JPH05162245A - Laminated sheet - Google Patents

Abstract

PURPOSE:To enhance the insulating reliability between patterns by integrally arranging metal foil to the outermost layer of a laminate composed of a required number of resin impregnated base materials through an inorg. ion exchanger-containing resin layer. CONSTITUTION:A resin solution consisting of 90 pts. of a bisphenol A type epoxy resin, 10 pts. of a phenol novolac type epoxy resin, 2 pts. of dicyandiamide, 0.1 pts. of 2-ethyl-4-methylimidazole, 50 pts. of an equal amount solvent mixture of DMF and methyl cellosolve and 5 pts. of an inorg. ion exchanger is applied to the upper and rear surfaces of seven prepregs each composed of epoxy resin impregnated glass cloth with a thickness of 0.2mm in a thickness of 0.01mm and the coated prepregs are dried. Copper foils with a thickness of 0.035mm are arranged to both surfaces of the prepregs to form a laminate which is, in turn, molded to obtain a laminated sheet with a thickness of 1.6mm. An electric circuit with a line width of 0.45mm and a line interval of 0.4mm is formed on the laminated sheet.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic equipment, electric equipment,
The present invention relates to an electric laminated plate used for a computer, a communication device and the like.

[0002]

2. Description of the Related Art Conventionally, a metal foil-clad laminate of paper phenol,
When a printed wiring board or the like is subjected to through-hole processing with silver paste, short-circuiting may occur due to silver migration. In addition, if a fine pattern or high-density wiring is formed on a metal foil-clad laminate of glass epoxy, a printed wiring board, or the like, the line spacing may be narrowed, and insulation failure due to copper migration may occur.

[0003]

As described in the prior art, in the conventional laminated board and printed wiring board, short circuit,
Poor insulation may occur. The present invention has been made in view of the above-mentioned problems in the prior art, and an object of the present invention is to leave chlorine ions, sodium ions, iron ions and other ionic impurities remaining in the resin in the PPM order, and hydrolyzability. It is an object of the present invention to provide a laminated plate capable of trapping chlorine and hydrolyzable bromine and applying them to trap silver ions moving as ions to secure insulation reliability between patterns.

[0004]

According to the present invention, an inorganic ion exchanger-containing resin layer is interposed in the outermost layer in which a required number of resin-impregnated base materials are stacked, and then a metal foil is disposed and integrated. Since the laminated plate is characterized by the fact that the above object can be achieved, the present invention will be described in detail below.

The resin of the resin-impregnated base material used in the present invention includes phenol, epoxy resin, unsaturated polyester resin, polyimide resin, polyphenylene oxide resin,
Polyphenylene sulfide resin, fluororesin, etc. alone, modified product, or mixture is used. If necessary, talc,
Inorganic powder fillers such as clay, silica, calcium carbonate and aluminum hydroxide, and fibrous fillers such as glass fibers, asbestos fibers, pulp fibers, synthetic fibers and ceramic fibers can be added. Glass as the base material,
Inorganic fibers such as asbestos, organic fibers such as polyester, polyamide, polyacryl, polyvinyl alcohol, polyimide, and fluororesin, and natural fibers such as cotton, woven cloth, nonwoven cloth, and paper can be used. The resin of the resin-impregnated base material may be impregnated with only the same resin, but may be plural impregnations such as primary impregnation with the same resin or different type resin and secondary impregnation so that more uniform impregnation can be performed. Thus, after impregnating the base material with the resin, it is dried by heating or the like, if necessary, to obtain a resin-impregnated base material. As the metal foil, a metal foil having a thickness of 0.018 to 0.07 mm, such as copper, aluminum, brass, nickel, iron, etc., alone, alloy, or composite foil can be used. The inorganic ion exchanger-containing resin layer is a resin layer containing an inorganic ion exchanger mainly containing a transition metal-containing metal oxide such as phosphorus, arsenic, antimony, bismuth, aluminum, gallium, indium, and the like. -A thermosetting resin such as an epoxy resin, an epoxy resin, a polyimide resin, a butyral resin, and a melamine resin, and a thermoplastic resin alone, a modified product, or a mixture, if necessary, with a curing agent, a curing accelerator, a crosslinking agent, or a solvent added. 1 to 20 parts of the above inorganic ion exchanger was added to 100 parts by weight of the resin solid content (hereinafter simply referred to as "part"). That is, if it is less than 1 part, it is difficult to improve the insulation reliability between the patterns, and if it exceeds 20 parts, it is difficult to improve the effect. If necessary, an inorganic powder filler such as talc, clay, calcium carbonate, aluminum hydroxide or silica can be added to the resin. The resin layer is formed by applying a liquid resin, a resin film, a prepreg, or the like, and it is preferable that the resin layer is arranged so as to have a thickness of 0.001 to 0.5 mm. The uniting means is not particularly limited to a press, a multi-roll, a double belt, a pressureless continuous method and the like.

The present invention will be described below based on examples.

[0007]

Example 1 90 parts of bisphenol A type epoxy resin, 10 parts of phenol novolac type epoxy resin, and 2 parts of dicyandiamide were placed on the prepreg surface on the top and bottom surfaces of seven glass cloths impregnated with epoxy resin having a thickness of 0.2 mm. A resin solution consisting of 0.1 part of 2 ethyl 4-methyl imidazole, 50 parts of a mixed solvent of DMF and methyl cellosolve in an equal amount, and 5 parts of an inorganic ion exchanger (manufactured by Toagosei Chemical Industry Co., Ltd., product number IXE-600). After coating and drying so as to have a thickness of 0.01 mm, a laminate having copper foil with a thickness of 0.035 mm is laminated and molded at a molding pressure of 40 Kg / cm ² and 165 ° C. for 90 minutes to obtain a thickness of 1 A laminated plate of 0.6 mm was obtained, and an electric circuit having a line width of 0.45 mm and a line interval of 0.4 mm was prepared on the laminated plate.

[0008]

Example 2 Paper 0.2 impregnated with phenol resin having a thickness of 0.2 mm
35 parts of butyral resin, 10 parts of cresol novolac type epoxy resin,
50 parts of resol type phenol resin, 60 parts of toluene, 80 parts of methanol, 115 parts of MEK, inorganic ion exchanger (manufactured by Toa Gosei Chemical Industry Co., Ltd., product number IXE-300)
A resin liquid consisting of 3 parts was applied to a thickness of 0.02 mm and dried, and then a laminated body in which copper foil with an adhesive having a thickness of 0.035 mm was arranged was formed at a molding pressure of 100 Kg / c.
m ² at 160 ° C. for 60 minutes by lamination molding and thickness 1.6 mm
After the copper foil of the laminate was etched, an electric circuit having a line width of 0.45 mm and a line interval of 0.4 mm was formed on the etched surface with silver paste.

[0009]

[Comparative Example 1] The resin liquid was not applied to the outermost prepreg surface,
A laminate having a thickness of 1.6 mm was obtained by the same treatment as in Example 1 except that the laminate was used as it was.

[0010]

[Comparative Example 2] The resin liquid was not applied to the outermost prepreg surface,
A laminated plate having a thickness of 1.6 mm was obtained by the same process as in Example 2 except that the laminate was used as it was.

The performance of the laminates of Examples 1 and 2 and Comparative Examples 1 and 2 are shown in Table 1.

[0012]

[Table 1] * 85 ° C, 85% R for Example 1 and Comparative Example 1
The insulation resistance between the patterns was measured at H, 100 VDC, and for Example 2 and Comparative Example 2, 60 ° C., 90% RH, 50
The insulation resistance between the patterns was measured at VDC.

[0013]

The present invention is constructed as described above. It was confirmed that in the laminated plate having the structure described in the claims, the insulation reliability between the patterns was improved, and the present invention was excellent.

Claims (1)

[Claims] 1. A laminated plate comprising a resin foil impregnated base material of a required number and an inorganic ion exchanger-containing resin layer interposed in the outermost layer, and then a metal foil is disposed and formed into a body.