JPH05166472A - Electron beam generating device and manufacture thereof - Google Patents

Abstract

(57) [Abstract] [Purpose] To prevent the thermal expansion of the curved substrate due to the generated heat and the deformation of the electrode due to the unevenness of the thickness of the insulating film. [Structure] At least a linear cathode 38, a linear cathode support member 37 that abuts and holds the linear cathode 38, and the linear cathode 38 and the linear cathode support member 37 are held in a predetermined curved shape. The curved substrate 30 includes a through hole 33 formed in a metal substrate by a punching method, and an insulating film 34 is formed by an electrodeposition process.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electron beam generator using a linear cathode for use in a color television receiver or display for displaying characters or images, and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, an electron beam generator is disclosed in, for example, Japanese Patent Laid-Open No. 54-14808. FIG. 5 is an exploded perspective view of the conventional electron beam generator, and 1 is an insulating substrate provided with an electron beam control electrode 2. The insulating substrate 1 is provided with pin mounting holes 3 while avoiding the electron beam control electrodes 2. 4, the core wire is a refractory metal wire,
For example, a linear cathode made of a tungsten wire, the surface of which is coated with a thermionic emission material. A plurality of linear cathodes 4 are stretched so as to be substantially orthogonal to the electron beam control electrode 2. In order that the linear cathode 4 and the electron beam control electrode 2 can maintain a constant space, the linear cathode 4 is stretched by supporting metal fittings 6 at both ends of the base substrate 5 with a spring action. The pitch of the electron beam control electrodes 2 and the pitch of the filament cathodes 4 are determined according to the required density of electron beams. Reference numerals 7 and 8 are electrodes made of a thin metal plate for taking out the electron beam in a focused state, and the through holes 9 and 10 provided along the longitudinal direction of each linear cathode 4 have a required diameter of electrons. It is determined by the size of the beam and the positional relationship between the electrodes. The electrodes 7 and 8 are provided with pin mounting holes 11.

The insulating substrate 1, the linear cathode 4 and the metal electrodes 7 and 8 described above are provided with pins 12 arranged at regular intervals.
And is attached to the base substrate 5. A ring-shaped spacer 13 is inserted through a pin in order to keep the distance between the electron beam control electrode 2 and the linear cathode 4 and the metal electrode 7 constant.

The electrodes 7 and 8 made of metal are insulated and held at the outer frame. And these parts are stored in a vacuum glass container. In the conventional electron beam generator configured as described above, the linear cathode 4 is
Electron beam control electrode 2 on insulating substrate 1 kept at 650 ℃,
The voltage applied to each of the electrodes 7 and 8 is changed to extract an electron beam from the filament cathode 4 and guide the electron beam to a phosphor surface (not shown) to irradiate the phosphor.

Further, FIG. 6 is a sectional view of an electron beam generator described in Japanese Patent Application No. 2-143119.
The conventional example shown in FIG. 5 relates to a structure for preventing the vibration of the linear cathode 4'generated when the size is increased. That is, the base substrate 5'and the insulating substrate 1'are made into a curved shape as a whole, and the insulating substrate 1'is provided with an opening 14 at a portion corresponding to the electron beam control electrode 2 ', and a linear cathode support having insulation and heat resistance. The member 15 is laminated, and the linear cathode 4'is provided and held on the surface thereof.
Reference numerals 16 and 17 are reinforcing ribs for keeping the curvature, and the base mounting board 5'and the insulating board 1 ', using the pin mounting holes,
Alternatively, the cathode support member 15 or the like is fixed by the pin 12 '.

FIG. 7 is a schematic view showing the characteristics when an insulating film is formed on an insulating substrate 1'by an electrodeposition process in a conventional example. The film forming process of the insulating substrate 1'will be described with reference to the conceptual diagram of the electrodeposition process of FIG.

First, a thin metal substrate 19 (1 mm or less in the present invention) having through holes 18 formed in a predetermined pattern is used as a negative electrode 20, a counter electrode is a positive electrode 21, and glass particles 22 having a fine particle size, for example, an alkali-free crystal. Glass (SiO ₂ -B
₍₂ O ₅ -MgO-CaO) is dispersed in isopropyl alcohol 23, and when an electric field is applied to both electrodes 20, 21 in electrolytic cell 24, glass particles 22 are electrophoresed on metal substrate 19 which is a negative electrode to form a film. Is done. Thereafter, a dry firing process is performed to form a dense insulating film having a high adhesiveness.

[0008]

However, in the above-mentioned structure, the manufacturing cost of the insulating substrates 1 and 1 ′ is increased when the size is increased or when the cathode power is increased to require brightness. Problems such as getting higher,
The generated heat causes thermal expansion of the substrates 1 and 1'and deformation of the electrodes due to unevenness of the thickness of the insulating film, which causes a problem that the landing of the electron beam is shifted and a defective image is generated.

For example, in the case of performing the electrodeposition process as described above, when the through hole 18 is provided in the metal substrate 19 by etching as shown in FIG. 7, the end portion 25 forms an acute edge portion, Therefore, current concentration occurs at the end portion 25 during the electrodeposition process, and the excessive film thickness region 26 as shown in the figure is formed over a wide range. The excessive film thickness region 26 is called a meniscus.
The size H1 of this region depends on the film thickness and the diameter of the through hole, but if the hole diameter of 1 mm is 100 μm and the film thickness is about 3 mm, then it is provided on the outer periphery of the through hole 18 described above. Since the distance between the cathode 4'and the electron beam control electrode 2'in FIG. 6 is strictly maintained, the thickness of the insulating layer formed by printing cannot be controlled, resulting in defective image quality.

When the metal substrate 19 is thus etched, fine pits (holes) are formed on the surface of the metal substrate 19, and defects such as film cracks are likely to occur during the electrodeposition process, resulting in a bare defect. The rate was high.

The present invention solves these problems and provides an electron beam generator which is inexpensive to manufacture and has no image defects.

[0012]

The technical means of the present invention for solving the above problems are as follows. According to the first aspect of the present invention, at least a linear cathode, a linear cathode support member that abuts and holds the linear cathode, and the linear cathode and the linear cathode support member are held in a predetermined curved shape. In the electron beam generator, the curved substrate has a through hole formed in a metal substrate by a punching method, and an insulating film is formed by an electrodeposition process.

According to a second aspect of the present invention, at least a linear cathode, a linear cathode support member that abuts and holds the linear cathode, and the linear cathode and the linear cathode support member are curved in a predetermined manner. A method of manufacturing an electron beam generator comprising: a curved substrate that holds a shape, wherein the curved substrate is formed by punching a through hole in a metal substrate from an outer peripheral edge side to an inner peripheral edge side by a punching method. , An insulating film is formed by an electrodeposition process, and a plurality of electron beam control electrodes are provided on the insulating film on the outer peripheral edge side of the curved substrate, and an insulating layer is provided around a through hole on the same insulating film by a printing process. ..

According to a third aspect of the present invention, at least a linear cathode, a linear cathode support member that abuts and holds the linear cathode, and the linear cathode and the linear cathode support member are curved in a predetermined manner. An electron beam generator comprising a curved substrate that holds a shape, wherein the curved substrate forms a sprayed film on a metal substrate by a spraying process, and the surface layer of the sprayed film is an organometallic polymer that becomes ceramic after heating. Layers are provided.

According to a fourth aspect of the present invention, at least a linear cathode, a linear cathode support member that abuts and holds the linear cathode, and the linear cathode and the linear cathode support member are curved in a predetermined manner. A method of manufacturing an electron beam generator comprising a curved substrate that holds a shape, wherein the curved substrate has a sprayed film formed on a metal substrate by a spraying process, and an organometallic polymer is applied to the surface layer of the sprayed film. Baking is performed to seal the pores, and a plurality of electron beam control electrodes and an insulating layer around the through holes are provided on the surface of the organometallic polymer by a printing process.

[0016]

The function of this technical means is as follows.
According to the first and second aspects, the curved substrate has the insulating film formed by the electrodeposition process on the metal substrate in which the through holes for mounting the pins are formed by the punching method.
In addition to forming a very dense insulating film, it is possible to obtain a curved substrate that can be easily curved and is low in cost without using a ceramic substrate or the like. In addition, when forming an insulating layer around the through hole on the insulating film formed by the electrodeposition process around the through hole in the printing process, a punching process is performed from the outer peripheral edge side to the inner peripheral edge side of the curved substrate. By forming the through hole by the method, the unevenness of the film thickness of the insulating film in the through hole portion generated in the electrodeposition process is eliminated on the outer peripheral edge side of the curved substrate.

On the other hand, according to the third and fourth aspects, since the insulating film is formed on the curved substrate by the thermal spraying process, the film can be easily formed only on the surface on which the insulating film is to be formed, that is, the printing surface. Also, since the thermal spray film can be applied to most materials, a material with a low coefficient of thermal expansion can be selected, and since the film quality is relatively porous, stress relaxation due to thermal expansion acts, causing thermal deformation of the curved substrate itself. Can be suppressed. The surface layer is coated with an organometallic polymer which becomes ceramic after being heated, so that its insulating property is maintained.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electron beam generator according to an embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view of an embodiment of the electron beam generator according to the present invention, and FIG. 2 shows the details of the portion A in FIG. In the figure, reference numeral 30 denotes a curved substrate, which is formed in a predetermined curved shape, and a plurality of ribs 31 are provided to keep the curved shape.
It is fixed to the back surface of the curved substrate 30 by 32. Curved board
Through holes are provided in 30 as shown at 33 in FIGS. 1 and 2. In addition, an insulating film 34 as shown in FIG. 2 is formed to a predetermined thickness on both surfaces of the curved substrate 30 (but only the front surface), and an electron beam control electrode 35 is formed on the insulating film 34 to a predetermined thickness. The width and pitch are formed by a printing process. An insulating layer 36 is formed around the through hole 33 so as to have a predetermined thickness, and a cathode support member 37 is laminated while being controlled to have an appropriate thickness gap. The cathode support member 37 includes an insulating film 37 on a metal substrate 37A.
B is formed, a portion corresponding to the position of the electron beam control electrode 35 is opened, and a linear cathode 38 for electron beam emission is provided and supported by the cathode support member 37. A member 39 for laminating and supporting these constituent elements is provided on the upper part thereof, and a pin 40 provided on the member 39 is inserted through the through hole 33 and fixed by a fastener 41 on the back surface of the curved substrate 30. ing. At this time, the member 39 is also an electrode for focusing and deflecting the electron beam emitted from the linear cathode 38.

The mode of operation of the electron beam generator thus constructed will be described. When the linear cathode 38 is heated to about 650 ° C. as in the conventional example, thermoelectrons are emitted from the linear cathode 38, and the on-off of the voltage applied to the electron beam control electrode 35 of the curved substrate 30 causes the front of the electron beam (see FIG. 1). It controls the release in the upper direction). By adopting such a configuration as a whole, the linear cathode 38 can stably emit an electron beam without vibrating even when the size is increased.

The important points in such a configuration are as follows. That is, the emission of the electron beam is uniform over the entire area of the entire surface, and the emitted electron beam is applied to the fluorescent screen (not shown) in a uniformly controlled manner. For that purpose, the following is required as the configuration of this electron beam generator. That is, since the forward emission of the electron beam is controlled by the voltage applied to the electron beam control electrode 35, the distance D between the surface of the electron beam control electrode 35 and the linear cathode 38 shown in FIG. It is necessary to keep The second point is that the structure has a large number of such heat sources, and therefore it is necessary that they are thermally reduced in deformation.

Next, a method of manufacturing the curved substrate 30 of the present invention will be described. In the present invention, as shown in FIG.
The through hole 43 is formed by punching. That is, the through hole portion 43 is formed by the cutting action of the male die 44 and the female die 45 at the time of punching, but at that time, the end shape is rounded at the corner as shown in the figure on the outer peripheral edge side of the curved substrate 30, The inner peripheral edge has a convex shape. When a film is formed on such a shaped surface by the above-described electrodeposition process, an excessive film thickness region 46 is generated on the female die 45 surface, but the male die 44 surface is formed.
On the surface, the smooth film formation of the substantially rounded portion 47 is realized, and the area H2 of the rounded portion 47 is as small as about 1 mm,
It is very small compared to the time of etching, and it is a male type
Forming an insulating layer by printing on the 44th surface ensures sufficient thickness and pattern accuracy, and prevents image quality defects. Further, unlike etching, the surface of the substrate 42 is not roughened, so that no film defect occurs during the electrodeposition process.

Next, a second embodiment of the present invention will be described with reference to FIG. As described above, the electron beam generator of the present invention uses a large number of heated linear cathodes 38, so that a thermal load is applied to each component and each component thermally expands. At this time, it is necessary for each member to have a structure in which the landing of the electron beam does not change even if it thermally expands, or to minimize the thermal expansion so that the landing is not affected. In particular, since the curved substrate 30 is used in the present invention, it is important to prevent the curved shape from changing. Therefore, in the first embodiment in which the insulating film is formed on the curved substrate 30 by the electrodeposition process, a metal having a low thermal expansion coefficient is used as the metal substrate 42, or the thermal expansion coefficient of the rib 31 for maintaining the curvature is adjusted to bend the metal. It was preventing change.

In the second embodiment of the present invention, the problem is solved by focusing on the film quality of the insulating film as follows. That is, since the heat generation source is located above the curved substrate 30, heat conduction to the curved substrate 30 is suppressed as much as possible. In FIG. 4, reference numeral 48 denotes a metal substrate which constitutes a curved substrate, and through holes are provided (not shown) as in the first embodiment. In the present invention, the sprayed film 50 is formed by a spraying process. The thermal spraying process is a method in which fine powder particles are heated and melted by a torch 49 with a certain heat source and sprayed and deposited on the substrate 48 at a high speed.Therefore, the sprayed film 50 deposited on the substrate 48 is flat as shown in the figure. It has a laminated structure of atomized particles and has pores 51 between the particles. Therefore, the film becomes a low thermal conductive film as compared with the case where the material having a low thermal conductivity is used as the particles, and particularly the thermal conductivity becomes low in the direction perpendicular to the laminated surface.

However, as described above, pores 51 are formed in the film.
When a conductive film is printed on the upper surface due to the presence of the slag, the material easily penetrates into the film and becomes conductive with the substrate 48. Therefore, in the present invention, as shown in FIG. 4 (b), the organometallic polymer 52 is applied to the surface layer portion of the sprayed film 50 and heated and baked. At this time, as the organometallic polymer 52, a Tyranno coat that turns into a ceramic after firing is used. By this process, the upper layer portion is sealed with the pores 51 of the sprayed film 50,
As shown in FIG. 4 (c), even if the electron beam control electrode 35 made of a conductive material is formed thereon by a printing process, it is sufficiently insulated from the metal substrate 48.

By doing so, the metal substrate 48
Therefore, the heat conduction to the substrate can be suppressed, and therefore, the curving deformation due to the thermal expansion of the substrate 48 and the thermal expansion of the ribs therebelow can be prevented, and the landing change that causes the image quality defect can be suppressed. Further, as the thermal spray material, it is possible to select a material that not only has a low thermal conductivity but also a small thermal expansion of the film itself. Further, since pores naturally exist in the lateral direction of the film, the stress generated by the thermal expansion in that direction is also relaxed, and the substrate 48 acts in a direction in which the deformation is smaller.

In the present invention, the first embodiment and the second embodiment are individually described. However, both are combined to form a thin insulating film by an electrodeposition process, and then a sprayed film is provided. It goes without saying that the above also falls within the scope of the present invention.

[0028]

As described above, according to the present invention, after the through holes of the curved substrate are formed by the punching method,
When the insulating film is formed by the electrodeposition process and the insulating layer that keeps the gap with the cathode supporting member is formed around the through hole by the printing process, the gap between the cathode and the control electrode can be uniformly held over the entire surface, and a uniform image can be formed. You can

Further, since the insulating film is formed on the curved substrate by a thermal spraying process, since the film quality is porous, heat conduction to the substrate is suppressed, and stress relaxation due to thermal expansion acts so that the curved substrate itself is Thermal deformation is suppressed. The surface layer is coated with an organometallic polymer which becomes ceramic after being heated, so that its insulating property is maintained.

[Brief description of drawings]

FIG. 1 is a sectional view of an electron beam generator according to a first embodiment of the present invention.

FIG. 2 is a detailed view of part A of FIG.

FIG. 3 is a schematic view of forming an insulating film in an electrodeposition process on a curved substrate.

FIG. 4 is a schematic view of forming an insulating film in a thermal spraying process on a curved substrate.

FIG. 5 is a schematic view of an electron beam generator in a conventional example.

FIG. 6 is a schematic view of an electron beam generator in a conventional example.

FIG. 7 is a schematic view of forming an insulating film in an electrodeposition process on a curved substrate.

FIG. 8 is a conceptual diagram of an electrodeposition film forming process.

[Explanation of symbols]

 30 Curved substrate 33 Through hole 34 Insulation film 35 Electron beam control electrode 36 Insulation layer 37 Cathode support member 38 Linear cathode 42 Metal substrate 43 Through hole 46 Over-thickness region 44 Male 48 Metal substrate 50 Sprayed film 51 Pore 52 Organic metal polymer

Claims (4)

[Claims] 1. A linear substrate, at least a linear cathode, a linear cathode support member that abuts and holds the linear cathode, and a curved substrate that holds the linear cathode and the linear cathode support member in a predetermined curved shape. An electron beam generator including: the curved substrate, wherein a through hole is provided in a metal substrate by a punching method, and an insulating film is formed by an electrodeposition process. 2. A linear cathode, a linear cathode support member that abuts and holds the linear cathode, and a curved substrate that holds the linear cathode and the linear cathode support member in a predetermined curved shape. A method of manufacturing an electron beam generator comprising: a curved substrate, wherein a through hole is formed in a metal substrate from an outer peripheral side of the curved substrate toward an inner peripheral side by a punching method, and then the curved substrate is insulated by an electrodeposition process. A method of manufacturing an electron beam generator in which a film is formed, and a plurality of electron beam control electrodes are provided on an insulating film on the outer peripheral edge side of a curved substrate, and an insulating layer is provided around a through hole on the same insulating film by a printing process. .. 3. A linear cathode, a linear cathode support member that abuts and holds the linear cathode, and a curved substrate that holds the linear cathode and the linear cathode support member in a predetermined curved shape. An electron beam generator comprising: a curved substrate, wherein the curved substrate is formed with a sprayed film on a metal substrate by a spraying process, and an organic metal polymer layer that is ceramicized after heating is provided on a surface layer of the sprayed film. Generator. 4. A linear substrate, at least a linear cathode, a linear cathode support member that abuts and holds the linear cathode, and a curved substrate that holds the linear cathode and the linear cathode support member in a predetermined curved shape. A method of manufacturing an electron beam generator comprising: a curved substrate, wherein after forming a sprayed film on a metal substrate by a spraying process, an organometallic polymer is applied to the surface layer of the sprayed film and baked to seal the pores. A method of manufacturing an electron beam generator, wherein a plurality of electron beam control electrodes, which are perforated, are provided on the surface of the organometallic polymer, and an insulating layer is provided around the through holes by a printing process.