JPH05143206A - Semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To compensate the operating state of an internal integrated circuit IC for a fixed time and longer against the fluctuation of a power voltage having a large amplitude by incorporating a storage battery and a diode element into a semiconductor IC device. CONSTITUTION:A storage battery 4 can be repetitively used with the repetitive charging and a diode element 5 prevents the discharging of the battery 4. The positive electrode of the battery 4 is connected to the higher potential power lead 3a of a package with a negative electrode connected to the lower potential power lead 3b of the package respectively. Meanwhile the element 5 is connected between both leads 3a and 3b so as to be biased forward by the external voltage. In such constitution, the short potential is supplied from the battery 4 and the influence given to an internal IC 6 can be compensated for a fixed time against the fluctuation of the power voltage having a large amplitude, e.g. the instaneous interruption of the power voltage. Two pairs of circuits containing respectively the pairs of batteries 4 and elements 5 are used. Then one of these two circuits is connected to a MAIN of the IC 6 with the other circuit connected to an area having the low power consumption in an emergency time. Thus, the operating state of the IC 6 can be compensated for a long period.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit device, and more particularly to a semiconductor integrated circuit device integrated with a backup power source.

[0002]

2. Description of the Related Art A conventional semiconductor integrated circuit device has an internal I
A terminal for connecting a C chip (hereinafter abbreviated as a pad terminal),
It has a connection terminal (hereinafter abbreviated as a pin terminal) for an external socket or a printed circuit board, and the pad terminal and the pin terminal are paired and electrically connected by a lead in the IC socket. There is.

As a conventional example, FIG. 4 shows a pin terminal 1a of a VCC-GND (hereinafter abbreviated as power supply) of a semiconductor integrated circuit device.
It is an equivalent circuit diagram between 1b-pad terminals 2a and 2b.

In FIG. 4, VCC pin terminals 1a, GN
There are a D pin terminal 1b, a VCC pad terminal 2a, and a GND pad terminal 2b, and between these terminals 1a-2a, 1b-2b.
Indicates that they are electrically connected by power supply leads 3a and 3b, respectively. Also, the power leads 3a, 3
A capacitor element 7 is connected between the points b and a high-frequency noise having a small amplitude and coming from the power supply system can be attenuated in the semiconductor integrated circuit device.

[0005]

In the semiconductor integrated circuit device described above, the effect of the capacitor element 7 on the high frequency noise having a small amplitude coming from the power supply system can be reduced. But you can
There is a drawback in that the operation of the internal IC 6 is stopped due to a large fluctuation of the power supply voltage such as a momentary interruption of the power supply voltage.

An object of the present invention is to provide a semiconductor integrated circuit device which solves the above-mentioned drawbacks and can compensate the operating state of the internal IC for a certain time or longer against a large fluctuation in the power supply voltage. is there.

[0007]

The structure of a semiconductor integrated circuit device of the present invention has a storage battery and a diode element for preventing the storage battery from discharging, and the + electrode of the storage battery is on the high potential side of the package. The negative electrode is connected to a power supply lead, the negative electrode is connected to a power supply lead on the low potential side of the package, and the diode element is connected so as to be forward-biased by a voltage externally applied between the leads.

[0008]

FIG. 1 is an equivalent circuit diagram between a pin terminal and a pad terminal of a power source of a semiconductor integrated circuit device as a first embodiment of the present invention.

Referring to FIG. 1, in this embodiment, a VCC pin terminal 1a, a GND pin terminal 1b, and a VCC pad terminal 2 are provided.
a and a GND pad terminal 2b, and between the terminals 1a-2
a is a power supply lead 3a, 3
It is shown that they are electrically connected by a'and the terminals 1b-2b are electrically connected by the power supply lead 3b.

Further, it is shown that a storage battery (storage battery which can be repeatedly used by repeatedly charging) 4 is connected between the power supply leads 3a and 3b.

By making such a connection, in the case of a large fluctuation of the power supply voltage, for example, a momentary interruption of the power supply voltage, the insufficient potential is replenished by the storage battery 4, and the influence on the internal IC is compensated for a certain period of time. You can

FIG. 2 is a perspective view showing an internal mounting state between the pin terminal and the pad terminal of the power source of the semiconductor integrated circuit device as the embodiment of FIG.

In FIG. 2, the same parts as those in FIG. 5 are denoted by the same numerals, and the internal IC 6 is mounted in a package having a dual line type lead.

FIG. 3 is an equivalent circuit diagram of the second embodiment of the present invention.

Referring to FIG. 3, in this embodiment, a VCC pin terminal 1a, a GND pin terminal 1b, and a VCC pad terminal 2 are provided.
a, a VCC1 pad terminal 2a ', and a GND pad terminal 2b, and the terminals 1a-2a are diode elements 5
Are electrically connected by means of power supply leads 3a, 3a ', and the terminals 1a-2a' are electrically connected by means of power supply leads 3a ", 3a 'via a diode element 5'. , Power lead 3 between terminals 1b-2b
It is shown that they are electrically connected by b.

Further, between the power leads 3a-3b and 3a "
It shows that the storage batteries 4 and 4'are connected between -3b.

The VCC pad terminal 2a is connected to the VCC of MAIN of the internal IC 6, and the VCC1 pad terminal 2a '.
Is connected to the VCC of a relatively low power consumption area (hereinafter abbreviated as backup area) for recording the internal state and the like of the internal IC 6 in an emergency.

The charging capacity of the storage battery 4 is set to a capacity capable of sufficiently compensating until the internal IC 6 completes the backup operation in the backup area, and the charging capacity of the storage battery 4'is sufficient to recover the fluctuation of the power supply potential and operate normally. Use a capacity that can be compensated.

By making such a setting, even in the case of the internal IC 6 which consumes a relatively large amount of power, it is possible to compensate with a storage battery having a small charge capacity, and it is possible to further improve reliability.

[0020]

As is apparent from the above description, according to the semiconductor integrated circuit device of the present invention, by incorporating the storage battery and the diode element, the operating state of the internal IC can be adjusted against the fluctuation of the power supply voltage, for example, the first This embodiment has an effect that compensation can be performed over a long period of several seconds to several minutes, and in the second embodiment over a long period of several minutes to several days.

[Brief description of drawings]

FIG. 1 is an equivalent circuit diagram between a pin terminal and a pad terminal of a power supply according to a first embodiment of the present invention.

FIG. 2 is a perspective view of the semiconductor integrated circuit device shown in FIG.

FIG. 3 is an equivalent circuit diagram between a power supply pin terminal and a pad terminal according to a second embodiment of the present invention.

FIG. 4 is an equivalent circuit diagram between a pin terminal and a pad terminal of a conventional power supply.

[Explanation of symbols]

 1a VCC pin terminal 1b GND pin terminal 2a VCC pad terminal 2a 'VCC1 pad terminal 2b GND pad terminal 3a, 3a', 3a ", 3b Power supply lead 4, 4 'Storage battery 5 Diode element 6 Internal IC 7 Capacitor element

Claims (2)

[Claims] 1. A storage battery and a diode element for preventing the storage battery from discharging, wherein a + electrode of the storage battery is connected to a high potential side power supply lead of a package, and a − electrode of the storage battery is a low potential side of the package. A semiconductor integrated circuit device characterized in that it is connected to a power supply lead and the diode element is connected so as to be forward-biased by a voltage externally applied between the leads. 2. The semiconductor integrated circuit device according to claim 1, wherein two sets of circuits each including a diode element and a storage battery are prepared.