JPH05172265A - Gas control device - Google Patents

Abstract

PURPOSE:To provide a gas control device, which does not require any indirect connecting means such as piping, pipe fitting, etc., between unitary functioning parts, can be accomplished at a low cost, occupies less space, and presents less amount of gas release. CONSTITUTION:A gas control device is installed in a flow line for high purity gas and is characterized by directly coupled three or more unitary functioning parts 2, 3, 4, 6, 7 consolidatedly. This direct coupling of three parts eliminates provision of any indirect connecting means for connecting them such as a pipe fitting, etc., which saves cost accordingly and lessens the space occupied. Because of elimination of necessity for joint connection and welding connection, the total amount of external leakage is lesser, and also the gas release amount is less due to small total surface area of the piping inner surfaces to lead to prevention of the gas purity from dropping.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a gas control device used in, for example, a semiconductor device manufacturing process.

[0002]

2. Description of the Related Art In semiconductor device manufacturing processes in which high integration is being advanced at a rapid pace, especially in wafer processing processes, elimination of factors adversely affecting device characteristics is more strongly demanded than before, and it is supplied. It is also required that the amount of impurities contained in the gas is extremely small.
Therefore, in addition to individual components in the gas flow system, for example, various surface treatments such as electrolytic polishing or special polishing such as chemical polishing are performed on the inner surface of all channels to minimize the storage and release of impure gas. Improvements are being made. Moreover, the price of semiconductor manufacturing equipment is increasing more and more, and the amount of capital investment is also increasing as the number of wafer processing steps increases with the integration of semiconductors. Further cost reduction is an essential requirement as the equipment becomes more sophisticated.

[0003] By the way, among gas control devices in semiconductor manufacturing equipment, a flow control unit commonly provided immediately before various reaction furnaces and the like is shown in FIG. As shown in FIG. 24, which is a corresponding layout diagram (hereinafter, referred to as a first conventional example), three kinds of process gases flowing from the inflow ports A, B, C through the filters a ... Switch by ...
The flow rate is controlled by the mass flow controller c ..., and is supplied from the outlet D to the reaction furnace. Also,
The flow system of the purge gas (usually N ₂ ) has a flow path led from the inflow port E to the outflow port D via the same single-function members a, b and c as described above, and the exhaust port F via each of the other mass flow controllers c. The pressure detecting member d is provided on the inflow side. In this first conventional example, a double-combined valve (partitioned by a broken line in FIG. 23) is used in part, but other single-function members are connected via pipes and joints. As shown in FIG. 24, the external dimensions are 61 cm in length L and 23 cm in width W.
Height H is about 14 cm.

Further, a typical cylinder cabinet in a semiconductor manufacturing apparatus has two types of processes as shown in a system diagram of FIG. 25 and a layout diagram of FIG. 26 (hereinafter referred to as a second conventional example). Process gas control parts f and f respectively provided in the flow paths for guiding the gas from the containers e and e to the outlets A and B and the atmospheric components that have invaded the vicinity of the cap when the process gas containers e and e are replaced In order to achieve high pressure from container g (150 kgf / cm ² ) And a purge gas control section h provided in a flow path for introducing N ₂ and Ar. Low pressure (7 kgf / cm ² ) introduced from the supply source (not shown) in the factory to the inlet C ) N ₂ gas is the process gas exhaust port D
It is for diluting its toxicity, corrosiveness, reactivity with air, etc. Note that, in FIG. 25, portions f, f, and h sectioned by alternate long and short dash lines show portions corresponding to the embodiment shown in FIG. 19 of the present invention, and the numeral symbols are the same as in FIG.

Also in this second conventional example, a double-type and a triple-type compound valve (shown by being divided by a broken line in FIG. 25) 29 ... Is partially provided, and the other single-function members are pipes and joints. Since the cabinets are connected via a cable, the dimensions of the cabinet indicated by the chain double-dashed line in FIG. 26 have a width W of 160 cm and a height H.
Is about 200 cm.

[0006]

In the above conventional example, since the number of pipes and joints between the single function members is large,
(A) The occupied space is large, (b) The total amount of external leakage is increased due to the large number of seal portions, (c) The total area of the inner surface is increased due to the long piping, and the amount of impure gas released is increased. Costs such as (d) procurement of pipes and joints, work of connection (including welding) and leakage inspection of multiple connection parts, etc. are required, which causes a decrease in gas purity.
There were problems such as.

In order to solve such a problem, a combination of two shutoff valves b, b and one mass flow controller c (see FIG. 27), one built-in filter a and two shutoff valves b. , B (see FIG. 28), two shutoff valves b, b and one pressure detector d (see FIG. 29)
Have been proposed. However, it is difficult to significantly reduce the length of the pipe and the number of connecting portions with such a composite, and the above (a), (b), (c),
The problem of (d) cannot be solved.

Further, the mass flow controller d is often damaged because it is relatively liable to be broken, but in the configuration shown in FIG. 27, it is necessary to remove it together with the two shut-off valves b, b. A separate valve must be provided to prevent the ingress of atmosphere, which is necessarily costly. On the other hand, if this is not done, each removal will result in widespread air pollution of other tubing systems. Moreover, since the mass flow controller itself has variations in size, it is difficult to secure the sealing performance in connection with variations in the crushing margin of the metal gasket for sealing if a plurality of sets having the configuration shown in FIG. 27 are connected. There is a problem such as.

The present invention has been made in order to solve the above-mentioned problems, and an object of the present invention is to eliminate the need for indirect connecting means such as pipes and joints between single-function members, and It is an object of the present invention to provide a gas control device which occupies a small amount of space and has a small amount of released impure gas.

[0010]

The first aspect of the present invention is to integrally and directly connect three or more kinds of monofunctional members in a gas control device in which a plurality of monofunctional members are provided in a high-purity gas flow system. Is characterized by.

A second aspect of the present invention is a gas control device in which a plurality of single-function members are provided in a high-purity gas flow system, and three or more single-function members have a flow path communicating with these single-function members. It is characterized in that it is integrally connected to the unit block formed.

[0012]

According to the present invention, in any case, three or more kinds of single-function members are directly connected to each other or connected to a block having a flow path communicating with these single-function members. It is not necessary to provide special indirect connecting means such as pipes and joints for connecting the functional members, and the problems (a) to (d) in the conventional device can be solved.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 12 show a first embodiment of the present invention,
FIG. 1 is a piping diagram of a gas control device in a semiconductor manufacturing apparatus. This piping structure is configured so as to correspond to the system diagram shown in FIG. That is, in the process gas distribution line 13 having the inflow ports A, B, and C, three types of process gas flowing in through the filters 7 can be switched by the shutoff valves 3 and 4. The gas flow controller 2 controls the flow rate and supplies the gas from the outlet D to the reactor.
Further, the purge gas (normally N ₂ ) flow line 14 can switch the purge gas flowing from the inflow port E through the filter 7 by shut-off valves 3 ..., 4 ..., And via the gas flow controller 2. The pressure detection sensor 5 is provided on the inflow side while being guided to the outflow port D. Each gas flow controller 2 in the process gas distribution line 13 is also connected to the purge gas distribution line 14 via the other shutoff valves 6 ...

The process gas distribution line 13 ... And the purge gas distribution line 14 are unitized. First, the unit of the process gas distribution line 13 will be described. The process gas distribution line 13 has a unit structure as shown in FIG. 3, and includes the filter 7, the shutoff valves 3 and 6, the gas flow controller 2, and the shutoff valves 4 and 6. The gas flow controller 2 has a pedestal 8 as schematically shown in FIG. 4 and specifically shown in FIG.
A flow sensor 201 and a piezo-electric element type control valve 202 are attached to and integrated with each other. The piezo-piezoelectric element type control valve 202 includes a piezo-piezoelectric element 203 and a valve element 204 which is opened and closed by the piezo-piezoelectric element 203. The pedestal 8 has channels 10, 1 opened to connect to the on-off valves 3 and 4.
0 is formed. The shutoff valves 3, 6, 4 and 6 are directly connected to the pedestal 8 of the gas flow controller 2.

Each of these shutoff valves is constructed by attaching a valve actuator to the valve casing, and the two shutoff valves 3 and 6 on the upstream side of the gas flow controller 2 have a double structure. Yes, as shown in FIG. 6, two valve actuators 4 are provided on a single valve casing 401a.
02 and 403 are attached, and the filter 7 is further attached. To explain this, since the two valve actuators 402 and 403 may have the same structure,
Explaining one, the piston 406 is operated by the pressure introduced from the pressure inlet 405,
6 through the stem 407 to the metal diaphragm valve 4
It is structured to operate 08. The valve casing 401a to which the valve actuators 402 and 403 are attached is connected to the passage 410 connected to the inlet A (B, C) of the process gas flow line 13 and the passage 10 of the gas flow controller 2. The passage 411 and the passage 412 that is connected to the inlet E of the purge gas distribution line 14.
Are formed. And one valve actuator 4
02 opens and closes the communication between the passages 410 and 411, and the other valve actuator 403 opens and closes the communication between the passages 412 and 411.

The filter 7 is connected to the passage 410 of the valve casing 401a. The filter 7 has an inlet A (B, C) of the process gas flow line 13 formed at one end of a filter casing 470 and a flange portion 471 formed at the other end, and a metal filter 472 is housed in the middle thereof. , The flange portion 47 at the other end
It is connected to the valve casing 401a via a bolt (not shown). In addition, 473 shows a metal O-ring.

On the other hand, two shutoff valves 4 and 6 are also provided on the downstream side of the gas flow controller 2, which are also of a double type and have the structure shown in FIG. In other words, a single valve casing 401b has the same 2
A number of valve actuators 422, 423 are attached. In this case, in the valve casing 401b to which the valve actuators 422 and 423 are attached, a passage 431 connected to the flow passage 10 of the gas flow controller 2, a passage 432 connected to the outlet F of the process gas distribution line 14, and A passage 433 is formed to communicate with the outlet D of the purge gas distribution line 13. One valve actuator 423 opens and closes the communication between the passages 431 and 432, and the other valve actuator 422 opens the passages 431 and 43.
The communication with 3 is opened and closed.

Therefore, the process gas distribution line 13
Is directly connected to the valve casing 401a shown in FIG. 6 and the pedestal 8 shown in FIG. 5 and the valve casing 401b shown in FIG. 7, so that the filter 7, the shut-off valves 3 and 6, the gas flow. The process gas distribution line 13 ... Is assembled into a unit as schematically shown in FIG. 3A, which is constituted by each single-function member including the controller 2 and the shutoff valves 4 and 6. Therefore, the passage structure has a configuration shown in FIG.

On the other hand, the unit of the purge gas flow line 14 is shown in FIG. 8, and comprises a filter 7, a pressure sensor 5, a shutoff valve 3, a gas flow controller 2 and a shutoff valve 4. The gas flow controller 2 may have the same structure as shown in FIGS. 4 and 5. One cutoff valve 3, a filter 7 and a pressure sensor 5 are provided on the upstream side of such a gas flow controller 2, and these are provided in a valve casing 501a and a valve actuator 5 as shown in FIG.
02, a filter 7 and a pressure sensor 5 are additionally provided. The valve actuator 502 and the filter 7 may have the same structure as shown in FIG. Valve casing 501
In a, a passage 510 communicating with the inlet E of the purge gas distribution line 14 and the flow passage 10 of the gas flow controller 2 are provided.
511 and process gas distribution line 1
A passage 512 communicating with the gas flow controller 2 of No. 3 is formed. Then, the valve actuator 502 opens and closes the communication between the passages 510 and 511. A pressure sensor 5 is provided in the passage 510, and the pressure sensor 5 is a diaphragm pressure sensor 55 (not shown).
0 is attached to the valve casing 501a by tightening it with a nut 551. 552 is a thrust bearing that prevents the diaphragm-type pressure sensor 550 from rotating due to the rotation of the nut 551 during tightening.

Further, as shown in FIG. 10, one shutoff valve 4 provided on the downstream side of the gas flow controller 2 is constructed by attaching a valve actuator 502 similar to the above to a valve casing 501b. .. Valve casing 50
A passage 522 communicating with the flow passage 10 of the gas flow controller 2 and a passage 523 communicating with the outlet D of the purge gas distribution line 13 are formed in the 1b. The valve actuator 502 opens and closes the communication between the passages 522 and 523.

Therefore, the purge gas distribution line 14
Is directly connected to the valve casing 501a shown in FIG. 9 and the pedestal 8 shown in FIG. 4 and the valve casing 501b shown in FIG. 10, so that the filter 7, the pressure sensor 5, the shutoff valve 3 and the gas are connected. The flow controller 2 and the shut-off valve 4 are used for each single-function member.

The unit of the process gas distribution line 13 ... And the unit of the purge gas distribution line 14 configured as described above further include the first and second manifolds 17,
They are interconnected by 18. That is, in the case of the present embodiment, as illustrated in the system diagram shown in FIG. 1, the process gas distribution line 13 ... And the purge gas distribution line 14 partitioned by the alternate long and short dash line are each made into a unit, and these unit parts are individually assembled, Further, by integrally assembling these units by the first and second manifolds 17 and 18 as illustrated in FIG.
The entire structure is integral. The first manifold 17
As shown in FIG. 11, the valve casings 401a and 5a
There is a connection passage 170 for electrically connecting the passages 412, 512 formed in the wiring 01a. In addition, the second manifold 18 includes the valve casing 401b as shown in FIG.
, And a passage 181 formed in 501b and connected to passages 432, and a passage 182 formed in conduction with passages 433, 523, and so on.

In this structure, the metal C ring, the metal O ring 473, and the metal are attached to the connecting portions of the bases 8 ... Metal seals (not shown) such as gaskets are provided respectively. Although these seal members can be connected by an ordinary O-ring or the like, polymer materials are not suitable for a high-purity gas flow system because they release a large amount of gas. Furthermore, the surface roughness of the inner surface is Rmax 1.0 μm in all the flow paths including each single function part.
The following surface (mirror surface) finish is applied, and it is configured so that the dead end where gas accumulates is minimized. Further, the part that may come into contact with gas is made of a metal material including the seal part, and is appropriately surface-treated or precision cleaned. Further, the sliding contact portion where fine particles are generated is eliminated to the maximum. If necessary, the flow path may be subjected to a thermal oxidation passivation treatment with dry O ₂ , which prevents a decrease in gas purity due to the released gas at a minute flow rate.

In the device constructed as described above,
Since all single-function members are directly connected together, piping and joints between single-function members are unnecessary,
The external dimensions are greatly reduced, and it is 1/5 compared to the first conventional example.
It becomes compact as follows. In addition, since the number of seals is small and the reliability against leakage is improved, the area inside the flow path is reduced with the decrease in the flow path length, which reduces the amount of impure gas released, which in turn reduces the process gas purity. Is prevented. Moreover, since indirect connection means such as pipes and joints are unnecessary, not only the procurement cost but also dimensional matching, connection, welding, inspection,
Manufacturing costs are greatly reduced because the assembly and cleaning operations are unnecessary.

Further, each mass flow controller 2 is shown in FIG.
In the state shown in FIG. 2, if the upper portion of the pedestal 8 in the drawing is detached from the valve casings 401a and 401b and can be attached and detached upward, a plurality of mass flow controllers 2 ... Stands side by side. However, only one of the mass flow controllers 2 can be removed, which greatly improves maintainability and improves workability in disassembly and assembly.

Then, for such a case, FIG.
It is effective to configure the maintenance application type mass flow controller 2a described as the second embodiment illustrated in FIG. That is, when the mass flow controller 2 shown in FIG. 4 is removed from the unit, the flow path 10,
When the atmospheric component enters the flow rate sensor 201 and the piezo-piezoelectric element type control valve 202 via 10 and is incorporated into the unit again, oxygen and moisture of the atmospheric component invading the flow paths 10 and 10 react with the process gas. , Generate reaction products and cause corrosion. In order to prevent this, the maintenance application type mass flow controller 2a illustrated in FIG.
On-off valves 12 and 12 similar to the shut-off valves are connected to the flow paths 10 and 10 of b, respectively, and these on-off valves 12 and 12 open and close the change flow paths 11 and 11 formed in the valve blocks 12a and 12a. Is becoming The change passages 11, 11 are connected to the passages 411, 431 of the valve casings 401a, 401b.

With this configuration, when the mass flow controller 2a is removed from the unit, the opening / closing valves 12, 1
2 can be closed to close the flow paths 10 and 10,
It is possible to prevent atmospheric components from entering the flow rate sensor 201 and the piezo-piezoelectric element type control valve 202, and to prevent oxidation and corrosion.

The gas flow controller 2 of the other process gas distribution line 13 has a pedestal 8 illustrated in FIG.
The auxiliary passage blocks 81a and 81b are formed on the pedestal 8a, and the change passages 11 and 11 are formed on the auxiliary passage blocks 81a and 81b.

Further, when the process gas distribution lines 13 and the purge gas distribution lines 14 are increased or decreased, it is only necessary to increase or decrease these units, so that the gas distribution lines can be easily changed. In this case, although it is necessary to increase or decrease the passages by the manifolds 17 and 18, as shown in FIG. 17 or FIG. 18, the auxiliary manifold 1 is attached to each of the manifolds 17 and 18.
6 may be connected or disconnected, or small block type manifolds 15 may be appropriately connected and used. In FIGS. 17 and 18, reference numeral 600 is a gap adjusting shim, and 601 is a sealing metal O-ring.

In such a configuration, the reference lines 13 and 14 capable of controlling a predetermined gas are individually assembled as a unit, and these are connected to the manifold 1.
The number of reference control units can be selectively set according to the number of gases used, and the manifolds 17 and 18 corresponding thereto can be configured to be connected by increasing or decreasing or changing the number of gas. , 19 should be prepared whenever necessary. Therefore, a unit serving as a standard control unit can be produced in anticipation in advance, and various different requirements can be promptly responded to, which is advantageous in terms of cost and delivery.

In the above embodiment, the single function members are directly connected, but the present invention is not limited to this.
That is, in the present invention, each single-function member may be connected and connected via the unit block 1 as in the third embodiment shown in FIG. That is, the unit block 1 has four mass flow controllers 2 located at the top.
(See FIG. 20), four shutoff valves 3 located on one side, four shutoff valves 4 located on the other side, and one pressure sensor 5,
6 shutoff valves 6 and 4 filters 7 located at the bottom
Are directly connected to each other. The mass flow controller 2 can be individually attached to and detached from the main block 1 via a pedestal 8c provided integrally. The flow path 9 for connecting these single-function parts 2, 3, 4, 5, 6, 7 to each other is formed in the unit block 1 as shown in FIGS. As shown in FIG. 3, the flow path 10 formed on the pedestal 8 c of the mass flow controller 2
Is connected to the flow path 9 of the unit block 1.

In the device constructed as described above,
Since all the single function parts are directly connected to the unit block 1 integrally, pipes and joints between the single function parts are unnecessary, and the external dimensions (cm) are length L of 14 and width W of The height is 20 and the height H is about 27, which is about 1/5 of the first conventional example, which is compact. Also in this case, since the number of seals is small and reliability against leakage is improved, the amount of gas released is reduced due to the decrease in the flow path internal area with the decrease in the flow path length, which in turn reduces the amount of gas. The decrease in purity is prevented. Moreover, since indirect connection means such as pipes and joints are unnecessary, not only the procurement cost but also
Manufacturing costs are greatly reduced because the work of dimensional matching, connection, welding, inspection, assembly, cleaning, etc. relating to these becomes unnecessary.

When the flow path is complicated, or when there is a dimensional limitation such as interference with other portions, for example, FIG.
Two unit blocks 1a and 1b may be provided as in the fourth embodiment shown in FIG. By doing so, the number of sealing parts increases, which may lead to a decrease in reliability in terms of external leakage, but depending on the flow path configuration, weight reduction,
Useful for miniaturization.

FIG. 22 shows another embodiment of the present invention, which corresponds to the process gas control section f and the purge gas control section h which are sectioned by the one-dot chain line in the system diagram shown in FIG. The difference between the two is the relief valve 2 described later.
Since only the presence or absence of 8 is described, the latter equipped with this will be described, and the description of the former will be omitted. The purge gas control unit h is 2
It is provided with one unit block 20, 21. A filter 22 is directly connected to the front side of the first block 20, and a pressure reducing valve 23 is directly connected to the upper side thereof. Connection ends 24 and 25 are directly connected to both sides of the second block 21 connected to the back side of the first block 20, a pair of valves 26 is directly connected to the upper side, and a pressure detector 27 and a relief valve 28 are directly connected to the lower side. Has been done. The external connection end of the relief valve 28 is the second block 21.
Is provided on the back side of. Further, a metal seal such as a metal C ring, a metal O ring, and a metal gasket is provided at each connecting portion between the first block 20, the second block 21, and the filter 22. Others are substantially the same as those in the embodiment shown in FIG. Although the valve 26 is for manual operation, it can be replaced with, for example, a pneumatic operating system when necessary for an automatic purge system or the like. Further, if necessary, each of the control units f and h can include the valve 29 and the pressure detection unit 30 (see FIG. 25) on the upstream side thereof. Needless to say, it is possible to obtain substantially the same operation and effect as in the embodiment shown in FIG. 19 also in the embodiment shown in FIG.

[0035]

As described above, according to the present invention, 3
Since more than one kind of single-function member is directly connected to each other, or is connected to a block forming a flow path communicating with these single-function members, special piping for connecting these single-function members,
It is not necessary to provide an indirect connecting means such as a joint, and it is possible to provide a gas control device that is low in cost, occupies a small space, and emits a small amount of gas.

[Brief description of drawings]

FIG. 1 is a system diagram showing a gas control device in a semiconductor manufacturing apparatus according to a first embodiment of the present invention.

FIG. 2 is a perspective view of the entire gas control device of the same embodiment.

3A and 3B show a unit of a process gas distribution line in the embodiment, FIG. 3A is a perspective view and FIG. 3B is a schematic sectional view.

4A and 4B show a gas flow controller in the embodiment, FIG. 4A being a perspective view and FIG. 4B being a schematic sectional view.

FIG. 5 is a cross-sectional view of the gas flow controller in the same embodiment.

FIG. 6 is a cross-sectional view of an upstream cutoff valve of a process gas distribution line in the same embodiment.

FIG. 7 is a cross-sectional view of a downstream cutoff valve of a process gas distribution line in the example.

FIG. 8 shows a unit of a purge gas distribution line in the embodiment, (A) is a perspective view and (B) is a schematic sectional view.

FIG. 9 is a cross-sectional view of an upstream side shutoff valve of a purge gas distribution line in the example.

FIG. 10 is a cross-sectional view of a downstream cutoff valve of the purge gas distribution line according to the embodiment.

FIG. 11 shows a first manifold in the same embodiment,
(A) is a partially sectional perspective view, and (B) is a schematic sectional view.

FIG. 12 shows a second manifold in the same embodiment,
(A) is a partially sectional perspective view, and (B) is a schematic sectional view.

FIG. 13 is a system diagram showing a gas control device in a semiconductor manufacturing apparatus according to the second embodiment of the present invention.

FIG. 14 shows a configuration of the same embodiment, (A) is a perspective view of the entire gas control device, and (B) and (C) are schematic views taken along the lines BB and CC of (A). Sectional view.

FIG. 15 shows a gas flow controller of the same embodiment,
(A) is a perspective view, (B) is a schematic sectional view.

16A and 16B show a maintenance-applied gas flow controller according to the same embodiment, in which FIG. 16A is a perspective view and FIG.

FIG. 17 is a perspective view showing a modified example of the manifold of the present invention in a partial cross section.

FIG. 18 is a perspective view showing a modified example of the manifold of the present invention in a partial cross section.

FIG. 19 shows a third embodiment of the present invention, (A) is a perspective view of a gas control device in a semiconductor manufacturing apparatus, (B) and (C) are lines BB and CC of (A). FIG.

FIG. 20 shows a gas flow controller of the same embodiment,
(A) is a perspective view, (B) is a schematic sectional view.

FIG. 21 shows a fourth embodiment of the present invention, (A) is a perspective view of a gas control device in a semiconductor manufacturing apparatus, (B) and (C) are lines BB and CC of (A). FIG.

22A and 22B show a fifth embodiment of the present invention, in which FIG. 22A is a perspective view of a gas control device in a semiconductor manufacturing apparatus, and FIG.

FIG. 23 is a system diagram illustrating a typical gas control device in a semiconductor manufacturing apparatus.

FIG. 24 shows a first conventional example corresponding to the same system diagram,
(A) is a top view and (B) is a front view.

FIG. 25 is a system diagram illustrating another typical gas control device in a semiconductor manufacturing apparatus.

FIG. 26 is a front view showing a second conventional example corresponding to the system diagram.

FIG. 27 shows a conventional example of a composite body of a shutoff valve and a gas flow controller, (A) is a top view, (B) is a front view,
(C) is a system diagram.

FIG. 28 shows a conventional example of a composite of a shutoff valve and a filter, (A) is a front view, and (B) is a system diagram.

FIG. 29 shows a conventional example of a composite body of a shutoff valve and a pressure detection unit, (A) is a front view, and (B) is a system diagram.

[Explanation of symbols]

1, 1a, 1b, 20, 21 ... Unit block, 2 ...
Gas flow controller, 3, 4, 6, 26 ... Shut-off valve,
5, 27 ... Pressure detector, 7, 22 ... Filter, 9, 10
... flow path, 8 ... pedestal, 12 ... open / close valve, 17, 18 ... manifold, 23 ... pressure reducing valve, 28 ... relief valve, 401a, 4
01b, 501a, 501b ... Valve casing.

Claims (8)

[Claims] 1. A gas control device in which a plurality of single-function members are provided in a high-purity gas flow system, wherein three or more single-function members are directly connected integrally. 2. The single-function member has at least a filter, a mass flow controller, and shutoff valves provided upstream and downstream of the mass flow controller,
The gas control device according to claim 1, wherein these members are directly connected integrally to form one gas control line. 3. The gas control device according to claim 2, wherein the mass flow controller is provided with an opening / closing valve at each of the outlet and the inlet. 4. The gas control device according to claim 1, wherein the inner surface of all the passages through which the high-purity gas flows has a surface roughness of Rmax 1 μm or less. 5. A gas control device in which a plurality of single-function members are provided in a high-purity gas flow system, wherein three or more kinds of single-function members are unit blocks in which flow paths communicating with these single-function members are formed. A gas control device characterized by being integrally connected. 6. The single-function member has at least a filter, a mass flow controller, and shutoff valves provided upstream and downstream of the mass flow controller,
The gas control device according to claim 5, wherein one of the members and the flow path formed in the unit block constitutes one gas control line. 7. The gas control device according to claim 6, wherein the mass flow controller is provided with an opening / closing valve at each of the outlet and the inlet. 8. The gas control device according to claim 5, wherein the inner surfaces of all the passages through which the high-purity gas flows have a surface roughness of Rmax 1 μm or less.