JPH0513259A - Formation of mark of articles - Google Patents
Formation of mark of articlesInfo
- Publication number
- JPH0513259A JPH0513259A JP3162921A JP16292191A JPH0513259A JP H0513259 A JPH0513259 A JP H0513259A JP 3162921 A JP3162921 A JP 3162921A JP 16292191 A JP16292191 A JP 16292191A JP H0513259 A JPH0513259 A JP H0513259A
- Authority
- JP
- Japan
- Prior art keywords
- mark
- black
- formation
- capacitor
- article
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000015572 biosynthetic process Effects 0.000 title claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 38
- 238000000576 coating method Methods 0.000 claims abstract description 31
- 239000000843 powder Substances 0.000 claims abstract description 31
- 239000011248 coating agent Substances 0.000 claims abstract description 30
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 5
- 238000001035 drying Methods 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 abstract description 16
- 239000003985 ceramic capacitor Substances 0.000 abstract description 10
- 239000003973 paint Substances 0.000 abstract description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 239000003086 colorant Substances 0.000 abstract 1
- 239000010419 fine particle Substances 0.000 abstract 1
- 230000008569 process Effects 0.000 description 9
- 239000000049 pigment Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- 238000007654 immersion Methods 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 238000004040 coloring Methods 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000001034 iron oxide pigment Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical compound [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
- Details Of Resistors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プラスチック成形品、
注形品等の物品、特に積層セラミックコンデンサ、抵抗
器、ハイブリッドＩＣ等の電子部品を対象とする標印形
成方法に関する。The present invention relates to a plastic molded article,
The present invention relates to a marking forming method for an object such as a cast product, particularly for an electronic component such as a laminated ceramic capacitor, a resistor and a hybrid IC.
【０００２】[0002]
【従来の技術】積層セラミックコンデンサ等の電子部品
には、個別識別として記号、マーク、数字等を標印して
あるが、この標印は、例えば積層セラミックコンデンサ
では次のように行う。まず、既知の方法で作製した積層
セラミックコンデンサの外部電極にリード線をはんだ接
合したものを余熱した後、フェノール樹脂又はエポキシ
樹脂、酸無水物、顔料、難燃剤からなる粉体塗料粉末中
に浸漬する。その後、コンデンサに付着した塗膜を高温
気体中で硬化させる。2. Description of the Related Art Symbols, marks, numbers, etc. are marked as individual identifications on electronic parts such as monolithic ceramic capacitors. This marking is performed as follows, for example, in monolithic ceramic capacitors. First, after the lead wires are soldered to the external electrodes of the monolithic ceramic capacitor manufactured by a known method, after preheating, it is dipped in a powder coating powder consisting of a phenol resin or epoxy resin, an acid anhydride, a pigment, and a flame retardant. To do. Then, the coating film attached to the capacitor is cured in a high temperature gas.
【０００３】次いで、黒色顔料、樹脂、溶媒からなるイ
ンクを硬化した塗装面に転写、スクリーン印刷又はロッ
ドプリンタで塗布して、黒色の標印を形成する（方法
Ａ）。或いは、黄色酸化鉄系顔料を配合した粉体塗料粉
末中に、リード線付コンデンサを同様に余熱してから浸
漬した後、乾燥・硬化させた塗装面にレーザ光を照射し
て、前記酸化鉄系顔料の酸化により茶色の標印を施す
（方法Ｂ）。或いは、粉体塗料粉末中への余熱・浸漬に
よって得られる塗装面をレーザ光の照射で粗くし、表面
粗度の違いで標印を設ける（方法Ｃ）。Then, an ink composed of a black pigment, a resin, and a solvent is transferred to the hardened coated surface, screen-printed or applied by a rod printer to form a black mark (method A). Alternatively, after preheating the capacitor with lead wire in a powder coating powder containing a yellow iron oxide pigment in the same manner and immersing it in the powder coating powder, irradiate the dried and hardened coated surface with laser light to produce the iron oxide. A brown marking is applied by oxidation of the system pigment (method B). Alternatively, the coated surface obtained by residual heat / immersion in the powder coating powder is roughened by laser light irradiation, and a mark is provided according to the difference in surface roughness (method C).
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記従
来のような標印方法Ａ、Ｃによれば、インク量の変化、
レオロジーの変化、被印刷物の形状変化等により、標印
の掠れ、滲み、細り、太り、欠如等が発生する。或い
は、電子部品を基板に装着した後の溶剤洗浄により、標
印の剥離、標印中の成分（有機結合剤、顔料等）溶出に
よる標印の消失等が生ずることもある。更に、方法Ａで
は標印形成に時間が掛かるという欠点もある。又、前記
方法Ｂのようにレーザ光の照射によって標印を発色させ
る方法では、これらの欠点は殆どみられないが、発色は
茶色や白色等であり、黒発色は得られない。However, according to the conventional marking methods A and C, the change in ink amount,
Blurring, bleeding, thinning, thickening, lacking, etc. of the mark occur due to changes in rheology, changes in the shape of the material to be printed, and the like. Alternatively, the solvent may be washed after mounting the electronic component on the substrate, whereby the mark may be peeled off, or the mark may disappear due to elution of components (organic binder, pigment, etc.) in the mark. Further, the method A has a drawback that it takes time to form the mark. Further, in the method of coloring the mark by irradiating the laser beam like the method B, these defects are hardly seen, but the coloring is brown or white, and black coloring is not obtained.
【０００５】従って、本発明の目的は、上記方法Ａ、Ｃ
で起こる問題点や、方法Ｂでの黒色化できない現状に鑑
み、そのような問題点を生起させずに黒色標印が得られ
ると共に、標印スピードが早い標印形成方法を提供する
ことにある。Therefore, the object of the present invention is to provide the above methods A and C.
In view of the problems that occur in No. 1 and the current situation where the method B cannot be blackened, a black mark can be obtained without causing such problems, and a mark forming method having a high marking speed is provided. .
【０００６】[0006]
【課題を解決するための手段】前記目的を達成するため
に、本発明の物品の標印形成方法は、レーザ照射により
黒色に発色する発色剤を含有する粉体塗料粉末中に物品
を余熱してから浸漬し、得られた物品の塗膜を乾燥させ
た後、物品の標印形成面となる塗装面に対して、所定の
標印パターンを持つマスクを介してレーザ光を照射する
ことを特徴とするものである。In order to achieve the above object, the method for forming a mark of an article of the present invention is to preheat an article in a powder coating powder containing a color former which develops black by laser irradiation. After soaking it, and drying the coating film of the obtained article, irradiate the laser beam through the mask with the predetermined marking pattern on the coating surface that becomes the marking forming surface of the article. It is a feature.
【０００７】本発明の標印形成方法によれば、粉体塗料
粉末中に黒色発色剤を含有させてあるため、この塗料粉
末から得られる塗膜にマスクを介してレーザ光を照射す
ると、レーザ光による黒色発色剤の酸化又は還元作用に
よって塗装面の被照射部分のみが黒色に発色し、結果的
に所定パターンの標印が形成される。この黒色発色剤と
しては、レーザ光照射によって黒色化すれば特定され
ず、Ｐｂ、Ｃｕ等の塩が例示される。According to the mark forming method of the present invention, since the black color former is contained in the powder coating powder, when a coating film obtained from this coating powder is irradiated with laser light through a mask, the laser light is emitted. Due to the oxidation or reduction action of the black color former by light, only the irradiated portion of the coated surface is colored black, and as a result, a mark having a predetermined pattern is formed. The black color-developing agent is not specified as long as it is blackened by laser light irradiation, and examples thereof include salts such as Pb and Cu.
【０００８】[0008]
【実施例】以下、本発明の物品の標印形成方法を実施例
に基づいて説明する。図１〜図７にその工程を順に示
す。この実施例では、標印形成対象物品として積層セラ
ミックコンデンサを例にしてある。まず、図１におい
て、既知の方法で作製した積層セラミックコンデンサを
用意する。このコンデンサ１０は、誘電体セラミック層
と内部電極層を交互に積層した積層体１１の一対の端面
に外部電極１２を設けたものである。このコンデンサ１
０の両外部電極１２に、それぞれリード線２０をはんだ
接合して、リード付積層セラミックコンデンサを得る
（図２参照）。EXAMPLES The method for forming a mark of an article according to the present invention will be described below based on examples. 1 to 7 show the steps in order. In this embodiment, a monolithic ceramic capacitor is used as an example of the article for which the mark is to be formed. First, in FIG. 1, a monolithic ceramic capacitor manufactured by a known method is prepared. In this capacitor 10, external electrodes 12 are provided on a pair of end faces of a laminated body 11 in which dielectric ceramic layers and internal electrode layers are alternately laminated. This capacitor 1
Lead wires 20 are soldered to both outer electrodes 12 of 0 to obtain a laminated ceramic capacitor with leads (see FIG. 2).
【０００９】次に、着色顔料及び体質顔としてのＴｉＯ
2 、シアニンブルー、ＳｉＯ2 、難燃性樹脂としての臭
素化エポキシ樹脂、及びＳｂ、前記黒色発色剤を５〜２
０％、更に硬化剤としての酸無水物等からなる粉体塗料
粉末を調製する。この粉体塗料粉末の軟化点以上（本例
では８０〜１５０℃）にコンデンサ１０を適当なヒータ
３０によって余熱する（図３参照）。その後、粉体塗料
粉末４０中に余熱したコンデンサ１０を浸漬する（図４
参照）。この浸漬時に、コンデンサ１０周辺の塗料粉末
４０がコンデンサの余熱によって軟化して粘着性を有す
るようになり、コンデンサ１０の表面に付着する。この
余熱・浸漬は、塗膜が所要の厚さ（例えば１０００μｍ
程度）と形状になるまで繰り返す。Next, a coloring pigment and TiO as a constitutional face.
2 , cyanine blue, SiO 2 , brominated epoxy resin as a flame-retardant resin, and Sb, the black color former 5 to 2
A powder coating powder consisting of 0% and an acid anhydride as a curing agent is prepared. The capacitor 10 is preheated by an appropriate heater 30 to a temperature above the softening point of the powder coating powder (80 to 150 ° C. in this example) (see FIG. 3). Then, the preheated capacitor 10 is immersed in the powder coating powder 40 (FIG. 4).
reference). During this immersion, the paint powder 40 around the capacitor 10 is softened by the residual heat of the capacitor and becomes sticky, and adheres to the surface of the capacitor 10. This residual heat / immersion causes the coating film to have a required thickness (for example, 1000 μm).
Repeat) until the shape is reached.
【００１０】そして、塗膜を形成したコンデンサ１０を
１２０〜２５０℃で３分間以上加熱する。加熱により、
塗膜中の臭素化エポキシ樹脂のエポキシ基と酸無水物と
が反応し、臭素化エポキシ樹脂が高分子化し、不溶・不
融の外装塗膜５０が積層体１１、外部電極１２及びリー
ド線２０の一部分に形成される（図５参照）。なお、本
実施例において、粉体塗料粉末に含まれる顔料は既知の
顔料を使用してもよく、樹脂についてもビスフェノール
型エポキシ樹脂又はフェノール樹脂でもよく、これらの
樹脂を用いる場合は難燃性を付与するために難燃剤を別
途添加する。Then, the coated capacitor 10 is heated at 120 to 250 ° C. for 3 minutes or more. By heating
The epoxy group of the brominated epoxy resin in the coating film reacts with the acid anhydride, the brominated epoxy resin polymerizes, and the insoluble / non-melting exterior coating film 50 forms the laminate 11, the external electrode 12, and the lead wire 20. Is formed on a part of the (see FIG. 5). In this example, the pigment contained in the powder coating powder may be a known pigment, and the resin may be a bisphenol type epoxy resin or a phenol resin. A flame retardant is added separately to impart.
【００１１】その後、図６に示すように、記号、マー
ク、数字等の所定の標印パターンを有するマスク６０
を、コンデンサ１０の標印形成面の前方に一定間隔を置
いて配し、出力３Ｊ以上のＣＯ2 レーザＬをマスク６０
に向かって照射する。この結果、マスク６０は標印パタ
ーンが切抜き部分になっているので、パターン通りにレ
ーザＬが塗装面に当たり、この塗装面に所定の標印７０
が形成される（図７参照）。この時、塗膜５０中の黒色
発色剤がレーザ光によって黒色に発色するため、黒色の
標印が得られる。又、レーザ照射による触刻の深さは精
精１〜１０μｍであり、塗膜５０の厚さ１０００μｍに
比べ僅少であり、コンデンサ１０自体には全く影響しな
い。更に、コンデンサの性能、例えば耐溶剤性（アセト
ン、１・１・１トリクロールエタンへの５分間浸漬によ
る溶剤洗浄）、静電容量、誘電正接、絶縁抵抗等には全
く問題は発生しない。Thereafter, as shown in FIG. 6, a mask 60 having a predetermined marking pattern such as symbols, marks and numbers.
Are arranged in front of the mark forming surface of the condenser 10 at a constant interval, and a CO 2 laser L having an output of 3 J or more is masked by the mask 60.
Irradiate toward. As a result, the marking pattern of the mask 60 is the cutout portion, so the laser L hits the coating surface according to the pattern, and the predetermined marking 70 is applied to this coating surface.
Are formed (see FIG. 7). At this time, the black color-developing agent in the coating film 50 is colored black by the laser light, so that a black mark is obtained. Further, the depth of touching by laser irradiation is 1 to 10 μm, which is smaller than the thickness of the coating film 50 of 1000 μm, and does not affect the capacitor 10 at all. Further, there is no problem at all with respect to the performance of the capacitor, such as solvent resistance (solvent cleaning by immersion in acetone, 1.1.1 / 1 trichloroethane for 5 minutes), capacitance, dielectric loss tangent, insulation resistance and the like.
【００１２】上記実施例は、積層セラミックコンデンサ
に関するものであるが、本発明の形成方法はこれに限定
されないことは言うまでもなく、コンデンサ以外の電子
部品、例えば抵抗器、ハイブリッドＩＣ等に対しても同
様に行うことができるだけでなく、プラスチック成形
品、注形品等の物品にも適用可能である。Although the above embodiments relate to a monolithic ceramic capacitor, it goes without saying that the forming method of the present invention is not limited to this, and the same applies to electronic parts other than capacitors, such as resistors and hybrid ICs. In addition to the above, it can be applied to articles such as plastic molded products and cast products.
【００１３】[0013]
【発明の効果】本発明の物品の標印形成方法は、以上説
明したように構成されるので、下記の効果を有する。
（１）前記従来の方法Ａのように有機物のインクを塗布
するのではなく、粉体塗料粉末中への余熱・浸漬によっ
て塗膜を施し、この塗膜に標印を形成するので、標印形
成後に行う溶剤洗浄に対する耐溶剤性が向上する。
（２）掠れ、滲み、細り、太り、欠損等の不都合が生じ
ない、寸法精度の良い標印が得られる。
（３）標印スピードが、例えば従来の転写方法による６
００個／分に比べて、１０００個／分以上と格段に早
い。
（４）粉体塗料粉末中に有機溶剤を使用しないため、火
災の心配がない。
（５）標印がその方法上安定して形成されるため、標印
形成工程を他の工程の加工機に併合できる等、標印形成
工程での監視要員を削減できる。The method for forming a mark of an article according to the present invention is configured as described above and therefore has the following effects. (1) Instead of applying an organic ink as in the conventional method A, a coating film is formed by residual heat / immersion in powder coating powder, and a mark is formed on this coating film. The solvent resistance to solvent cleaning performed after formation is improved. (2) It is possible to obtain a mark with good dimensional accuracy without causing inconveniences such as blurring, bleeding, thinning, thickening, and loss. (3) The marking speed is, for example, 6 according to the conventional transfer method.
Remarkably faster than 1000 pieces / minute compared to 00 pieces / minute. (4) Since no organic solvent is used in the powder coating powder, there is no risk of fire. (5) Since the mark is stably formed in terms of its method, it is possible to reduce the number of monitoring personnel in the mark forming process, such as the mark forming process can be combined with the processing machine of another process.
【図１】本発明の標印形成方法の一例に係る第一段階の
工程図である。FIG. 1 is a process drawing of a first stage according to an example of a mark forming method of the present invention.
【図２】本発明の標印形成方法の一例に係る第二段階の
工程図である。FIG. 2 is a process drawing of the second stage according to an example of the mark forming method of the present invention.
【図３】本発明の標印形成方法の一例に係る第三段階の
工程図である。FIG. 3 is a process drawing of a third step according to an example of the mark forming method of the present invention.
【図４】本発明の標印形成方法の一例に係る第四段階の
工程図である。FIG. 4 is a process drawing of the fourth step according to an example of the mark forming method of the present invention.
【図５】図４に示す浸漬工程で得られたコンデンサの外
観図である。5 is an external view of a capacitor obtained in the dipping process shown in FIG.
【図６】本発明の標印形成方法の一例に係る第五段階の
工程図である。FIG. 6 is a process drawing of the fifth step according to an example of the mark forming method of the present invention.
【図７】図６に示すレーザ光照射工程で得られたコンデ
ンサの外観図である。7 is an external view of a capacitor obtained in the laser light irradiation step shown in FIG.
１０ 積層セラミックコンデンサ １１ 積層体 １２ 外部電極 ２０ リード線 ３０ ヒータ ４０ 粉体塗料粉末 ５０ 塗膜 ６０ マスク ７０ 標印 Ｌ レーザ光 10 Multilayer ceramic capacitors 11 laminate 12 external electrodes 20 lead wires 30 heater 40 powder coating powder 50 coatings 60 mask 70 Mark L laser light
Claims (2)
含有する粉体塗料粉末中に物品を余熱してから浸漬し、
得られた物品の塗膜を乾燥させた後、物品の標印形成面
となる塗装面に対して、所定の標印パターンを持つマス
クを介してレーザ光を照射することを特徴とする物品の
標印形成方法。1. An article is preheated and immersed in a powder coating powder containing a color-developing agent that develops black color by laser irradiation,
After drying the coating film of the obtained article, the coated surface to be the mark forming surface of the article is irradiated with laser light through a mask having a predetermined mark pattern. Mark formation method.
る請求項１記載の物品の標印形成方法。2. The method for forming a mark on an article according to claim 1, wherein the article is an electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3162921A JPH0513259A (en) | 1991-07-03 | 1991-07-03 | Formation of mark of articles |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3162921A JPH0513259A (en) | 1991-07-03 | 1991-07-03 | Formation of mark of articles |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0513259A true JPH0513259A (en) | 1993-01-22 |
Family
ID=15763769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3162921A Pending JPH0513259A (en) | 1991-07-03 | 1991-07-03 | Formation of mark of articles |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0513259A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001358414A (en) * | 2000-06-16 | 2001-12-26 | Ibiden Co Ltd | Printed wiring board and method of manufacturing the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55110001A (en) * | 1979-02-16 | 1980-08-25 | Hitachi Ltd | Method of marking electronic part |
| JPS61283101A (en) * | 1985-06-07 | 1986-12-13 | 株式会社村田製作所 | Impartment of display to electronic component |
| JPS6489508A (en) * | 1987-09-30 | 1989-04-04 | Murata Manufacturing Co | Method of imparting display to electronic component |
-
1991
- 1991-07-03 JP JP3162921A patent/JPH0513259A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55110001A (en) * | 1979-02-16 | 1980-08-25 | Hitachi Ltd | Method of marking electronic part |
| JPS61283101A (en) * | 1985-06-07 | 1986-12-13 | 株式会社村田製作所 | Impartment of display to electronic component |
| JPS6489508A (en) * | 1987-09-30 | 1989-04-04 | Murata Manufacturing Co | Method of imparting display to electronic component |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001358414A (en) * | 2000-06-16 | 2001-12-26 | Ibiden Co Ltd | Printed wiring board and method of manufacturing the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0275070B1 (en) | Multilayer printed wiring board and method for making same | |
| US3895218A (en) | Electric heater plate and terminal thereof | |
| JPH0389544A (en) | Manufacture of thick film circuit substrate | |
| JPH0513259A (en) | Formation of mark of articles | |
| JPH0553284B2 (en) | ||
| US4016645A (en) | Electric heater plate and terminal thereof | |
| JPH04199782A (en) | Forming method for through hole of flexible board | |
| JP4653291B2 (en) | Ceramic member marking method and marked ceramic member | |
| CN114401592A (en) | High-precision printing method for PCB solder mask | |
| JP2018152487A (en) | Chip resistor and manufacturing method thereof | |
| US3425831A (en) | Stencil screen | |
| JPH05270138A (en) | Electronic part | |
| JP3093648B2 (en) | Chip components | |
| JPH01143288A (en) | Manufacture of thick film circuit | |
| US2888336A (en) | Color coded printed circuit | |
| JP2868989B2 (en) | Component mounting method | |
| CN117835578A (en) | Technological method for solving breakdown of circuit board in laser coding covering film and thermosetting oil | |
| JP3103164B2 (en) | Manufacturing method of end face type thermal head | |
| JPH0770378B2 (en) | Circuit board | |
| JP2024089575A (en) | Circuit board and manufacturing method thereof | |
| WO2016185605A1 (en) | Printed wiring board and production method for printed wiring board | |
| JPH01249171A (en) | Production of base body having inorganic oxide film | |
| JPS6020549A (en) | Manufacture of thick film printed substrate | |
| JPH03171692A (en) | Manufacture of organic thick film circuit board | |
| JPH06326219A (en) | Manufacture of electronic component |