposing, evaporating, and dissociating organic compounds, carbon oxides, or carbon materials in the plasma.
したがつて、振幅変調された電力を用いる以外
の他の条件は特に制限されるものではない。 Therefore, conditions other than using amplitude-modulated power are not particularly limited.
以下にそれらの条件について説明する。 Those conditions will be explained below.
本発明に用いる放電は、グロー放電、アーク放
電、或いはグロー・アーク遷移領域の放電の何れ
でも良い。放電に用いる電源は、直流、低周波交
流、高周波、マイクロ波の何れでもよく、或いは
それらを重畳してもよく、また有電極、無電極の
何れの放電法でもよい。 The discharge used in the present invention may be a glow discharge, an arc discharge, or a discharge in the glow-arc transition region. The power source used for the discharge may be direct current, low-frequency alternating current, high frequency, or microwave, or may be a combination of these, and either an electroded or electrodeless discharge method may be used.
これらの電力の変調の周波数は、もとの周波数
(搬送波の周波数)、伝送系・放電アプリケーター
の周波数特性等によるが、およそ10Hz〜(もとの
周波数)×1/20の範囲が用いられる。例えば、
13.56MHzの高周波の場合は10Hz〜500kHzである。
但し、バースト発振等を用いれば、変調波の波数
を波数単位でコントロールできるし、任意波形発
振器で変調すれば、変調周波数を発振中に変動さ
せることもできる。直流電力の場合も同様に変調
でき、およそ10Hz〜500kHzが利用できる。 The frequency of these power modulations depends on the original frequency (carrier frequency), the frequency characteristics of the transmission system/discharge applicator, etc., but a range of about 10 Hz to (original frequency) x 1/20 is used. for example,
For a high frequency of 13.56MHz, it is 10Hz to 500kHz.
However, if burst oscillation or the like is used, the wave number of the modulated wave can be controlled in units of wave numbers, and if modulated by an arbitrary waveform oscillator, the modulation frequency can be varied during oscillation. Direct current power can be modulated in the same way, and approximately 10Hz to 500kHz can be used.
変調の波形は正弦波、三角波、矩形波等、どん
な形でも良いが、矩形波が最も効果的である。ま
た、それらの波形にバイアスを与え、例えば、矩
形波変調のオフ時に出力をある程度出すこともで
きる。パルス変調においてはそのデユーテイーを
代えることができる。 The modulation waveform may be of any shape, such as a sine wave, a triangular wave, or a rectangular wave, but a rectangular wave is most effective. It is also possible to apply a bias to these waveforms so that, for example, a certain amount of output can be produced when square wave modulation is turned off. In pulse modulation, the duty can be changed.
これらの変調された電力を放電に適用するこ
と、すなわち、強い電力と弱い電力或いは電力O
とを繰り返しながら適用することにより、ガス温
度、基体温度を過度に上昇させることなく、少な
い平均電力でより速い成長速度を得るという効果
が得られる。 Applying these modulated powers to the discharge, i.e. strong power and weak power or power O
By repeatedly applying these steps, it is possible to obtain a faster growth rate with less average power without excessively increasing the gas temperature and substrate temperature.
この効果の得られる理由は明らかではないが、
平均電力が低くても瞬間的に強い電界が加えられ
るため、気体のイオン化・解離が有効に行われる
一方、平均電力が低いため、ガス温度の上昇は少
なくなるためと推定される。 The reason for this effect is not clear, but
It is presumed that this is because even if the average power is low, a strong electric field is instantaneously applied, which effectively ionizes and dissociates the gas, but because the average power is low, the rise in gas temperature is reduced.
放電電力は、これらの変調波形、デユーテイー
の他の反応器或いは電極の大きさ、ガス流量、ガ
ス圧力等によつて異なるが、基体の温度或いは成
長空間の気相温度が350〜1400℃の範囲になるよ
うに選ばれる。 The discharge power varies depending on these modulation waveforms, the size of other reactors or electrodes in the duty unit, gas flow rate, gas pressure, etc., but it can be used when the temperature of the substrate or the gas phase temperature of the growth space is in the range of 350 to 1400°C. chosen to be.
炭素源としては、プラズマ中で分解し、イオン
種、ラジカル種を生成するものであれば良い。例
えば、メタン、エタン、プロパン、エチレン、ベ
ンゼン、シクロヘキサン等の飽和、不飽和脂肪族
又は芳香族炭化水素、アルコール、アセトン、ア
ルデヒド等の酸素を含む有機化合物、アミン、ア
ミド等の窒素を含む有機化合物、塩化メチル、ク
ロロホルム等のハロゲンを含む有機化合物、チオ
フエンなどの硫黄を含む有機化合物、ホスフイン
等の燐を含む有機化合物、ポリエチレンなどの高
分子化合物や一酸化炭素、二酸化炭素などが用い
られる。また固体黒鉛材もプラズマ中に投入して
用いることができる。 Any carbon source may be used as long as it decomposes in plasma to generate ion species and radical species. For example, saturated or unsaturated aliphatic or aromatic hydrocarbons such as methane, ethane, propane, ethylene, benzene, and cyclohexane; organic compounds containing oxygen such as alcohols, acetone, and aldehydes; organic compounds containing nitrogen such as amines and amides; , organic compounds containing halogens such as methyl chloride and chloroform, organic compounds containing sulfur such as thiophene, organic compounds containing phosphorus such as phosphine, polymeric compounds such as polyethylene, carbon monoxide, carbon dioxide, etc. Furthermore, solid graphite material can also be used by being introduced into the plasma.
プラズマのガス圧力は10-4〜5×102気圧まで
の範囲で用いることができる。圧力が低すぎると
ダイヤモンドの析出速度が遅く、逆に高すぎると
容器の取扱いに手間がかかり、装置が高価になる
ので、望ましくは10-3〜10気圧である。 The plasma gas pressure can be used in a range of 10 -4 to 5×10 2 atm. If the pressure is too low, the rate of diamond precipitation will be slow, and if the pressure is too high, handling of the container will be troublesome and the equipment will be expensive, so the pressure is preferably 10 -3 to 10 atm.
基体としては、モリブデン、ステンレス等の金
属、シリコン等の半導体、アルミナ等のセラミツ
クス、或いはダイヤモンド単結晶等、いずれでも
用いることができる。基体温度はプラズマ加熱の
みで上記の350〜1400℃にすることができるが、
必要に応じてヒーターによる加熱、或いは冷媒に
よる冷却により温度調節ができる。 As the substrate, any of metals such as molybdenum and stainless steel, semiconductors such as silicon, ceramics such as alumina, or single crystal diamond can be used. The substrate temperature can be raised to the above 350 to 1400℃ using only plasma heating, but
If necessary, the temperature can be adjusted by heating with a heater or cooling with a refrigerant.
次に本発明の実施に用いる装置の一例を図面を
用いて説明する。 Next, an example of an apparatus used to carry out the present invention will be explained with reference to the drawings.
第1図は直流プラズマジエツトを用いた場合の
反応装置を示しており、1は直流プラズマトー
チ、2は直流電源、3は基体、3′は基体ホルダ
ー、4は反応室、5は排気装置、6はガス供給装
置、7,7′はガス流量調整バルブである。操作
手順は、まず排気装置5により反応室4を真空に
した後、ガス流量調整バルブ7を通じてプラズマ
発生ガスを供給する。所定の圧力とした後、直流
電源2よりプラズマトーチ1の電極間にパルス化
された電力を供給し、プラズマを発生させる。続
いてプラズマ中にバルブ7′より炭素源を供給す
ることにより、基体上にダイヤモンドを析出させ
る。 Figure 1 shows a reaction apparatus using a DC plasma jet, where 1 is a DC plasma torch, 2 is a DC power source, 3 is a substrate, 3' is a substrate holder, 4 is a reaction chamber, and 5 is an exhaust device. , 6 is a gas supply device, and 7 and 7' are gas flow rate adjustment valves. The operating procedure is as follows: First, the reaction chamber 4 is evacuated using the exhaust device 5, and then plasma generating gas is supplied through the gas flow rate adjustment valve 7. After setting the pressure to a predetermined value, pulsed power is supplied from the DC power source 2 between the electrodes of the plasma torch 1 to generate plasma. Subsequently, diamond is deposited on the substrate by supplying a carbon source into the plasma from the valve 7'.
第2図は平行平板型直流放電又は高周波放電の
場合の反応装置を示しており、8は直流又は高周
波電源、9,9′は平板電極であり、その他の部
材は第1図と同様である。操作手順は、まず排気
装置5により反応室4を真空にした後、ガス流量
調整バルブ7より希釈ガスと反応ガスを流し、電
極9と9′の間に直流又は高周波をかけ、プラズ
マを発生させて、電極9′の上に置いた基体上に
ダイヤモンドを析出させる。 Figure 2 shows a reaction device for parallel plate DC discharge or high frequency discharge, where 8 is a DC or high frequency power supply, 9 and 9' are flat plate electrodes, and other members are the same as in Figure 1. . The operating procedure is to first evacuate the reaction chamber 4 using the exhaust device 5, then flow the diluent gas and reaction gas through the gas flow rate adjustment valve 7, apply direct current or high frequency between the electrodes 9 and 9', and generate plasma. Then, diamond is deposited on the substrate placed on the electrode 9'.
第3図はワークコイル型高周波放電の場合の反
応装置を示しており、4′は石英製反応室、7,
7′,7″はガス流量調整バルブ、10は高周波電
源、11はワークコイルであり、その他の部材は
第1図と同様である。この操作手順としては、ま
ず排気装置5により反応室4′を真空にした後、
バルブ7″よりシースガスを、バルブ7′よりプラ
ズマガスを流し、ワークコイル11に高周波電力
を供給してプラズマを発生させ、バルブ7よりキ
ヤリアーと原料ガスを流し、基体上にダイヤモン
ドを析出させる。反応室圧力が低い場合はバルブ
7又は7′から希釈ガスと反応ガスの混合ガスを
流せば良い。 Figure 3 shows the reaction apparatus for work coil type high frequency discharge, where 4' is a quartz reaction chamber, 7,
7', 7'' are gas flow rate adjustment valves, 10 is a high frequency power source, 11 is a work coil, and other members are the same as those shown in FIG. After evacuating the
Sheath gas is flowed through valve 7'' and plasma gas is flowed through valve 7', high frequency power is supplied to work coil 11 to generate plasma, and carrier and raw material gas are flowed through valve 7 to deposit diamond on the substrate. Reaction. When the chamber pressure is low, a mixed gas of dilution gas and reaction gas may be flowed through valve 7 or 7'.
第4図はマイクロ波放電を用いた装置の概略を
示しており、12はマイクロ波電源、13は導波
管、1しはプランジヤーであり、他の部材は第1
〜第3図と同様である。操作手順としては、まず
反応室4′を排気し、バルブ7′よりシースガス
を、バルブ7より希釈ガスと反応ガスを供給した
後、マイクロ波を導波管13を通して電源12よ
り供給し、プランジヤー14の調整により反応室
内にプラズマを発生させ、ダイヤモンドを析出さ
せる。反応室圧力が低い場合は、バルブ7′より
シースガスを流さなくてもよい。 Figure 4 shows an outline of a device using microwave discharge, in which 12 is a microwave power source, 13 is a waveguide, 1 is a plunger, and other members are the first
~Same as Figure 3. The operation procedure is as follows: First, the reaction chamber 4' is evacuated, the sheath gas is supplied from the valve 7', the dilution gas and the reaction gas are supplied from the valve 7, and then microwaves are supplied from the power supply 12 through the waveguide 13, and the plunger 14 By adjusting the temperature, plasma is generated in the reaction chamber and diamond is deposited. When the reaction chamber pressure is low, it is not necessary to flow the sheath gas through the valve 7'.
(実施例) 次に本発明の実施例を示す。(Example) Next, examples of the present invention will be shown.
実施例 1
第1図に示した装置を用いて、反応室を
0.1Torr以下に排気した後、バルブ7よりアルゴ
ン20/min、水素10/minを流し、炭素源と
してバルブ7′よりメタン0.75/minを流し、
200Torrのもとで電源出力12KW、繰り返し周波
数100Hz、デユーテイ30%の放電を10分間行つた。
但し、ピークオフ時の出力は2KWであつた。そ
の結果、モリブデン基板上に中心部膜厚40μmの
ダイヤモンド膜を得た。一方、変調なしの出力
5KWの時は、同じガス流量では放電が維持でき
なかつた。Example 1 Using the apparatus shown in Figure 1, a reaction chamber was prepared.
After exhausting to 0.1 Torr or less, argon was flowed at 20/min and hydrogen was flowed at 10/min from valve 7, and methane was flowed at 0.75/min from valve 7' as a carbon source.
Discharge was performed for 10 minutes at 200 Torr with a power output of 12 KW, a repetition frequency of 100 Hz, and a duty of 30%.
However, the output during peak off was 2KW. As a result, a diamond film with a thickness of 40 μm at the center was obtained on a molybdenum substrate. On the other hand, the output without modulation
At 5KW, discharge could not be maintained with the same gas flow rate.
実施例 2
第2図に示した装置を用いて、水素0.96/
minとメタン0.04/minを流しながら、圧力
200Torrにて電極間に、ピーク時6KW、デユー
テイ20%、500ppsの直流放電を1時間行うこと
によつて、陽極上に置かれたモリブデン基板上に
厚さ15μmのダイヤモンド膜を得た。析出速度は
15μm/hrである。これに対し、1.2KWの連続直
流放電では9μm/hrの析出速度であつた。Example 2 Hydrogen 0.96/
min and while flowing methane 0.04/min, the pressure
A diamond film with a thickness of 15 μm was obtained on the molybdenum substrate placed on the anode by performing direct current discharge of 6 KW at peak, 20% duty, and 500 pps between the electrodes at 200 Torr for 1 hour. The precipitation rate is
It is 15μm/hr. On the other hand, with continuous DC discharge of 1.2 KW, the deposition rate was 9 μm/hr.
実施例 3
第2図に示した装置を用いて、水素195ml/
min、メタン5ml/minの混合ガスを流しなが
ら、ガス圧1Torrにて13.56MHzの高周波を、ピ
ーク出力5KW、繰り返し周波数20KHz、デユー
テイ20%の矩形波変調で用い、プラズマを発生さ
せることによつて、3時間後にシリコン基板上に
膜厚約1μmのダイヤモンド膜を得た。析出速度
は約0.3μm/hrである。一方、変調なしの1KW
の出力の場合は、0.1μm/hrの析出速度であつ
た。Example 3 Using the apparatus shown in Figure 2, 195 ml of hydrogen/
By using a high frequency of 13.56 MHz at a gas pressure of 1 Torr with square wave modulation of a peak output of 5 KW, a repetition frequency of 20 KHz, and a duty of 20% while flowing a mixed gas of 5 ml/min of methane and 5 ml/min of methane, plasma is generated. After 3 hours, a diamond film with a thickness of about 1 μm was obtained on the silicon substrate. The deposition rate is approximately 0.3 μm/hr. Meanwhile, 1KW without modulation
In the case of an output of , the deposition rate was 0.1 μm/hr.
実施例 4
第3図に示した装置を用い、バルブ7″よりア
ルゴン15/min+水素6/min、バルブ7′
よりアルゴン1/min、バルブ7よりアルゴン
2/min+メタン0.8/minのガスを流し、圧
力1気圧で、周波数15MHz、出力15KWの高周波
を500Hzの矩形でデユーテイ30%の変調を行なつ
た電力で放電を行い、モリブデン基板上に10分間
で10μm厚のダイヤモンド膜を得た。基板温度は
約1100℃であつた。一方、変調のない15KWの場
合は、基板温度は約1600℃となり、析出物は殆ど
黒鉛であつた。また、4.5KWの場合は、上記の
ガス流ではプラズマが消失した。Example 4 Using the apparatus shown in Figure 3, argon 15/min + hydrogen 6/min from valve 7'', valve 7'
Argon 1/min and methane 2/min + methane 0.8/min were flowed from valve 7 at a pressure of 1 atm, a high frequency of 15 MHz, and an output of 15 KW was modulated with a rectangular frequency of 500 Hz and a duty of 30%. A diamond film with a thickness of 10 μm was obtained on a molybdenum substrate in 10 minutes by performing electric discharge. The substrate temperature was approximately 1100°C. On the other hand, in the case of 15KW without modulation, the substrate temperature was approximately 1600°C, and the precipitates were mostly graphite. Moreover, in the case of 4.5KW, the plasma disappeared in the above gas flow.
実施例 5
第3図に示した装置を用い、バルブ7′より水
素200ml/minとアルコール蒸気0.015g/minを
流し、出力30Torrにて周波数15MHz、出力3KW
の高周波を10KHzの矩形波でデユーテイ20%の変
調を行つた電力で放電を行い、シリコン基板上に
3時間で1.5μm厚のダイヤモンド膜を得た。析出
速度は0.5μm/hrである。一方、変調なしの
600W出力の場合は0.2μm/hrの析出速度であつ
た。Example 5 Using the apparatus shown in Fig. 3, 200 ml/min of hydrogen and 0.015 g/min of alcohol vapor were flowed from valve 7' at an output of 30 Torr, a frequency of 15 MHz, and an output of 3 KW.
A diamond film with a thickness of 1.5 μm was obtained on a silicon substrate in 3 hours by performing a discharge using a high frequency power modulated with a 10 KHz square wave and a duty of 20%. The deposition rate is 0.5 μm/hr. On the other hand, without modulation
In the case of 600W output, the deposition rate was 0.2 μm/hr.
実施例 6
第4図に示した装置を用い、バルブ7′より水
素10/minとアルゴン10/minの混合ガス、
バルブ7よりメタン0.7/minとアルゴン1
/minの混合ガスを流し、圧力1気圧にて、
2.45GHz、出力5KWのマイクロ波を、3KHz、デ
ユーテイ30%の矩形波で変調した電力により放電
させることにより、20分間でモリブデン基板上に
膜厚6μmのダイヤモンド膜を得た。一方、変調
しない1.5KWの放電では放電が維持できなかつ
た。Example 6 Using the apparatus shown in Fig. 4, a mixed gas of hydrogen 10/min and argon 10/min was supplied from valve 7'.
Methane 0.7/min and argon 1 from valve 7
Flow a mixed gas of /min at a pressure of 1 atm.
A diamond film with a thickness of 6 μm was obtained on a molybdenum substrate in 20 minutes by discharging a 2.45 GHz, 5 KW microwave with power modulated by a 3 KHz, 30% duty square wave. On the other hand, the discharge could not be maintained with unmodulated 1.5KW discharge.
実施例 7
第4図に示した装置を用い、バルブ7より水素
190ml/minとヘリウム6ml/minとメタン4
ml/minの混合ガスを流し、圧力50Torrにて
2.45GHz、出力3KWのマイクロ波を、1MHz、デ
ユーテイ10%の矩形波で変調して放電させること
により、ダイヤモンドの析出速度1.3μm/hrを得
た。一方、変調しない300Wの連続波では0.6μ
m/hrの析出速度であつた。Example 7 Using the device shown in Figure 4, hydrogen was supplied from valve 7.
190ml/min, helium 6ml/min and methane 4
Flow a mixed gas of ml/min at a pressure of 50 Torr.
A diamond deposition rate of 1.3 μm/hr was obtained by modulating and discharging a 2.45 GHz, 3 KW microwave with a 1 MHz, 10% duty square wave. On the other hand, for 300W continuous wave without modulation, 0.6μ
The precipitation rate was m/hr.
(発明の効果)
以上詳述したように、本発明によれば、少ない
平均放電電力でより速いダイヤモンドの析出速度
が得られる。また高いガス圧での放電でも気体温
度の上昇を少なくしてダイヤモンド合成が行え
る。更に気体又は基体温度のコントロールを容易
であり、また従来のような大容量の排気装置を必
要としない等、優れた効果が得られる。(Effects of the Invention) As described in detail above, according to the present invention, a faster diamond precipitation rate can be obtained with less average discharge power. Furthermore, diamond synthesis can be performed by reducing the rise in gas temperature even with discharge at high gas pressure. Furthermore, excellent effects such as easy control of gas or substrate temperature and no need for a large-capacity exhaust device as in the prior art can be obtained.
第1図〜第4図は本発明の実施に用いる装置の
一例を示す概略図で、第1図は直流プラズマジエ
ツト型の場合、第2図は平行平板型直流放電及び
高周波放電の場合、第3図はワークコイル型高周
波放電の場合、第4図はマイクロ波放電の場合を
示している。
1……直流プラズマトーチ、2……直流電源、
3……基体、3′……基体ホルダー、4,4′……
反応室、5……排気装置、6……ガス供給装置、
7,7′,7″……ガス流量調整バルブ、8……直
流電源若しくは高周波電源、9,9′……放電電
極、10……高周波電源、11……ワークコイ
ル、12……マイクロ波電源、13……導波管、
14……プランジヤー。
Figures 1 to 4 are schematic diagrams showing an example of the apparatus used to carry out the present invention. Figure 1 is for a DC plasma jet type, and Figure 2 is for a parallel plate type DC discharge and high frequency discharge. FIG. 3 shows the case of work coil type high frequency discharge, and FIG. 4 shows the case of microwave discharge. 1...DC plasma torch, 2...DC power supply,
3...Substrate, 3'...Substrate holder, 4,4'...
reaction chamber, 5...exhaust device, 6...gas supply device,
7, 7', 7''...Gas flow rate adjustment valve, 8...DC power supply or high frequency power supply, 9,9'...Discharge electrode, 10...High frequency power supply, 11...Work coil, 12...Microwave power supply , 13... waveguide,
14...Plunger.
Claims (1)
する方法において、該プラズマを振幅変調された
電力により発生させることを特徴とするダイヤモ
ンドの合成法。1. A method for synthesizing diamond by plasma CVD, characterized in that the plasma is generated by amplitude-modulated electric power.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28094189A JPH03141197A (en) | 1989-10-27 | 1989-10-27 | Synthesis of diamond using plasma |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28094189A JPH03141197A (en) | 1989-10-27 | 1989-10-27 | Synthesis of diamond using plasma |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03141197A JPH03141197A (en) | 1991-06-17 |
| JPH0512311B2 true JPH0512311B2 (en) | 1993-02-17 |
Family
ID=17632051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28094189A Granted JPH03141197A (en) | 1989-10-27 | 1989-10-27 | Synthesis of diamond using plasma |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03141197A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT411070B (en) * | 1996-03-25 | 2003-09-25 | Electrovac | METHOD FOR PRODUCING A SUBSTRATE WITH A POLYCRYSTALLINE DIAMOND LAYER |
-
1989
- 1989-10-27 JP JP28094189A patent/JPH03141197A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03141197A (en) | 1991-06-17 |
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